Infineon Technologies IRF2204LPBF
- Part No.:
- IRF2204LPBF
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-262-3 Long Leads, I2PAK, TO-262AA
- Datasheet:
-
IRF2204LPBF.pdf
- Description:
- MOSFET N-CH 40V 170A TO262
- Quantity:
- Payment:

- Shipping:

Inventory:8,718
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Product details
Overview
IRF2204LPBF from Infineon Technologies is a 40V, 170A N-channel D2Pak (TO-262) HEXFET® Power MOSFET with 3.6mΩ RDS(on) at VGS = 10V, 175°C maximum junction temperature, and 460mJ single-pulse avalanche energy-designed for high-current industrial motor drive inverters and DC-DC power stages.
For engineers reviewing the IRF2204LPBF datasheet, IRF2204LPBF pinout, IRF2204LPBF application, or IRF2204LPBF equivalent, key selection criteria include continuous drain current derating above 25°C, gate charge (130–200nC), body diode reverse recovery (68–100ns), thermal resistance (RθJC = 0.75°C/W), and avalanche ruggedness under unclamped inductive switching.
Technical Context
This MOSFET employs advanced planar silicon processing to achieve ultra-low on-resistance per die area while maintaining robust safe operating area (SOA) up to 100µs at 175°C. Its dynamic dv/dt rating and fast switching (tr = 140ns, tf = 110ns) support high-frequency hard-switched topologies.
The integrated body diode features low forward voltage (VSD ≤ 1.3V at 130A) and controlled reverse recovery (Qrr = 120–180nC), enabling reliable freewheeling in synchronous rectification and H-bridge configurations without external Schottky supplementation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 40V - Maximum blocking voltage before avalanche onset; defines usable bus voltage range in 24–36V systems. |
| RDS(on) | 3.6mΩ max @ VGS = 10V, ID = 130A - Directly determines conduction loss (Pcond ≈ I² × R) in high-current paths. |
| ID @ TC = 25°C | 170A - Continuous current capability with heatsink at case temperature of 25°C; sets minimum heatsink sizing baseline. |
| EAS | 460mJ - Single-pulse avalanche energy rating; enables robustness against inductive turn-off transients without snubbers. |
| Qg | 130–200nC - Total gate charge defining driver strength requirement and switching loss trade-off. |
| RθJC | 0.75°C/W - Junction-to-case thermal resistance; critical for calculating ΔTJ rise under steady-state power dissipation. |
| tr/tf | 140ns/110ns - Rise/fall times at VDD = 20V, ID = 130A, RG = 2.5Ω; constrains minimum practical switching frequency. |
Pinout & Package
IRF2204LPBF uses the D2Pak (TO-262) surface-mount package with isolated tab, optimized for high-current PCB mounting and thermal transfer via soldered tab to copper pour or heatsink.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Drain (Tab) | Main current path collector | Electrically connected to exposed copper tab; must be electrically isolated from chassis unless referenced to system ground. |
| Source | Current return path & reference node | Low-inductance connection point for source sensing, gate driver return, and current measurement shunt placement. |
| Gate | Control terminal for channel modulation | High-impedance input requiring <200nC total charge; sensitive to ESD and requires gate resistor for ringing suppression. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low RDS(on) | 3.6mΩ max enables <1W conduction loss at 130A, reducing heatsink mass and improving power density in motor drives. |
| 175°C rated junction temperature | Allows operation in sealed enclosures or high-ambient environments without derating, extending reliability under thermal stress. |
| Repetitive avalanche capability | Rated for repeated unclamped inductive switching up to TJmax, eliminating need for external clamping circuits in H-bridge braking. |
| Fast body diode recovery | trr = 68–100ns with Qrr = 120–180nC minimizes commutation loss and EMI during synchronous rectification transitions. |
| Lead-free and RoHS-compliant | Meets IPC-J-STD-020D reflow profile requirements with peak solder temperature up to 300°C for 10 seconds. |
Applications
| Industrial Motor Inverter | High-Current DC-DC Converter |
|---|---|
Use Scenario: Three-phase 24–36V BLDC motor inverter stage handling peak currents >150A per phase. IC Role / Device Role / Timing Role: High-side and low-side switching element in 6-step commutation; operates at 8–20kHz PWM frequency. Use Value: Low RDS(on) reduces I²R losses by >30% vs. legacy 5mΩ MOSFETs, lowering thermal design burden and enabling smaller heatsinks. | Use Scenario: 48V-to-12V bidirectional buck-boost converter in automotive auxiliary power supply. IC Role / Device Role / Timing Role: Primary switch in synchronous rectified topology; handles continuous 120A output with 95% efficiency target. Use Value: Fast switching and low Qg reduce gate drive loss and enable higher frequency operation, shrinking magnetics volume by ~25%. |
| Uninterruptible Power Supply (UPS) | Industrial Battery Management System |
