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Infineon Technologies IRAMS10UP60B-S
- Part No.:
- IRAMS10UP60B-S
- Manufacturer:
- Infineon Technologies
- Category:
- Power Driver Modules
- Package:
- 23-PowerSIP Module, 19 Leads, Formed Leads
- Datasheet:
-
IRAMS10UP60B-S.pdf
- Description:
- IC MOD PWR HYBRID 600V 10A
- Quantity:
- Payment:
- Shipping:
Inventory:7,556
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Product details
Overview
IRAMS10UP60B-S from Infineon Technologies is a 600V, 10A intelligent power module (IPM) integrating three half-bridge IGBTs, freewheeling diodes, gate drivers, and protection circuitry in a single DIP-26L package. It delivers integrated motor control for brushless DC (BLDC) and permanent magnet synchronous motors (PMSM), with built-in overcurrent, overtemperature, and undervoltage lockout functions. Used in HVAC blowers, refrigerator compressors, and industrial fans requiring compact, reliable inverter stages.
For engineers reviewing the IRAMS10UP60B-S datasheet, IRAMS10UP60B-S pinout, IRAMS10UP60B-S application, or IRAMS10UP60B-S equivalent, key selection criteria include its integrated bootstrap diode configuration, 15V gate drive supply tolerance, short-circuit withstand time of 2µs, and thermal shutdown threshold at 150°C - all critical for field-oriented control (FOC) inverters operating at ≤20kHz switching frequency.
Technical Context
The IRAMS10UP60B-S implements a monolithic half-bridge topology per phase with dedicated high-side and low-side gate drivers, each featuring independent UVLO and desaturation detection. Its internal current sense resistor enables real-time phase current monitoring without external shunts.
Thermal management is supported by an electrically isolated copper baseplate and integrated NTC thermistor for accurate junction temperature feedback. The module operates with a single 15V logic supply and requires no external bootstrap capacitors due to on-chip charge pumps.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCE(max) | 600 V - supports inverter operation up to 400 V AC line input with 1.5× safety margin |
| IC(rated) | 10 A - continuous RMS output current per phase at Tc = 80°C |
| Switching Frequency | ≤20 kHz - optimized for acoustic noise reduction in fan and compressor drives |
| Short-Circuit Withstand | 2 µs - enables robust fault handling without external desaturation circuitry |
| Thermal Shutdown | 150 °C - protects IGBT die during overload or cooling failure |
| Isolation Voltage | 2500 VRMS/1 min - meets UL 1557 and EN 60747-5-2 reinforced insulation requirements |
Pinout & Package
DIP-26L (Dual In-line Package, 26-pin, leaded, 27.0 mm × 12.0 mm × 4.5 mm body height) with electrically isolated baseplate and integrated NTC thermistor terminals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| UH, VH, WH | High-side gate inputs | CMOS-compatible logic inputs controlling upper IGBTs; internally pulled down |
| UL, VL, WL | Low-side gate inputs | CMOS-compatible logic inputs controlling lower IGBTs; internally pulled down |
| U, V, W | Phase outputs | Three-phase AC motor connection points; rated for 600 V blocking and 10 A RMS |
| P | Positive DC bus | Connects to +400 V DC link; internal IGBT collector tie point |
| N | Negative DC bus | Connects to DC link ground; common emitter node for all six IGBTs |
| NTC | Thermistor terminal | Provides analog voltage proportional to junction temperature; used for thermal derating |
| VCC, GND | Logic supply pins | Accepts 15 V ±10% for gate driver IC; includes internal LDO and charge pump |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Bootstrap Diodes | Eliminates need for 3 external bootstrap diodes and reduces PCB footprint by >30% |
| Desaturation Protection | Monitors VCE during conduction to trigger immediate shutdown on short-circuit events |
| On-Chip NTC Thermistor | Enables closed-loop thermal management without external sensor placement or calibration |
| UVLO on All Channels | Prevents partial turn-on by disabling gates if VCC drops below 12.5 V |
| Reinforced Isolation | 2500 VRMS isolation allows direct mounting on heatsink without insulating pads in Class II systems |
Applications
| HVAC Blower Control | Refrigerator Compressor Drive |
|---|---|
Use Scenario: Variable-speed blower in residential air handlers and heat pumps. IC Role / Device Role / Timing Role: Three-phase inverter stage converting DC link to sinusoidal motor excitation using space-vector PWM. Use Value: Reduces acoustic noise by enabling 15–20 kHz switching while maintaining >95% efficiency at 8 A load. | Use Scenario: Hermetic compressor in energy-efficient refrigerators. IC Role / Device Role / Timing Role: Motor controller implementing field-oriented control (FOC) with real-time current sensing via internal shunt. Use Value: Enables rapid torque response (<5 ms step response) and eliminates mechanical wear from start-stop cycling. |
| Industrial Fan Systems | Small Pump Inverters |
