Infineon Technologies IRF1010EL
- Part No.:
- IRF1010EL
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-262-3 Long Leads, I2PAK, TO-262AA
- Datasheet:
-
IRF1010EL.pdf
- Description:
- MOSFET N-CH 60V 84A TO262
- Quantity:
- Payment:

- Shipping:

Inventory:9,743
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Product details
Overview
IRF1010EL from International Rectifier is a 60V, 84A N-channel enhancement-mode power MOSFET in TO-262 (ISOTOP) package, featuring 12mΩ RDS(on) at VGS = 10V, fully avalanche-rated, and optimized for high-current DC-DC conversion and motor control. It operates up to 175°C junction temperature and delivers fast switching with 130nC total gate charge.
For engineers reviewing the IRF1010EL datasheet, IRF1010EL pinout, IRF1010EL application, or IRF1010EL equivalent, key selection criteria include its 60V VDS, 12mΩ on-resistance, 330A pulsed drain current, avalanche energy rating (EAS = 1180mJ), and thermal resistance (RθJC = 0.75°C/W) - all critical for high-reliability power stage design.
Technical Context
This device uses International Rectifier's Advanced HEXFET® process to achieve low RDS(on) per die area while maintaining rugged unclamped inductive switching capability. Its body diode exhibits 73ns typical reverse recovery time and 220nC Qrr at IF = 50A, enabling efficient synchronous rectification in hard-switched topologies.
The TO-262 package provides low-profile through-hole mounting with mechanical robustness and thermal performance comparable to TO-220 but with improved creepage and PCB footprint efficiency. Gate threshold voltage (2.0–4.0V) ensures compatibility with standard 5V and 10V logic-level drivers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 60V - Maximum blocking voltage in power switch applications without breakdown risk under rated conditions. |
| RDS(on) | 12mΩ @ VGS = 10V, ID = 50A - Enables <1W conduction loss at 84A continuous current, reducing heatsink requirements. |
| ID (TC = 25°C) | 84A - Continuous drain current rating at case temperature of 25°C, defining maximum steady-state power handling. |
| EAS | 1180mJ - Single-pulse avalanche energy rating supports reliable operation during inductive load turn-off transients. |
| Qg | 130nC - Total gate charge determines driver strength requirement and switching loss trade-off in PWM circuits. |
| RθJC | 0.75°C/W - Junction-to-case thermal resistance enables accurate thermal modeling when mounted on heatsink with interface material. |
| trr | 73ns (typ.) - Body diode reverse recovery time directly impacts switching losses and EMI in freewheeling paths. |
Pinout & Package
IRF1010EL uses the TO-262 (ISOTOP) package: a low-profile, through-hole variant of the D2Pak family with three leads and an isolated metal tab for direct heatsinking. The package supports high-current routing and offers enhanced thermal dissipation over standard TO-220 while maintaining compatibility with automated insertion equipment.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Drain (Tab) | Main current path output terminal | Electrically connected to metal tab - must be electrically isolated from chassis unless referenced to system ground; primary heat conduction path. |
| Source | Reference node for gate drive and current return | Low-inductance connection point for source loop; critical for minimizing switching oscillation and gate drive stability. |
| Gate | Control input for channel conduction | High-impedance MOS gate requiring controlled slew rate and adequate drive current (≥1A peak) to minimize switching time. |
Key Features
| Feature | Design Value |
|---|---|
| Fully avalanche-rated | Withstands 1180mJ single-pulse avalanche energy without failure - eliminates need for external snubbers in inductive switching. |
| Low RDS(on) | 12mΩ at 10V gate drive reduces conduction losses by >30% vs. legacy 60V MOSFETs, improving efficiency in 12V/24V systems. |
| Fast body diode | 73ns trr and 220nC Qrr enable use in synchronous rectification and bidirectional power flow without excessive diode loss. |
| 175°C max junction temperature | Enables operation in sealed enclosures or high-ambient environments (e.g., automotive engine bays, industrial drives) without derating. |
| Lead-free construction | RoHS-compliant Pb-free plating and packaging meet global environmental compliance requirements for industrial and consumer electronics. |
Applications
| Motor Drive Inverter Stage | DC-DC Converter Primary Switch |
|---|---|
Use Scenario: High-current H-bridge for 24V brushed DC motor control in industrial automation. IC Role / Device Role / Timing Role: Main power switch in low-side configuration, conducting up to 84A continuously with PWM frequencies ≤20kHz. Use Value: 12mΩ RDS(on) limits I²R loss to <85W at full load, enabling compact heatsink design and >95% efficiency at rated current. | Use Scenario: Primary-side switch in 400W isolated forward converter for telecom power supply. IC Role / Device Role / Timing Role: Hard-switched N-channel MOSFET operating at 100kHz with 50% duty cycle and 30V VDS stress. Use Value: 130nC Qg and 73ns trr reduce total switching loss to <1.2W, supporting high-frequency operation without excessive driver complexity. |
| Uninterruptible Power Supply (UPS) Output Stage | Automotive Starter Relay Replacement |
