Infineon Technologies IRAM256-1067A2

Overview

IRAM256-1067A2 from Infineon Technologies (formerly International Rectifier) is a 10A, 600V integrated power module combining three Trench IGBTs and a 3-phase high-voltage gate driver in a single isolated SIP-1A package. It delivers motor drive functionality for 0.25–0.75 kW AC induction motors operating at 85–253 V_AC, with open-emitter outputs, built-in temperature monitoring via NTC, and over-current protection. Used in energy-efficient air conditioner and washing machine inverters.

For engineers reviewing the IRAM256-1067A2 datasheet, IRAM256-1067A2 pinout, IRAM256-1067A2 application, or IRAM256-1067A2 equivalent, key selection criteria include its 2000 V_RMS isolation rating, 125°C maximum case temperature, matched 1.15 µs propagation delay across all six channels, 3.3 V Schmitt-triggered logic compatibility, and integrated bootstrap diodes and under-voltage lockout per channel.

Technical Context

This IPM integrates a full 3-phase inverter bridge (six Trench IGBTs + freewheeling diodes), high-side floating gate drivers with VBx supplies, and protection circuitry including ITRIP-based current limiting, thermal shutdown via VTH/NTC, and EN-controlled fault latching. All six gate drivers share matched timing (±75 ns propagation delay matching) and internal 290 ns dead-time insertion to prevent shoot-through.

The module operates with dual supply domains: VCC (13.5–16.5 V) powers low-side logic and driver circuitry, while VB1–VB3 (up to 600 V offset) supply high-side drivers referenced to VS1–VS3. Logic inputs (HIN/LIN/ITRIP/FLT/EN) are 3.3 V compatible with hysteresis, and the ITRIP threshold is fixed at 0.49 V ±0.05 V with 150 ns blanking time.

Key Specifications

Pinout & Package

IRAM256-1067A2 uses a thermally enhanced SIP-1A (Single In-line Package) with full transfer mold construction, 2000 V_RMS isolation, and CTI > 600. The package features isolated baseplate mounting (M3 screws, 0.8–1.0 N·m torque) and optimized thermal resistance (R_TH(J-C) = 3.5°C/W per IGBT).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 3-phase IGBT inverter module applications.

Compared with FSTB1067A and FSBB15CH60C, IRAM256-1067A2 offers superior integration density, tighter timing control, and embedded thermal/current protection - reducing total solution size by 25% and eliminating four external components required by alternatives.

Availability

IRAM256-1067A2 is available at Aetrix Electronics and suitable for air conditioner inverters, washing machine drives, and refrigerator compressor controls requiring stable component supply, long-lifecycle support, and industrial-grade reliability.

Supply support for IRAM256-1067A2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader specializing in power management, sensor, and automotive ICs, with core expertise in high-voltage power devices and intelligent power modules.

IRAM256-1067A2 belongs to Infineon's IRAM family of integrated power modules, designed specifically for cost-sensitive, high-volume white goods motor drives requiring compact size, robust protection, and simplified thermal design.

FAQ

What is the purpose of the VRU, VRV, and VRW pins?

VRU, VRV, and VRW are dedicated low-side emitter connection terminals for phases U, V, and W respectively. They provide isolated return paths for current sensing and thermal decoupling, enabling accurate shunt-based phase current measurement without ground loop interference. Each pin is electrically isolated from the module baseplate and VSS, supporting differential sensing topologies.

Can IRAM256-1067A2 operate with a 3.3 V microcontroller without level shifters?

Yes - all logic inputs (HIN1–3, LIN1–3, ITRIP, FLT/EN) are 3.3 V compatible with Schmitt-triggered thresholds (2.5 V typical high threshold, 0.8 V low threshold) and built-in 310 ns input filtering. No external level-shifting circuitry is required when interfacing directly with standard 3.3 V MCUs such as STM32G4 or TI C2000 series.

How does the ITRIP protection function without external components?

The ITRIP pin accepts a voltage signal derived from a single shunt resistor placed in the common DC-link return path. When this voltage exceeds the internal 0.49 V threshold (with 70 mV hysteresis), the module immediately disables all six IGBTs and asserts FLT/EN low. A 150 ns blanking time prevents false triggering during PWM transitions, and recovery requires toggling the EN pin.

What thermal interface material is recommended for mounting?

Infineon specifies use of thermal interface material with 1 W/m·K conductivity (e.g., Shin-Etsu G746 or Dow Corning TC-5002) applied uniformly to the module's flat, convex backside. Mounting torque must be 0.8–1.0 N·m on M3 screws, and heatsink flatness must be maintained between −50 µm and +100 µm to ensure R_TH(C-S) ≤ 0.1°C/W and avoid localized hot spots.