Infineon Technologies IRF2807ZSPBF
- Part No.:
- IRF2807ZSPBF
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
IRF2807ZSPBF.pdf
- Description:
- MOSFET N-CH 75V 75A D2PAK
- Quantity:
- Payment:

- Shipping:

Inventory:5,020
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Product details
Overview
IRF2807ZSPBF from Infineon Technologies (formerly International Rectifier) is a 75V, 75A N-channel D2Pak (TO-263) HEXFET® Power MOSFET with 9.4mΩ RDS(on) at VGS = 10V, 175°C maximum junction temperature, and rated for repetitive avalanche energy up to 300mJ. It serves as a high-current, low-loss main switch in DC-DC converters, motor drives, and UPS systems.
For engineers reviewing the IRF2807ZSPBF datasheet, IRF2807ZSPBF pinout, IRF2807ZSPBF application, or IRF2807ZSPBF equivalent, key selection criteria include its 75A continuous drain current at TC = 25°C, 0.90°C/W junction-to-case thermal resistance, fast switching (td(on) = 18ns, tf = 45ns), body diode reverse recovery charge (Qrr = 80–120nC), and D2Pak package compatibility with high-power PCB layouts.
Technical Context
This MOSFET employs advanced silicon processing to minimize conduction loss while maintaining robust unclamped inductive switching capability. Its 175°C operating temperature and 300mJ single-pulse avalanche rating enable reliable operation under transient overloads without external snubbers.
The device features a low 7.5–9.4mΩ RDS(on), 71–110nC total gate charge, and optimized capacitance profile (Ciss = 3270pF, Coss = 420pF, Crss = 240pF), supporting high-frequency hard-switching topologies up to several hundred kHz in synchronous rectification and half-bridge configurations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 75V - Maximum blocking voltage before avalanche; supports 48V bus systems with 50% safety margin. |
| RDS(on) | 7.5–9.4mΩ - Confirmed on-resistance range at VGS = 10V and TJ = 25°C; determines I²R conduction loss in high-current paths. |
| ID (continuous) | 75A @ TC = 25°C - Silicon-limited current handling; requires heatsinking for sustained operation above 63A at 100°C case temp. |
| EAS | 300mJ - Single-pulse avalanche energy rating; enables safe operation during inductive turn-off transients without clamping circuits. |
| Qg | 71–110nC - Total gate charge affecting driver power and switching speed; impacts gate drive loss and dV/dt control. |
| RθJC | 0.90°C/W - Junction-to-case thermal resistance; defines minimum heatsink requirement for 75A operation at 175°C max junction temp. |
| Qrr | 80–120nC - Body diode reverse recovery charge; directly influences commutation loss and EMI in synchronous buck or bridge legs. |
Pinout & Package
D2Pak (TO-263) surface-mount package with exposed drain pad for thermal and electrical connection. Three terminals: Drain (D), Source (S), Gate (G).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Drain (D) | Main high-side current path output | Connected to PCB copper pour for thermal dissipation and high-current routing; electrically tied to exposed metal tab. |
| Source (S) | Reference node for gate drive and current sensing | Low-inductance return path; used for Kelvin source connection in precision current monitoring designs. |
| Gate (G) | Control input for channel conduction | High-impedance MOS control terminal requiring <20V absolute max rating; sensitive to ESD and ringing. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low RDS(on) | 9.4mΩ max at 10V drive enables <5W conduction loss at 75A, reducing heatsink size in 48V industrial power supplies. |
| 175°C junction rating | Allows full-rated current delivery in high-ambient environments (e.g., enclosed motor drives) without derating below 100°C ambient. |
| Repetitive avalanche capability | Rated for repeated unclamped inductive switching (IAS = 53A, L = 0.12mH) without degradation-critical for relay replacement and solenoid drivers. |
| Fast switching with low Qgd/Qg | 28–42nC Miller charge relative to 71–110nC total gate charge improves immunity to dv/dt-induced turn-on in half-bridge configurations. |
Applications
| DC-DC Converter Primary Switch | Brushless DC Motor Inverter Leg |
|---|---|
Use Scenario: High-efficiency 48V-to-12V synchronous buck converter in telecom power shelves. IC Role / Device Role / Timing Role: Main high-side switching element controlling energy transfer into output inductor; switched at 200kHz. Use Value: 9.4mΩ RDS(on) reduces conduction loss by >30% vs. comparable 12mΩ devices, improving full-load efficiency from 92% to 94.5%. | Use Scenario: Upper-leg switch in 3-phase BLDC inverter driving 5kW HVAC compressor. IC Role / Device Role / Timing Role: High-current, high-dv/dt switching node in 6-step commutation; subjected to body-diode reverse recovery stress. Use Value: 80–120nC Qrr and soft-recovery characteristics minimize shoot-through risk and reduce EMI during phase transitions. |
| Uninterruptible Power Supply Output Stage | Industrial Solenoid/Relay Driver |
