Infineon Technologies IRAM336-025SB3
- Part No.:
- IRAM336-025SB3
- Manufacturer:
- Infineon Technologies
- Category:
- Power Driver Modules
- Package:
- 19-PowerSSIP Module, Formed Leads
- Datasheet:
-
IRAM336-025SB3.pdf
- Description:
- IC HYBRID MULTI-CHIP 500V 2A
- Quantity:
- Payment:

- Shipping:

Inventory:2,888
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Product details
Overview
IRAM336-025SB from Infineon Technologies (formerly International Rectifier) is a 3-phase inverter Hybrid IC integrating six 500V MOSFETs, high-voltage gate drivers, bootstrap diodes, and an NTC thermistor in a single SIP-S package. It delivers 2A RMS phase current at 25°C, supports 360V DC bus, and enables compact motor drive for fans, pumps, and refrigerator compressors.
For engineers reviewing the IRAM336-025SB datasheet, IRAM336-025SB pinout, IRAM336-025SB application, or IRAM336-025SB equivalent, key selection criteria include integrated shoot-through prevention, matched 750ns/920ns propagation delays, VDD/VBS undervoltage lockout thresholds (8.2–9.8V), thermal feedback via TH pin, and bootstrapped high-side supply generation without external isolated rails.
Technical Context
The IRAM336-025SB implements a fully integrated 3-phase bridge with independent high- and low-side gate drivers per phase, each featuring Schmitt-triggered logic inputs, cross-conduction prevention, and lower di/dt gate drive for noise immunity. All three high-side floating supplies (VB1–VB3) are referenced to their respective VSx terminals and support up to +500V offset.
It embeds an internal 100kΩ NTC thermistor (R25 = 100kΩ ±3%, B25/50 = 4250K) for junction temperature monitoring, plus an over-current shutdown function triggered by the ITRIP pin with programmable trip threshold. The FAULT/EN pin provides both fault indication and enable control with automatic 8ms reset timing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 500 V - Maximum MOSFET blocking voltage; supports 360V DC bus with 25% margin for transients. |
| IO @ TC=25°C | 2.0 A RMS - Continuous phase current capability at case temperature 25°C; defines base thermal design point. |
| TJ max | +150°C - Maximum MOSFET and driver junction temperature; sets thermal derating boundary. |
| RDS(ON) | 2.2–2.7 Ω - On-resistance per MOSFET at VDD=15V, ID=1.0A; determines conduction loss and heatsink sizing. |
| TON / TOFF | 750 / 920 ns - Propagation delay from HIN/LIN to HO/LO output; ensures precise PWM timing and channel matching. |
| VDDUV+ | 8.9 V (typ) - Positive-going undervoltage lockout threshold for VDD; prevents erratic operation during brownout. |
| RTH @ 25°C | 100 kΩ ±3% - NTC resistance at 25°C; used with external circuitry for accurate thermal protection. |
Pinout & Package
The IRAM336-025SB uses a 19-pin Single In-line Package (SIP-S) with insulated metal baseplate for direct heatsink mounting. Pin 1 (TH) connects to an internal NTC thermistor; pins 4/6/8 (U,VS1; V,VS2; W,VS3) serve as phase outputs and floating supply references; pins 5/7/9 (VB1–VB3) provide high-side bootstrap supply inputs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 TH | NTC Thermistor Terminal | Provides analog temperature feedback; RTH = 100kΩ @ 25°C, B = 4250K. |
| 2 V− | Negative DC Bus Input | Common reference for VDD, VSS, and all low-side sources; tied to module case. |
| 3 V+ | Positive DC Bus Input | High-current input for 360V DC bus; requires local electrolytic + ceramic decoupling. |
| 4 U,VS1 | Phase U Output / HS Floating Reference | Output node for phase U; also serves as return path for VB1 bootstrap supply. |
| 5 VB1 | High-Side Bootstrap Supply Input (Phase U) | Accepts charge from internal bootstrap diode; must be decoupled with ≥0.1µF ceramic near pin. |
| 11–13 HIN1–HIN3 | High-Side Gate Driver Inputs | Schmitt-triggered 3.3V/5V-compatible logic inputs; enable shoot-through prevention when paired with LIN. |
| 14–16 LIN1–LIN3 | Low-Side Gate Driver Inputs | Logic-level inputs referenced to VSS; cross-conduction prevention logic ensures dead-time enforcement. |
| 17 FAULT/EN | Fault Indicator & Enable Control | Open-drain fault flag; active-low enable; auto-resets after 8ms unless cleared externally. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Bootstrap Diodes | Eliminates need for external high-voltage isolated supplies; reduces BOM count and layout complexity for high-side gate drive. |
| Matched Propagation Delay | 750ns turn-on / 920ns turn-off across all six channels; ensures synchronized switching and minimizes torque ripple in motor control. |
| Cross-Conduction Prevention Logic | Hardware-enforced dead-time between complementary HIN/LIN signals; prevents shoot-through without external timing circuits. |
| Thermal Monitoring via NTC | On-die 100kΩ NTC (B=4250K) connected to TH pin; enables precise junction temperature sensing for over-temperature shutdown. |
| Under-Voltage Lockout (UVLO) | Independent UVLO on VDD and all VBx supplies (8.2–9.8V threshold); guarantees safe startup and fault recovery under brownout conditions. |
Applications
| Refrigerator Compressor Drive | Fan Speed Control |
|---|---|
Use Scenario: Variable-speed compressor in domestic refrigerators operating from 85–253 Vac input with sinusoidal PWM at 20kHz. IC Role / Device Role / Timing Role: 3-phase inverter delivering 250W motor power; integrates gate drive, protection, and thermal sensing in one SIP-S module. Use Value: Reduces system component count by eliminating discrete bootstrap diodes, UVLO comparators, and external NTC biasing networks. | Use Scenario: Low-noise, energy-efficient ceiling fan with soft-start and torque compensation. IC Role / Device Role / Timing Role: Compact motor driver providing matched 750ns/920ns propagation delays for precise commutation timing. Use Value: Lower di/dt gate drive improves EMI performance; integrated shoot-through prevention enhances reliability in cost-sensitive consumer designs. |
