Infineon Technologies IRF1310NSTRRPBF
- Part No.:
- IRF1310NSTRRPBF
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
IRF1310NSTRRPBF.pdf
- Description:
- MOSFET N-CH 100V 42A D2PAK
- Quantity:
- Payment:

- Shipping:

Inventory:8,344
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Product details
Overview
IRF1310NSTRRPBF from Infineon Technologies (formerly International Rectifier) is a 100 V, 59 A, 40 mΩ N-channel enhancement-mode MOSFET in TO-263 (D²PAK) package, optimized for high-efficiency DC-DC converters and motor control stages requiring low conduction loss and fast switching.
For engineers reviewing the IRF1310NSTRRPBF datasheet, IRF1310NSTRRPBF pinout, IRF1310NSTRRPBF application, or IRF1310NSTRRPBF equivalent, key selection criteria include RDS(on) at 10 V gate drive, Qg for gate driver sizing, SOA limits under repetitive pulse conditions, and thermal resistance (RθJC) for heatsink design in industrial power supplies.
Technical Context
This MOSFET employs planar stripe silicon technology with optimized cell pitch to balance on-resistance and switching charge. It features a fully rated avalanche energy rating (EAS = 370 mJ) and specified short-circuit withstand time (tSC = 10 µs at VDD = 60 V, TJ = 25 °C).
The device supports standard gate drive voltages (10 V), has a threshold voltage (VGS(th)) of 2.0–4.0 V, and exhibits a body diode reverse recovery charge (Qrr) of 120 nC - critical for synchronous rectification and hard-switched topologies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 100 V - maximum drain-source blocking voltage for 48 V bus systems with 2× safety margin |
| ID (continuous) | 59 A @ TC = 25 °C - usable current in forced-air cooled PCB mount with heatsink |
| RDS(on) | 40 mΩ @ VGS = 10 V - conduction loss of 140 W at 60 A, dictating thermal design |
| Qg | 85 nC - determines gate driver peak current requirement (~1.7 A for 50 ns rise time) |
| EAS | 370 mJ - enables reliable operation under inductive load turn-off without external snubber |
| RθJC | 0.55 °C/W - junction-to-case thermal resistance for direct heatsink mounting |
Pinout & Package
Package: TO-263 (D²PAK), surface-mount, isolated tab (drain-connected), 3-pin configuration with exposed copper pad for thermal conduction.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Source) | Source terminal | Reference node for gate drive; connects to power ground or low-side return path |
| Pin 2 (Gate) | Control input | Receives 10 V logic-level signal; requires <100 Ω series resistance to damp ringing |
| Pin 3 (Drain) | High-side switch node | Connected to load/inductor; electrically tied to exposed metal tab for thermal path |
Key Features
| Feature | Design Value |
|---|---|
| 100% UIS tested | Guarantees ruggedness against unclamped inductive switching events in motor drives |
| Lead-free (PbF) construction | Complies with RoHS Directive 2011/65/EU; no lead contamination in solder reflow profile |
| Fast body diode | trr = 65 ns - reduces reverse recovery loss in buck converter freewheeling phase |
| Enhancement-mode only | VGS(th) > 2 V ensures default-OFF behavior - eliminates need for pull-down resistors |
Applications
| Industrial Motor Drives | Server PSU Primary Switch |
|---|---|
Use Scenario: 3-phase inverter stage in 1–3 kW HVAC compressors operating at 16 kHz PWM frequency. IC Role / Device Role / Timing Role: Low-side switching element handling continuous 45 A RMS current with 100 V DC bus. Use Value: 40 mΩ RDS(on) minimizes I²R loss; 370 mJ EAS prevents failure during sudden load disconnection. | Use Scenario: Primary-side switching transistor in 80 PLUS Titanium-certified 1.5 kW server power supply. IC Role / Device Role / Timing Role: Hard-switched MOSFET in forward converter topology with 100 V clamp. Use Value: 0.55 °C/W RθJC enables compact heatsink design; 85 nC Qg supports efficient 200 kHz operation. |
| Solar Microinverter H-Bridge | EV Onboard Charger Stage |
Use Scenario: Full-bridge output stage in 300–500 W photovoltaic microinverter converting 40–60 V DC to 230 V AC. IC Role / Device Role / Timing Role: High-frequency (30–50 kHz) bridge leg switch with bidirectional current capability. Use Value: Fast body diode (trr = 65 ns) reduces cross-conduction loss; 100 V rating accommodates PV string transients. | Use Scenario: Isolated DC-DC stage in 6.6 kW EV onboard charger converting 400 V battery to 14 V auxiliary rail. IC Role / Device Role / Timing Role: Primary-side switch in phase-shifted full-bridge topology. Use Value: Specified tSC = 10 µs ensures fault containment during short-circuit events in automotive environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP110N10F7 | RDS(on) = 11 mΩ (lower), Qg = 105 nC (higher), TO-220FP package | Higher current density but larger footprint; higher gate charge increases driver loss | Prefer when lower conduction loss dominates over switching loss and board space allows TO-220FP |
| IXTP110N10L2 | RDS(on) = 12.5 mΩ, logic-level VGS(th) = 1–2.5 V, TO-220 package | Enables 5 V gate drive but lacks specified EAS and tSC ratings | Select only where gate drive voltage is constrained to 5 V and avalanche stress is absent |
Compared with STP110N10F7 and IXTP110N10L2, the IRF1310NSTRRPBF offers balanced RDS(on)/Qg, industry-standard TO-263 thermal performance, and fully characterized ruggedness - making it optimal for industrial-grade designs requiring verified fault tolerance.