Use Scenario: Output inverter stage in 3kVA online UPS delivering clean 230VAC from 48VDC battery bank. IC Role / Device Role / Timing Role: Half-bridge leg switch subjected to repetitive short-circuit and overload conditions. Use Value: 460mJ EAS and SOA-rated pulse current (850A) ensure survival during grid fault events without sacrificial fusing. | Use Scenario: Cell-balancing and main contactor switching in 48V lithium-ion battery pack for material handling equipment. IC Role / Device Role / Timing Role: Solid-state relay replacement for high-cycle, high-current load switching (≥100k operations). Use Value: 175°C TJ rating and low thermal resistance allow direct PCB mounting without mechanical relays, improving long-term contact reliability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STL220N4F7AG | RDS(on) = 3.7mΩ, Qg = 145nC, same D2Pak package, lower EAS (320mJ) | Suitable for lower-stress DC-DC but marginal for repetitive avalanche in motor braking | Prefer when gate drive capability is limited and avalanche stress is infrequent |
| IXTH170N04S2 | RDS(on) = 3.2mΩ, Qg = 220nC, TO-247 package, higher thermal mass | Better conduction loss but slower switching and larger footprint; requires mechanical mounting | Select for highest efficiency in low-frequency (<10kHz), high-reliability industrial systems where board space is not constrained |
Compared with STL220N4F7AG and IXTH170N04S2, IRF2204LPBF delivers optimal balance of low RDS(on), moderate Qg, proven avalanche ruggedness, and compact D2Pak thermal interface-making it preferred for space-constrained, high-dynamic-duty motor control designs.
Availability
IRF2204LPBF is available at Aetrix Electronics and suitable for industrial motor drives, high-current DC-DC converters, and uninterruptible power supplies requiring stable component supply across multi-year production cycles.
Supply support for IRF2204LPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs and discrete devices.
The IRF HEXFET® product line was engineered specifically for high-efficiency, high-reliability power conversion in industrial motor drives, UPS systems, and renewable energy inverters-emphasizing ruggedness, thermal performance, and manufacturability.
FAQ
What is the maximum allowable gate-to-source voltage for IRF2204LPBF?
The absolute maximum VGS is ±20V. Operation beyond this risks permanent gate oxide damage. For reliable switching, gate drive should be clamped between 0V and +12V to +15V, with negative turn-off bias recommended only if required for noise immunity in high-dv/dt environments.
Can IRF2204LPBF be used in parallel configurations?
Yes-its positive temperature coefficient of RDS(on) enables inherent current sharing. Parallel operation requires matched gate drive impedance, symmetrical PCB layout, and thermal coupling via shared heatsink to prevent thermal runaway. Derate total current by 15% for two devices and 25% for three or more.
Is the drain tab electrically isolated in the D2Pak package?
No-the drain is internally connected to the exposed copper tab. Electrical isolation from the PCB or heatsink must be achieved using insulating thermal pads or ceramic washers. Failure to isolate may cause short circuits in grounded-chassis systems.
What is the typical reverse recovery time of the body diode?
The body diode's reverse recovery time (trr) is 68–100ns at TJ = 25°C, IF = 130A, and di/dt = 100A/µs. This value increases with junction temperature and decreases with higher di/dt; design margins should assume 100ns for EMI and loss estimation.
IRF2204LPBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- TO-262-3 Long Leads, I2PAK, TO-262AA
- Packaging:
- Tube
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 40 V
- Current - Continuous Drain (Id) @ 25°C:
- 170A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 3.6mOhm @ 130A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 200 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 5890 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 200W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-262
IRF2204LPBF FAQ
1.How can I place an order for IRF2204LPBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRF2204LPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRF2204LPBF reliable?
The price and inventory of IRF2204LPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRF2204LPBF is usually 5 days.
3.What payment methods are accepted for IRF2204LPBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRF2204LPBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRF2204LPBF?
IRF2204LPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRF2204LPBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRF2204LPBF?
For technical support, including IRF2204LPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRF2204LPBF requirements.
6.How does Aetrix verify that IRF2204LPBF is sourced from the original manufacturer or authorized distributors?
All IRF2204LPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRF2204LPBF meets industry standards.
7.What is the process for return or replacement of IRF2204LPBF?
All IRF2204LPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRF2204LPBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRF2204LPBF part is unused and in its original packaging.
Return procedure for IRF2204LPBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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