| Pump Motor Control | Small Appliance Motor Drive |
Use Scenario: Circulating pump in HVAC or dishwasher requiring continuous 2A RMS phase current at 100°C case temperature. IC Role / Device Role / Timing Role: High-efficiency inverter with 5.8°C/W thermal resistance per FET; supports derated 1.0A RMS at TC=100°C. Use Value: Flat metal baseplate allows direct heatsink mounting; eliminates need for isolation pads while maintaining safety compliance. | Use Scenario: Vacuum cleaner or blender with rapid acceleration/deceleration and over-current protection. IC Role / Device Role / Timing Role: Fault-tolerant driver with auto-resettable FAULT/EN pin and programmable ITRIP shutdown. Use Value: 8ms automatic fault reset enables graceful recovery without microcontroller intervention; simplifies firmware design. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 3-phase inverter applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRAMX16UP60B | 600V VDSS, 1.5A RMS @ TC=25°C, no integrated NTC, different pinout (27-pin DIP). | Lacks thermal feedback; requires external temperature sensing and separate bootstrap diodes. | Choose when higher bus voltage margin is needed and thermal monitoring is handled externally. |
| FAN7382MX | Standalone 3-phase HVIC driver only; no MOSFETs, no NTC, no bootstrap diodes; 600V level-shift capability. | Requires external 6x MOSFETs, bootstrap network, and thermal sensor; greater design flexibility but higher BOM count. | Choose for custom power stage tuning or when discrete MOSFET selection is required for specific RDS(ON)/Qg trade-offs. |
Compared with IRAMX16UP60B and FAN7382MX, the IRAM336-025SB uniquely combines 500V MOSFETs, matched gate drive timing, integrated NTC, and bootstrap diodes in a space-saving SIP-S package-enabling faster time-to-market for sub-250W appliance motor drives without compromising protection or thermal visibility.
Availability
IRAM336-025SB is available at Aetrix Electronics and suitable for refrigerator compressor drives, HVAC fan control, circulating pump systems, and small appliance motor control requiring stable component supply and long-term industrial availability.
Supply support for IRAM336-025SB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader specializing in power management, automotive, and industrial control solutions, with deep expertise in high-voltage integration and motor drive systems.
The IRAM336-025SB belongs to Infineon's Integrated Power Hybrid IC product line, designed specifically for cost-sensitive, space-constrained appliance motor drives requiring full protection, thermal visibility, and simplified bill-of-materials.
FAQ
What is the maximum DC bus voltage supported by the IRAM336-025SB?
The IRAM336-025SB supports a maximum positive DC bus input voltage (V+) of 360V, with MOSFETs rated for 500V VDSS. This provides sufficient margin for transient spikes in 230Vac rectified applications. Operation above 360V violates recommended conditions and risks exceeding absolute maximum ratings for VBx and VSx terminals.
How does the ITRIP shutdown function operate?
The ITRIP pin accepts an analog voltage proportional to phase current via an external sense resistor and op-amp circuit. When this voltage exceeds the internal threshold (~1.5V typical), the device immediately disables all gate outputs and asserts the FAULT/EN pin. The fault remains latched until either the EN signal is cycled or the internal 8ms auto-reset timer expires.
Can the IRAM336-025SB be used with 3.3V logic controllers?
Yes - all HIN and LIN inputs are Schmitt-triggered and compatible with both 3.3V and 5V logic levels. The input threshold is referenced to VSS, and the device specifies valid operation for logic inputs from VSS to VSS+5V. No level-shifting circuitry is required when interfacing with standard MCU GPIOs.
Is external isolation required between the module case and heatsink?
Yes - the module case is electrically connected to the V− terminal (negative DC bus). Since V− is not earth-referenced in most appliance designs, isolation material (e.g., mica or silicone pad) must be placed between the case and heatsink to prevent electrical shock and ensure user safety compliance per IEC 60335.
IRAM336-025SB3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 19-PowerSSIP Module, Formed Leads
- Packaging:
- Tube
- Product Status:
- Obsolete
- Type:
- MOSFET
- Configuration:
- 3 Phase
- Current:
- 2 A
- Voltage:
- 500 V
- Voltage - Isolation:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
IRAM336-025SB3 FAQ
1.How can I place an order for IRAM336-025SB3 through Aetrix?
Please submit a Request for Quotation (RFQ) for IRAM336-025SB3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRAM336-025SB3 reliable?
The price and inventory of IRAM336-025SB3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRAM336-025SB3 is usually 5 days.
3.What payment methods are accepted for IRAM336-025SB3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRAM336-025SB3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRAM336-025SB3?
IRAM336-025SB3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRAM336-025SB3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRAM336-025SB3?
For technical support, including IRAM336-025SB3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRAM336-025SB3 requirements.
6.How does Aetrix verify that IRAM336-025SB3 is sourced from the original manufacturer or authorized distributors?
All IRAM336-025SB3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRAM336-025SB3 meets industry standards.
7.What is the process for return or replacement of IRAM336-025SB3?
All IRAM336-025SB3 units undergo pre-shipment inspection (PSI). If there is an issue with IRAM336-025SB3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRAM336-025SB3 part is unused and in its original packaging.
Return procedure for IRAM336-025SB3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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