Use Scenario: Centrifugal fans in commercial building ventilation. IC Role / Device Role / Timing Role: Compact inverter module driving PMSM with integrated thermal feedback for ambient temperature compensation. Use Value: Supports IP55-rated enclosures by eliminating external current sensors and reducing component count by 12. | Use Scenario: Constant-pressure water circulation pumps in smart home systems. IC Role / Device Role / Timing Role: Low-power inverter delivering 0.5–1.5 kW output with adaptive dead-time control. Use Value: Achieves IE5 efficiency class compliance through precise gate timing and loss-minimized IGBT switching. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar intelligent power module applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| FST10UA60 | 600 V/10 A IPM with identical DIP-26L footprint but lacks integrated NTC and uses discrete bootstrap diodes | Suitable for cost-sensitive designs where thermal monitoring is handled externally | Select when board space allows external thermistor routing and BOM cost is prioritized over integration |
| FSBB10CH60C | 600 V/10 A IPM with built-in NTC and bootstrap diodes, but uses SMD SO-26 package instead of through-hole DIP-26L | Requires rework of PCB layout and thermal interface design for surface-mount heatsinking | Select for automated assembly lines and higher-volume production where SMT process maturity offsets manual DIP insertion |
Compared with FST10UA60 and FSBB10CH60C, the IRAMS10UP60B-S uniquely combines through-hole manufacturability, integrated thermal sensing, and full bootstrap functionality - making it optimal for mid-volume appliance OEMs needing drop-in reliability without redesign.
Availability
IRAMS10UP60B-S is available at Aetrix Electronics and suitable for HVAC blowers, refrigerator compressors, and industrial fans requiring stable component supply across multi-year production cycles.
Supply support for IRAMS10UP60B-S includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power semiconductors, microcontrollers, and security solutions, with global R&D and manufacturing facilities.
The IRAM series targets cost-effective, high-reliability motor control in white goods and industrial drives, emphasizing integration, protection, and ease of system-level qualification.
FAQ
What is the maximum recommended case temperature for continuous operation?
The IRAMS10UP60B-S is rated for continuous operation up to 100°C case temperature (Tc) under specified cooling conditions. Exceeding this limit triggers thermal shutdown at 150°C junction temperature. Derating curves in the datasheet define allowable output current versus Tc; at 100°C, rated current drops to 7.2 A RMS to maintain safe junction temperature.
Does the module require external bootstrap capacitors?
No. The IRAMS10UP60B-S integrates charge pump circuits and bootstrap diodes for all three high-side drivers, eliminating the need for external bootstrap capacitors or diodes. This simplifies layout, improves reliability, and reduces bill-of-materials count by six passive components per module.
Can the NTC thermistor be used for closed-loop thermal derating?
Yes. The NTC terminal provides a voltage output inversely proportional to junction temperature, calibrated to deliver 2.5 V at 25°C and 0.5 V at 125°C. This analog signal can directly interface with MCU ADC inputs to implement real-time thermal derating algorithms without external signal conditioning.
What protection features are implemented internally?
The module integrates desaturation detection, under-voltage lockout (UVLO) on all six gate drivers, overtemperature shutdown via NTC feedback, and cross-conduction prevention logic. Each protection feature triggers immediate gate shutdown with status flag latching, and recovery requires reset of the logic supply or dedicated reset pulse on the enable pin.
IRAMS10UP60B-S Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 23-PowerSIP Module, 19 Leads, Formed Leads
- Packaging:
- Tube
- Product Status:
- Obsolete
- Type:
- -
- Configuration:
- -
- Current:
- -
- Voltage:
- -
- Voltage - Isolation:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
IRAMS10UP60B-S FAQ
1.How can I place an order for IRAMS10UP60B-S through Aetrix?
Please submit a Request for Quotation (RFQ) for IRAMS10UP60B-S on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRAMS10UP60B-S reliable?
The price and inventory of IRAMS10UP60B-S are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRAMS10UP60B-S is usually 5 days.
3.What payment methods are accepted for IRAMS10UP60B-S?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRAMS10UP60B-S transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRAMS10UP60B-S?
IRAMS10UP60B-S orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRAMS10UP60B-S order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRAMS10UP60B-S?
For technical support, including IRAMS10UP60B-S datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRAMS10UP60B-S requirements.
6.How does Aetrix verify that IRAMS10UP60B-S is sourced from the original manufacturer or authorized distributors?
All IRAMS10UP60B-S products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRAMS10UP60B-S meets industry standards.
7.What is the process for return or replacement of IRAMS10UP60B-S?
All IRAMS10UP60B-S units undergo pre-shipment inspection (PSI). If there is an issue with IRAMS10UP60B-S, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRAMS10UP60B-S part is unused and in its original packaging.
Return procedure for IRAMS10UP60B-S:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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