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Infineon Technologies IRF1607

Part No.:
IRF1607
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
TO-220-3
Datasheet:
AetrixIRF1607.pdf
Description:
MOSFET N-CH 75V 142A TO220AB
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,399

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Product details

Overview

IRF1607 from Infineon Technologies (formerly International Rectifier) is a 75V, 142A N-channel enhancement-mode HEXFET® Power MOSFET in TO-220AB package, featuring RDS(on) = 5.8 mΩ @ VGS = 10 V, 175°C maximum junction temperature, and 1250 mJ single-pulse avalanche energy - deployed as a main switch in high-current DC-DC converters and motor phase-legs.

For engineers reviewing the IRF1607 datasheet, IRF1607 pinout, IRF1607 application, or IRF1607 equivalent, key selection criteria include its ultra-low on-resistance at high current, validated repetitive avalanche capability up to Tjmax, fast switching (tr = 130 ns), and thermal robustness under sustained conduction in industrial motor drive inverters.

Technical Context

This planar stripe HEXFET uses advanced silicon processing to minimize RDS(on) per die area while maintaining ruggedness. Its gate charge profile (Qg = 210–320 nC) supports efficient hard-switching at 38 V bus voltage with 1.8 Ω gate resistance, and its body diode exhibits trr = 130–200 ns and Qrr = 690–1040 nC under 100 A/µs di/dt.

The device operates with VGS(th) = 2.0–4.0 V and gfs = 79 S, enabling reliable turn-on with standard 10 V gate drivers. Its dynamic dv/dt rating of 5.2 V/ns and Coss = 1230 pF @ 25 V ensure stable commutation in high-speed half-bridge configurations without spurious turn-on.

Key Specifications

ParameterValue and Actual Design Meaning
VDSS75 V - Maximum blocking voltage before avalanche onset; defines usable DC bus range in 48 V systems.
RDS(on)5.8 mΩ (typ), 7.5 mΩ (max) @ VGS = 10 V, ID = 85 A - Directly determines conduction loss (Pcond ≈ I² × R) at rated load.
ID @ TC = 25°C142 A - Continuous drain current limited by thermal resistance (RθJC = 0.40 °C/W) and case mounting.
EAS1250 mJ - Single-pulse avalanche energy rating; enables unclamped inductive switching survival in motor drive fault conditions.
tr / tf130 ns / 86 ns - Rise/fall times measured at VDD = 38 V, ID = 85 A, RG = 1.8 Ω; sets minimum practical switching frequency.
Qg210–320 nC - Total gate charge determines driver power requirement and switching transition time.
TJ max+175°C - Enables operation in sealed enclosures or high ambient environments without derating.

Pinout & Package

TO-220AB package with isolated tab (drain-connected), standard 3-lead through-hole mounting. Thermal pad requires mechanical clamping and thermal interface material for optimal heat transfer to heatsink.

Pin/TerminalCircuit RoleDesign Meaning
Drain (Tab)Main current path output terminalElectrically connected to metal tab; must be insulated from heatsink unless system ground reference permits direct connection.
SourceReturn path for drain current; reference for gate driveLow-inductance source return critical for minimizing shoot-through risk in bridge topologies.
GateControl electrode for channel formationHigh-impedance input requiring low-impedance driver (≤1.8 Ω) to achieve specified tr/tf.

Key Features

FeatureDesign Value
Ultra-low RDS(on)5.8 mΩ typ @ 10 V - Reduces conduction losses by >30% vs. legacy 75 V MOSFETs at 85 A.
175°C junction ratingEnables full current delivery in ambient temperatures up to 85°C with proper heatsinking - no derating required below TC = 100°C.
Repetitive avalanche capabilityValidated per Fig. 15–16 up to 10% duty cycle - allows safe operation during short-circuit events without external protection.
Fast body diode recoverytrr = 130 ns, Qrr = 690 nC - Minimizes reverse recovery loss and EMI in synchronous rectification and freewheeling paths.

Applications

Industrial Motor DriveDC-DC Converter (48 V Input)

Use Scenario: Three-phase inverter stage for 5–10 kW brushless AC motors in CNC machinery and pumps.

IC Role / Device Role / Timing Role: High-side/low-side switching element in 6-pack configuration; conducts 142 A peak phase current at 10 kHz PWM.

Use Value: Low RDS(on) reduces I²R loss by 1.8 W per device vs. 8 mΩ alternatives, improving thermal margin at full load.

Use Scenario: Primary-side synchronous rectifier in isolated 48 V → 12 V bi-directional buck-boost converter for telecom power shelves.

IC Role / Device Role / Timing Role: Main power switch handling 100 A continuous current with 38 V VDS during switching transitions.

Use Value: 1250 mJ EAS withstands 200 µs inductive spikes during transient overloads without failure.

