International Rectifier IRAM336-025SB

Overview

IRAM336-025SB from International Rectifier is an Integrated power module for AC motor control supplied in a 19-SSIP Formed Leads module package. It integrates multiple power-stage functions for AC motor-control equipment, reducing the number of separate inverter devices and simplifying the power-stage assembly.

For engineers reviewing the IRAM336-025SB datasheet, IRAM336-025SB pinout, IRAM336-025SB application, or IRAM336-025SB equivalent, this device is commonly used in ac motor drives, compact inverter modules, motor-control service replacement, and integrated drive power stages designs. The module is described as 600 V class inverter module. The output class is 2.5 A class module. The package format and formed-lead arrangement are key purchasing details because IRAM modules are normally matched to a fixed PCB footprint and heatsink structure.

Technical Context

In a motor-drive system, IRAM336-025SB operates between the DC-link capacitor and the motor phase outputs. The controller provides gate or logic drive signals while the module handles the power switching path, so bus-loop inductance, bootstrap supply routing, and heatsink mounting affect reliability.

Thermal design should be reviewed using the module case temperature, switching frequency, modulation method, and motor current profile. A small mechanical change can affect isolation distance, lead stress, and thermal-interface pressure.

When replacing an IRAM module, the exact suffix, lead form, rated current, voltage class, and pin arrangement must match the original board. Similar current-class modules may not be mechanically or electrically interchangeable.

Key Specifications

Pinout & Package

The IRAM336-025SB pinout must be reviewed from the exact package drawing because terminal function, thermal path, and mechanical footprint are linked in this product family. 19-SSIP Formed Leads package information and Bulk packaging for this line.

For PCB design, use the package drawing and confirm copper area, soldering method, creepage or clearance where applicable, and the final orderable suffix before layout or replacement approval. SIP / PowerSIP module package intended for vertical mounting and controlled creepage layout.

Key Features

• Integrated power module for AC motor control for compact AC motor-drive inverter assemblies.
• Integrated module construction reduces separate transistor and diode count.
• Designed for DC-link to three-phase output power conversion.
• Formed-lead module package supports defined creepage and heatsink mounting.
• Thermal interface, mounting pressure, and bus-loop inductance affect reliability.
• Useful for OEM repair or BOM continuation when exact suffix and footprint match.

Applications

Equivalent & Alternatives

When evaluating IRAM336-025SB equivalent devices, engineers should compare only specific orderable alternatives and should verify package footprint, pinout, electrical ratings, thermal data, qualification status, and suffix or packing requirements before substitution.

Compared with related alternatives, IRAM336-025SB should remain the preferred sourcing reference when the existing BOM, PCB footprint, and qualification documentation require the exact International Rectifier orderable device.

Quality

IRAM336-025SB should be sourced as original International Rectifier / Infineon inventory through traceable and controlled supply channels. Quality verification may include package inspection, top-mark validation, label and lot review, solderability inspection, moisture-sensitivity handling review, and electrical screening according to the target production requirement.

Because IRAM336-025SB is used in AC motor-drive and inverter power-stage modules, final validation should include the actual PCB footprint, thermal path, electrical stress, operating temperature, and fault-condition behavior. Traceable sourcing helps reduce counterfeit risk and supports repeatable performance in production, repair, and maintenance programs.

Availability

IRAM336-025SB available at Aetrix Electronics and suitable for AC motor-drive and inverter power-stage modules requiring stable component supply, package matching, and controlled replacement planning.

Supply support may include scheduled delivery planning, volume procurement support, BOM continuity assistance, traceable sourcing management, and long-term availability support for OEM manufacturers, repair programs, and electronics production teams.

For production or repair deployment, confirming package type, orderable suffix, lifecycle status, environmental requirement, electrical rating, thermal condition, and sourcing continuity helps reduce procurement risk and improve manufacturing stability.

Manufacturer

International Rectifier was a semiconductor manufacturer known for power MOSFETs, IGBTs, gate drivers, power-management ICs, intelligent power switches, photovoltaic relays, and power modules. International Rectifier products became part of Infineon Technologies' power semiconductor portfolio after the acquisition of International Rectifier.

The IRAM336-025SB ordering line should be reviewed with the relevant International Rectifier legacy technical documentation and Infineon supply-chain references where available. This is especially important for legacy MOSFETs, IRAM modules, PV relay products, and automotive AUIR power devices.

FAQ

What is IRAM336-025SB used for?

IRAM336-025SB is used in AC motor-drive and inverter power-stage modules. The exact application depends on the technical documentation electrical ratings, package, pinout, and thermal capability.

Where can I find the IRAM336-025SB technical documentation?

The IRAM336-025SB technical documentation should be obtained from International Rectifier / Infineon documentation or an authorized technical documentation source. It should be used to confirm ratings, package information, pinout, thermal data, and test conditions.

What should be considered in IRAM336-025SB pinout design?

Pinout design should confirm the package drawing, terminal functions, thermal path, high-current routing or isolation spacing, and whether the orderable suffix changes package or packing details.

Can IRAM336-025SB be used as a direct replacement?

IRAM336-025SB can be used as a direct replacement only when the package footprint, pinout, electrical ratings, thermal behavior, and qualification status match the original design.

What are common IRAM336-025SB equivalent solutions?

Equivalent solutions should be limited to specific orderable devices with verified technical documents. Suffix variants may differ in package, reel orientation, lead finish, qualification, or manufacturing status.