Infineon Technologies IRF1010ZSTRLPBF
- Part No.:
- IRF1010ZSTRLPBF
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
IRF1010ZSTRLPBF.pdf
- Description:
- MOSFET N-CH 55V 75A D2PAK
- Quantity:
- Payment:

- Shipping:

Inventory:1,859
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Product details
Overview
IRF1010ZSTRLPBF from Infineon Technologies is an N-channel enhancement-mode HEXFET® Power MOSFET in D2PAK (TO-263) package, rated for 55V VDSS, 7.5 mΩ RDS(on) at VGS = 10 V, and 75 A continuous drain current at TC = 25°C. It features 175°C maximum junction temperature, fast switching (tr = 150 ns, tf = 92 ns), and rated repetitive avalanche energy up to 360 mJ.
For engineers reviewing the IRF1010ZSTRLPBF datasheet, IRF1010ZSTRLPBF pinout, IRF1010ZSTRLPBF application, or IRF1010ZSTRLPBF equivalent, key selection criteria include on-resistance vs. thermal derating, gate charge (Qg = 63–95 nC), body diode recovery (Qrr = 15–23 nC, trr = 22–33 ns), and SOA limits under unclamped inductive switching.
Technical Context
This MOSFET employs advanced silicon processing to minimize RDS(on) per unit area while maintaining robust avalanche capability. Its design integrates a low-inductance D2PAK package with internal source/drain inductances of LS = 7.5 nH and LD = 4.5 nH, enabling high di/dt operation in hard-switched topologies.
The device supports gate drive voltages from 2.0 V to 4.0 V threshold (VGS(th)) and delivers 33 S typical transconductance (gfs). Its Ciss/Coss/Crss values (2840 pF / 420 pF / 250 pF at VDS = 25 V) define switching loss behavior in PWM converters and motor drives.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 55 V - Maximum blocking voltage before avalanche onset; defines use in ≤48 V DC bus systems. |
| RDS(on) | 7.5 mΩ max @ VGS = 10 V, TJ = 25°C - Directly determines conduction loss in high-current paths (e.g., 75 A yields ≤42 W I²R loss). |
| ID (cont) | 75 A @ TC = 25°C - Package-limited current rating; derates to ~40 A at TC = 100°C per linear derating factor of 0.90 W/°C. |
| Qg | 63–95 nC - Total gate charge defining driver strength requirement; impacts turn-on energy and EMI in high-frequency switching. |
| tr/tf | 150 ns / 92 ns - Rise/fall times measured at VDD = 28 V, ID = 75 A, RG = 6.8 Ω; constrains minimum practical switching frequency. |
| EAS | 94 mJ (tested), 360 mJ (thermally limited) - Single-pulse avalanche energy rating enables robustness in inductive load switching without external snubbers. |
| VSD | 1.3 V max @ IS = 75 A - Forward voltage of integrated body diode; critical for synchronous rectification and freewheeling path losses. |
Pinout & Package
IRF1010ZSTRLPBF is housed in a surface-mount D2PAK (TO-263) package with three terminals: Drain (tab), Source (pins 1 & 2), and Gate (pin 3). The exposed drain pad provides low thermal resistance (RθJC = 1.11 °C/W) and must be soldered to a PCB copper pour for thermal management.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Drain (Tab) | Main high-side current path | Electrically connected to heatsink; requires isolation if heatsink is grounded; dominates thermal path to ambient. |
| Source (Pins 1 & 2) | Reference node for gate drive and current return | Parallel pins reduce bondwire inductance; critical for minimizing VGS noise during fast switching. |
| Gate (Pin 3) | Control terminal for channel modulation | High-impedance input requiring low-inductance gate loop; sensitive to ringing due to Qgd = 24 nC Miller charge. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low RDS(on) | 7.5 mΩ enables <1 W conduction loss at 40 A, reducing heatsink size in 48 V battery-powered inverters. |
| 175°C junction rating | Allows full-rated operation at elevated ambient temperatures (e.g., automotive engine compartments or enclosed industrial enclosures). |
| Repetitive avalanche capability | Rated for repeated unclamped inductive switching up to TJmax, eliminating need for external clamping in motor phase-legs. |
| Fast body diode recovery | trr = 22–33 ns and Qrr = 15–23 nC minimize reverse recovery loss and EMI in half-bridge freewheeling. |
| Lead-free construction | Meets RoHS Directive 2011/65/EU; compatible with standard Pb-free reflow profiles (peak 260°C, 10 s). |
Applications
| DC Motor Drive | Switching Power Supply |
|---|---|
Use Scenario: Full-bridge control of brushed 24–48 V DC motors in industrial actuators and EV auxiliary systems. IC Role / Device Role / Timing Role: High-side and low-side switching element; handles bidirectional current up to 75 A with <100 ns dead-time tolerance. Use Value: Low RDS(on) reduces I²R heating during stall conditions; avalanche rating withstands back-EMF spikes during abrupt stops. | Use Scenario: Primary-side switch in 500–1000 W LLC resonant and hard-switched forward converters. IC Role / Device Role / Timing Role: Main power switch operating at 100–300 kHz; driven by isolated gate driver with 12–15 V supply. Use Value: Low Qg and fast tr/tf enable high-efficiency operation; Coss = 420 pF ensures predictable ZVS transition timing. |
| Uninterruptible Power Supply | Battery Management System |