Uninterruptible Power Supply (UPS)Electric Vehicle On-Board Charger (OBC)

Use Scenario: Inverter output stage delivering clean 230 VAC from 400 VDC bus in line-interactive UPS systems.

IC Role / Device Role / Timing Role: Half-bridge leg switch operating at 20 kHz with 175°C thermal headroom during overload conditions.

Use Value: 5.2 V/ns dv/dt rating prevents false turn-on during high dV/dt transients across transformer leakage inductance.

Use Scenario: Active clamp flyback primary switch in 3.3 kW OBC front-end converting AC to 400 VDC.

IC Role / Device Role / Timing Role: High-frequency (100 kHz) switching element managing 85 A pulsed drain current with minimal gate drive loss.

Use Value: Qg = 210 nC enables use of cost-effective 2 A gate drivers instead of 4 A alternatives, reducing BOM count.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STP140N75F7RDS(on) = 5.0 mΩ (lower), Qg = 190 nC (lower), but TJmax = 175°C same; no published EAS specLacks documented avalanche rating - unsuitable where unclamped inductive switching is routinePrefer when gate drive power is constrained and avalanche stress is absent.
IXTH120N075L2RDS(on) = 6.2 mΩ (higher), Qg = 260 nC (higher), but EAS = 1400 mJ (higher); TO-247 packageHigher thermal mass and RθJC = 0.35 °C/W - better for sustained 100 A loads but larger footprintPrefer for higher-reliability 24/7 operation where board space allows TO-247.

Compared with STP140N75F7 and IXTH120N075L2, the IRF1607 delivers the best balance of low RDS(on), proven avalanche robustness, and TO-220AB form factor - making it optimal for space-constrained industrial inverters requiring fault tolerance without package redesign.

Availability

IRF1607 is available at Aetrix Electronics and suitable for industrial motor drives, DC-DC converters, and uninterruptible power supplies requiring stable component supply and long-term production continuity.

Supply support for IRF1607 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs and discrete devices.

The HEXFET® Power MOSFET product line targets high-efficiency, high-reliability power conversion in motor control, renewable energy, and server power applications - emphasizing ruggedness, low conduction loss, and thermal resilience.

FAQ

Is IRF1607 lead-free and RoHS compliant?

Yes, the IRF1607PbF variant is lead-free and fully RoHS compliant per EU Directive 2011/65/EU. The "PbF" suffix indicates lead-free plating and packaging; all soldering parameters (300°C for 10 seconds) are validated for Pb-free reflow and hand-soldering processes.

What is the recommended gate resistor value for hard-switching at 20 kHz?

A 1.8 Ω gate resistor is specified in the datasheet for tr/tf measurements at 85 A. For 20 kHz hard-switching with 142 A peak current, use 1.5–2.2 Ω to balance switching loss, EMI, and gate driver thermal load - verified via Figure 10a/b test circuit waveforms.

Can IRF1607 replace IRF1404 in an existing design?

Yes, with caveats: IRF1607 offers lower RDS(on) (5.8 mΩ vs. 4.9 mΩ) and higher ID (142 A vs. 130 A), but requires verification of gate drive strength (Qg = 210 nC vs. 193 nC) and avalanche handling (EAS = 1250 mJ vs. 950 mJ). Layout parasitics must also be reviewed due to faster switching.

Does IRF1607 require a negative gate turn-off voltage?

No. The device specifies ±20 V absolute maximum VGS, but standard 0 V to +10 V or +12 V gate drive is sufficient. Negative turn-off is not required - its VGS(th) (2.0–4.0 V) ensures full enhancement at +10 V and stable cutoff at 0 V, even with Miller-induced coupling.

IRF1607 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HEXFET®
Package/Case:
TO-220-3
Packaging:
Tube
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
75 V
Current - Continuous Drain (Id) @ 25°C:
142A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
7.5mOhm @ 85A, 10V
Vgs(th) (Max) @ Id:
4V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
320 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
7750 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
380W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
TO-220AB

IRF1607 FAQ

1.How can I place an order for IRF1607 through Aetrix?

Please submit a Request for Quotation (RFQ) for IRF1607 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IRF1607 reliable?

The price and inventory of IRF1607 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRF1607 is usually 5 days.

3.What payment methods are accepted for IRF1607?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRF1607 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IRF1607?

IRF1607 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IRF1607 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IRF1607?

For technical support, including IRF1607 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRF1607 requirements.

6.How does Aetrix verify that IRF1607 is sourced from the original manufacturer or authorized distributors?

All IRF1607 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRF1607 meets industry standards.

7.What is the process for return or replacement of IRF1607?

All IRF1607 units undergo pre-shipment inspection (PSI). If there is an issue with IRF1607, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IRF1607 part is unused and in its original packaging.

Return procedure for IRF1607:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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