Use Scenario: Bidirectional 75A output stage in online UPS converting battery DC to 230VAC via H-bridge inverter. IC Role / Device Role / Timing Role: Low-side switch in full-bridge topology handling continuous 75A RMS current with 200A peak surge. Use Value: 0.90°C/W RθJC allows direct mounting to cold plate, sustaining 75A at 175°C junction temp without forced air cooling. | Use Scenario: Solid-state replacement for 30A mechanical contactor controlling hydraulic valve bank in factory automation. IC Role / Device Role / Timing Role: Unclamped inductive turn-off switch absorbing stored energy from 200mH solenoid coil. Use Value: 300mJ EAS rating permits >10⁶ cycles of 53A/0.12mH inductive switching without snubber or external protection. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP75NF75 | 75V, 75A, RDS(on) = 10.5mΩ, TO-220 package, no avalanche rating specified | Lacks documented repetitive avalanche capability; higher RDS(on) increases conduction loss by ~17% | Preferred where cost sensitivity outweighs avalanche robustness and thermal performance is less constrained. |
| IXTP75N075 | 75V, 75A, RDS(on) = 9.0mΩ, TO-220 package, 200mJ EAS | Lower RDS(on) but reduced avalanche energy (200mJ vs. 300mJ); TO-220 limits thermal performance vs. D2Pak | Better for lower-power designs needing marginal RDS(on) improvement but unable to use surface-mount layout. |
Compared with STP75NF75 and IXTP75N075, the IRF2807ZSPBF delivers superior thermal management via D2Pak packaging, highest avalanche ruggedness (300mJ), and lowest verified RDS(on) among D2Pak 75V/75A MOSFETs-making it optimal for high-reliability, thermally constrained, or inductive-switching-critical applications.
Availability
IRF2807ZSPBF is available at Aetrix Electronics and suitable for DC-DC converters, motor inverters, uninterruptible power supplies, and industrial solenoid drivers requiring stable component supply across multi-year production programs.
Supply support for IRF2807ZSPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader specializing in power management, automotive, and industrial control solutions, with deep expertise in silicon and wide-bandgap power devices.
The IRF2807ZSPBF belongs to Infineon's legacy HEXFET® Power MOSFET product line, engineered for high-current, high-ruggedness switching in industrial power conversion, motor control, and energy infrastructure applications.
FAQ
What is the maximum continuous drain current at 100°C case temperature?
The IRF2807ZSPBF supports 63A continuous drain current at TC = 100°C, as specified in Figure 9 of the datasheet. This value reflects package thermal limitation-not silicon limit-and assumes proper PCB copper area and thermal interface to maintain case temperature.
Does this MOSFET require a gate resistor for stability in hard-switching applications?
Yes. A gate resistor (typically 6.2–25Ω) is required to dampen ringing and control dv/dt during switching, especially in half-bridge configurations. The datasheet specifies td(on), tr, td(off), and tf test conditions using RG = 6.2Ω, confirming its necessity for predictable timing and EMI control.
Can the body diode be used for synchronous rectification in a buck converter?
No-the internal body diode is not optimized for synchronous rectification. Its Qrr (80–120nC) and forward voltage (1.3V) result in high commutation loss and poor efficiency compared to discrete Schottky or GaN-based synchronous FETs. External low-VF diodes or dedicated sync-FETs are recommended.
Is the IRF2807ZSPBF RoHS-compliant and lead-free?
Yes. The "Z" suffix and "PbF" designation confirm compliance with RoHS Directive 2011/65/EU. The device uses lead-free terminations and meets JEDEC J-STD-020 moisture sensitivity level (MSL) 3 requirements when handled per AN-994 guidelines.
IRF2807ZSPBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tube
- Product Status:
- Discontinued at Digi-Key
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 75 V
- Current - Continuous Drain (Id) @ 25°C:
- 75A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 9.4mOhm @ 53A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 110 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 3270 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 170W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- D2PAK
IRF2807ZSPBF FAQ
1.How can I place an order for IRF2807ZSPBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRF2807ZSPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRF2807ZSPBF reliable?
The price and inventory of IRF2807ZSPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRF2807ZSPBF is usually 5 days.
3.What payment methods are accepted for IRF2807ZSPBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRF2807ZSPBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRF2807ZSPBF?
IRF2807ZSPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRF2807ZSPBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRF2807ZSPBF?
For technical support, including IRF2807ZSPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRF2807ZSPBF requirements.
6.How does Aetrix verify that IRF2807ZSPBF is sourced from the original manufacturer or authorized distributors?
All IRF2807ZSPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRF2807ZSPBF meets industry standards.
7.What is the process for return or replacement of IRF2807ZSPBF?
All IRF2807ZSPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRF2807ZSPBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRF2807ZSPBF part is unused and in its original packaging.
Return procedure for IRF2807ZSPBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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