Infineon Technologies IRAMX16UP60B

Overview

IRAMX16UP60B from Infineon Technologies (formerly International Rectifier) is a 16A, 600V integrated power hybrid IC with internal shunt resistor, three-phase IGBT inverter bridge, and monolithic gate driver for appliance motor drives. It integrates low V_CE(on) punch-through IGBTs, bootstrap diodes, temperature monitoring via NTC thermistor, over-current protection with 21–28A trip threshold, and 2000V_RMS isolation - deployed in air conditioning compressors and light industrial AC motor drives.

For engineers reviewing the IRAMX16UP60B datasheet, IRAMX16UP60B pinout, IRAMX16UP60B application, or IRAMX16UP60B equivalent, key selection criteria include its 600V blocking voltage, 16A RMS phase current rating at T_C=25°C, matched 590/660ns propagation delays, integrated shunt-based current sensing (18.1 mΩ), and UL-pending isolation compliance for safety-critical inverter designs.

Technical Context

This hybrid IC combines three half-bridge IGBT/diode pairs with a single monolithic high-voltage gate driver IC in a fully isolated SiP2 package. The driver implements Schmitt-triggered logic inputs, cross-conduction prevention, programmable dead time (220–360ns), and under-voltage lockout on all channels (10.6–11.6V thresholds).

The inverter section uses punch-through IGBT technology with 1.55–1.85V typical V_CE(on) at 8A/25°C, short-circuit safe operating area rated for 10µs at 140A, and reverse recovery energy of 30–60µJ per diode. Thermal management is supported by an embedded NTC thermistor (R₂₅ = 100 kΩ, B = 4250 K) and low junction-to-case thermal resistance (3.5°C/W per IGBT).

Key Specifications

Pinout & Package

IRAMX16UP60B uses a Single-in-Line Package (SiP2) with full transfer mold structure, providing reinforced creepage distance (3.2mm), thermal enhancement via direct heatsink mounting, and galvanic isolation between power and logic domains.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar three-phase IGBT inverter applications.

Compared with FST16060 and FSBB15CH60C, IRAMX16UP60B reduces bill-of-materials count by integrating shunt, NTC, gate drivers, and protection logic - enabling smaller PCBs, faster time-to-market, and higher functional safety compliance without external circuitry.

Availability

IRAMX16UP60B is available at Aetrix Electronics and suitable for air conditioning compressors, refrigerator fan controllers, and industrial pump motor drives requiring stable component supply, long lifecycle support, and certified isolation performance.

Supply support for IRAMX16UP60B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader specializing in power management, automotive, and industrial control solutions, with deep expertise in high-voltage power semiconductors and intelligent power modules.

The IRAMX16UP60B belongs to Infineon's Integrated Power Hybrid IC product line, engineered specifically for cost-sensitive, space-constrained appliance motor drives needing high integration, safety certification readiness, and robust fault protection.

FAQ

What is the maximum recommended PWM carrier frequency for IRAMX16UP60B?

The datasheet specifies a maximum PWM carrier frequency of 20 kHz under recommended operating conditions. At 16 kHz, the device delivers optimal trade-off between switching losses (E_TOT = 465–615 µJ) and audible noise suppression for appliance motors. Operation above 20 kHz risks exceeding thermal limits due to increased gate drive losses and reduced heat dissipation margin.

How does the internal shunt resistor enable current sensing without external components?

The 18.1 mΩ ±5% shunt is laser-trimmed and co-packaged with the IGBTs, allowing direct measurement of phase current via the ITRIP pin. With a 440–540 mV trip threshold and 70 mV hysteresis, it eliminates external amplifiers, filters, and calibration - reducing offset error and improving response time to <1.75 µs for over-current events.

Can IRAMX16UP60B be used with 110VAC input systems?

No - the device is rated for 450V DC bus operation, targeting 230VAC rectified systems. Using it with 110VAC-derived buses (≈155V DC) violates minimum V_BS requirements (VS+12V) for high-side gate drive and risks insufficient bootstrap charging, leading to shoot-through or incomplete turn-on of high-side IGBTs.

What thermal interface material is recommended for heatsink mounting?

A thermal compound with conductivity ≥1 W/m·K is required, as specified in the mechanical characteristics table. Standard silicone-based pastes meet this requirement; phase-change pads are acceptable if their thickness maintains ≤0.1°C/W interfacial resistance. Mounting torque must be controlled to 0.5–1.0 Nm (M3 screw) to avoid package cracking or delamination.