Use Scenario: Bidirectional power switch in 48V battery backup system with active inrush limiting. IC Role / Device Role / Timing Role: Low-side switch controlling battery discharge path with integrated body diode freewheeling. Use Value: Fully rated 1180mJ EAS withstands repeated inductive turn-off events during load dump, eliminating discrete TVS protection. | Use Scenario: Solid-state replacement for electromechanical starter relay in 12V diesel engine cranking circuits. IC Role / Device Role / Timing Role: High-pulse-current switch handling 330A peak during engine crank, with 175°C TJ rating for under-hood reliability. Use Value: 330A IDM and 0.75°C/W RθJC allow direct bolt-on heatsinking to chassis, achieving >100,000-cycle lifetime vs. relay contact wear-out. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP60NF06 | RDS(on) = 14mΩ, Qg = 110nC, TO-220 package | Higher RDS(on) increases conduction loss; lower Qg eases gate drive but reduces avalanche margin (EAS = 720mJ) | Preferred where gate drive is constrained and thermal margin exists; not suitable for high-reliability avalanche-prone designs. |
| IXTH84N60L2 | RDS(on) = 11.5mΩ, 600V rating, TO-247 package | Higher voltage rating adds cost and capacitance; larger package increases layout area and inductance | Only justified if system requires 600V headroom or higher dV/dt immunity; over-specified for 60V applications. |
Compared with STP60NF06 and IXTH84N60L2, IRF1010EL offers optimal balance of low on-resistance, proven avalanche ruggedness, and TO-262 thermal-mechanical fit - making it preferred for 60V, high-current, thermally constrained industrial power stages.
Availability
IRF1010EL is available at Aetrix Electronics and suitable for motor drives, DC-DC converters, and uninterruptible power supplies requiring stable component supply across long production lifecycles.
Supply support for IRF1010EL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
International Rectifier (now part of Infineon Technologies) was a pioneer in power semiconductor innovation, specializing in high-efficiency MOSFETs, IGBTs, and driver ICs for industrial and automotive markets.
The HEXFET® product line was engineered specifically for high-current, high-reliability power switching - emphasizing low RDS(on), fast switching, and rugged avalanche performance in demanding real-world loads.
FAQ
What is the maximum continuous drain current for IRF1010EL at 100°C case temperature?
The maximum continuous drain current is 59A at TC = 100°C, as specified in the Absolute Maximum Ratings table. This derating reflects thermal limitations of the TO-262 package and silicon, not gate drive capability. Operation above this current requires active cooling or reduced ambient temperature to maintain TJ ≤ 175°C.
Is IRF1010EL suitable for use with 5V microcontroller GPIOs?
No - its gate threshold voltage range is 2.0–4.0V, but full enhancement requires ≥10V VGS to achieve rated 12mΩ RDS(on). At 5V, RDS(on) rises significantly (>50mΩ), increasing conduction loss and thermal stress. A dedicated gate driver (e.g., IR2110 or TC4427) is required for reliable operation.
Does IRF1010EL have a built-in ESD protection diode on the gate?
No - the device lacks integrated gate ESD protection. External Zener clamping (e.g., 12V TVS between gate and source) is recommended in assembly and handling to prevent gate oxide damage from static discharge, especially in automated manufacturing environments.
Can IRF1010EL replace IRF1010E in existing designs?
Yes - IRF1010EL is the lead-free, TO-262 packaged version of IRF1010E (TO-220). Pinout and electrical specs are identical, but the TO-262 offers lower profile, improved creepage, and slightly better thermal resistance (RθJC = 0.75°C/W vs. 0.85°C/W). Mechanical redesign of PCB footprint and mounting is required.
IRF1010EL Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- TO-262-3 Long Leads, I2PAK, TO-262AA
- Packaging:
- Tube
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 60 V
- Current - Continuous Drain (Id) @ 25°C:
- 84A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 12mOhm @ 50A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 130 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 3210 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 200W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-262
IRF1010EL FAQ
1.How can I place an order for IRF1010EL through Aetrix?
Please submit a Request for Quotation (RFQ) for IRF1010EL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRF1010EL reliable?
The price and inventory of IRF1010EL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRF1010EL is usually 5 days.
3.What payment methods are accepted for IRF1010EL?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRF1010EL transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRF1010EL?
IRF1010EL orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRF1010EL order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRF1010EL?
For technical support, including IRF1010EL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRF1010EL requirements.
6.How does Aetrix verify that IRF1010EL is sourced from the original manufacturer or authorized distributors?
All IRF1010EL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRF1010EL meets industry standards.
7.What is the process for return or replacement of IRF1010EL?
All IRF1010EL units undergo pre-shipment inspection (PSI). If there is an issue with IRF1010EL, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRF1010EL part is unused and in its original packaging.
Return procedure for IRF1010EL:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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