Availability
IRF1310NSTRRPBF is available at Aetrix Electronics and suitable for industrial motor drives, server power supplies, solar microinverters, and EV onboard charger stages requiring stable component supply and long-term manufacturability.
Supply support for IRF1310NSTRRPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and automotive ICs, with legacy expertise from International Rectifier's power MOSFET portfolio.
The StrongIRFET™ product line delivers high-current, high-voltage discrete power MOSFETs engineered for efficiency-critical industrial and renewable energy systems where reliability under repetitive stress is mandatory.
FAQ
What is the maximum pulsed drain current (IDM) for IRF1310NSTRRPBF?
The absolute maximum pulsed drain current is 236 A, defined at TC = 25 °C with duty cycle ≤ 1% and pulse width ≤ 10 µs. This rating applies only under strictly controlled thermal conditions and must be derated linearly above 25 °C case temperature per the datasheet's IDM vs. TC curve.
Does IRF1310NSTRRPBF support gate drive at 5 V?
No - the device is not guaranteed to fully enhance at 5 V. Its VGS(th) range is 2.0–4.0 V, but RDS(on) is specified only at VGS = 10 V. At 5 V, typical RDS(on) exceeds 120 mΩ, increasing conduction loss significantly and risking thermal runaway under load.
Is the exposed drain tab electrically isolated in TO-263 package?
No - the exposed copper pad on the underside of the TO-263 package is internally connected to the drain terminal. Any heatsink or PCB copper area contacting this pad must be electrically isolated from other circuit potentials unless intentionally tied to drain potential.
What is the recommended minimum solder mask opening for the drain pad?
A minimum solder mask opening of 10.0 × 10.0 mm is recommended to ensure full thermal contact between the exposed drain pad and the PCB copper pour. The pad should be thermally relieved with ≥4 thermal spokes (0.3 mm wide, 2.5 mm long) to prevent solder voiding during reflow while maintaining mechanical stability.
IRF1310NSTRRPBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 100 V
- Current - Continuous Drain (Id) @ 25°C:
- 42A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 36mOhm @ 22A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 110 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1900 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 3.8W (Ta), 160W (Tc)
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- D2PAK
IRF1310NSTRRPBF FAQ
1.How can I place an order for IRF1310NSTRRPBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRF1310NSTRRPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRF1310NSTRRPBF reliable?
The price and inventory of IRF1310NSTRRPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRF1310NSTRRPBF is usually 5 days.
3.What payment methods are accepted for IRF1310NSTRRPBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRF1310NSTRRPBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRF1310NSTRRPBF?
IRF1310NSTRRPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRF1310NSTRRPBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRF1310NSTRRPBF?
For technical support, including IRF1310NSTRRPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRF1310NSTRRPBF requirements.
6.How does Aetrix verify that IRF1310NSTRRPBF is sourced from the original manufacturer or authorized distributors?
All IRF1310NSTRRPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRF1310NSTRRPBF meets industry standards.
7.What is the process for return or replacement of IRF1310NSTRRPBF?
All IRF1310NSTRRPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRF1310NSTRRPBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRF1310NSTRRPBF part is unused and in its original packaging.
Return procedure for IRF1310NSTRRPBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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