Use Scenario: Inverter stage in 1–3 kVA online UPS units converting 48 V DC battery bank to 120/230 V AC output. IC Role / Device Role / Timing Role: Half-bridge leg switch; subjected to 60 Hz fundamental + high-frequency PWM harmonics and line transients. Use Value: 175°C TJ rating sustains reliability under sustained overload; EAS = 360 mJ absorbs surge events without failure. | Use Scenario: Active cell balancing and main discharge FET in 13S–16S Li-ion battery packs for energy storage and e-mobility. IC Role / Device Role / Timing Role: High-current discharge switch and balancing path controller; operates in linear and saturated modes. Use Value: Low VSD = 1.3 V minimizes heat generation during active balancing; robust SOA supports safe linear-mode operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP75NF55 | RDS(on) = 8.5 mΩ, Qg = 105 nC, TO-220 package | Higher gate charge increases driver loss; through-hole mounting limits board density | Prefer when cost sensitivity outweighs thermal performance and layout compactness. |
| IXTH75N10L2 | RDS(on) = 9.0 mΩ, 100 V VDSS, TO-247 package | Higher voltage rating adds margin but increases capacitance (Ciss = 3800 pF), slowing switching | Choose when system overvoltage risk exceeds 55 V or higher creepage is required. |
Compared with STP75NF55 and IXTH75N10L2, IRF1010ZSTRLPBF offers the lowest RDS(on) and best thermal resistance in surface-mount form, making it optimal for space-constrained, high-current 48 V systems where efficiency and thermal headroom are prioritized.
Availability
IRF1010ZSTRLPBF is available at Aetrix Electronics and suitable for DC motor drives, uninterruptible power supplies, and battery management systems requiring stable component supply and long-term production continuity.
Supply support for IRF1010ZSTRLPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power electronics, automotive microcontrollers, and security ICs, with global manufacturing and R&D centers.
This device belongs to Infineon's HEXFET® Power MOSFET product line, engineered for high-efficiency, high-reliability switching in industrial motor control, renewable energy inverters, and server power supplies.
FAQ
What is the maximum allowable case temperature for continuous operation?
The IRF1010ZSTRLPBF supports continuous operation up to TC = 100°C, beyond which its continuous drain current derates linearly at 0.90 W/°C. At TC = 100°C, the rated ID drops to approximately 40 A (per Fig. 9), and thermal design must ensure RθJA ≤ 40 °C/W for PCB-mounted configurations to avoid exceeding 175°C junction temperature.
Is the body diode suitable for synchronous rectification?
Yes-the integrated body diode has VSD = 1.3 V max at 75 A and trr = 22–33 ns, making it usable in non-critical synchronous rectification roles. However, for high-efficiency designs, an external Schottky or GaN FET is preferred due to lower forward drop and zero reverse recovery charge.
Does IRF1010ZSTRLPBF require gate resistors for stability?
Yes-a series gate resistor (typically 5–22 Ω) is recommended to dampen ringing caused by gate-drain Miller feedback (Qgd = 24 nC) and parasitic PCB inductance. Values below 5 Ω risk oscillation; above 22 Ω excessively slows switching and increases switching loss.
Can this MOSFET replace IRF1010N in existing designs?
No-IRF1010ZSTRLPBF is not a direct replacement for IRF1010N. While both are 55 V N-channel MOSFETs, the IRF1010N has RDS(on) = 10.5 mΩ and uses TO-220 packaging. The Z-series offers lower on-resistance and D2PAK packaging, requiring PCB layout revision and thermal validation due to different RθJC and mounting requirements.
IRF1010ZSTRLPBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Last Time Buy
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 55 V
- Current - Continuous Drain (Id) @ 25°C:
- 75A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 7.5mOhm @ 75A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 95 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2840 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 140W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- D2PAK
IRF1010ZSTRLPBF FAQ
1.How can I place an order for IRF1010ZSTRLPBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRF1010ZSTRLPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRF1010ZSTRLPBF reliable?
The price and inventory of IRF1010ZSTRLPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRF1010ZSTRLPBF is usually 5 days.
3.What payment methods are accepted for IRF1010ZSTRLPBF?
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4.How is shipping managed for IRF1010ZSTRLPBF?
IRF1010ZSTRLPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRF1010ZSTRLPBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRF1010ZSTRLPBF?
For technical support, including IRF1010ZSTRLPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRF1010ZSTRLPBF requirements.
6.How does Aetrix verify that IRF1010ZSTRLPBF is sourced from the original manufacturer or authorized distributors?
All IRF1010ZSTRLPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRF1010ZSTRLPBF meets industry standards.
7.What is the process for return or replacement of IRF1010ZSTRLPBF?
All IRF1010ZSTRLPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRF1010ZSTRLPBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRF1010ZSTRLPBF part is unused and in its original packaging.
Return procedure for IRF1010ZSTRLPBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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