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Infineon Technologies IRF3710SPBF
- Part No.:
- IRF3710SPBF
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
IRF3710SPBF.pdf
- Description:
- MOSFET N-CH 100V 57A D2PAK
- Quantity:
- Payment:
- Shipping:
Inventory:2,397
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Product details
Overview
IRF3710SPBF from Infineon Technologies (formerly International Rectifier) is a 100V, 57A N-channel D2Pak surface-mount power MOSFET with 23 mΩ RDS(on) at VGS = 10 V, fully avalanche-rated, and optimized for high-current DC-DC converters, motor drives, and UPS systems requiring robust switching and thermal performance.
For engineers reviewing the IRF3710SPBF datasheet, IRF3710SPBF pinout, IRF3710SPBF application, or IRF3710SPBF equivalent, key selection criteria include its 100 V VBR(DSS), 23 mΩ on-resistance at 28 A, 130 nC total gate charge, 175 °C max junction temperature, and D2Pak thermal resistance of 0.75 °C/W junction-to-case.
Technical Context
This HEXFET® device uses advanced silicon processing to achieve ultra-low on-resistance per die area while maintaining fast switching (td(on) = 12 ns, tf = 47 ns) and rugged avalanche capability (EAS = 1060 mJ). Its internal source/drain inductance (LS/LD) is minimized for high di/dt operation up to 380 A/µs.
The D2Pak package enables high-power surface-mount operation with 200 W power dissipation at TC = 25 °C and linear derating of 1.3 W/°C above that point. The body diode exhibits VSD = 1.2 V at IS = 28 A and trr = 140–220 ns under specified recovery conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VBR(DSS) | 100 V - Withstands 100 V drain-source blocking voltage before avalanche onset, enabling use in 48 V bus and 100 V industrial input stages. |
| RDS(on) | 23 mΩ @ VGS = 10 V, ID = 28 A - Delivers low conduction loss (< 1.8 W at 57 A continuous) and high efficiency in high-current switching paths. |
| ID (TC = 25 °C) | 57 A - Supports sustained high-current loads in motor H-bridges and battery-powered inverters without forced cooling. |
| Qg | 130 nC - Requires moderate gate drive strength; compatible with standard 1–2 A peak gate drivers for < 100 kHz PWM operation. |
| EAS | 1060 mJ - Withstands single-pulse inductive energy events without failure, critical for relay/snubberless flyback and solenoid driving. |
| RθJC | 0.75 °C/W - Enables direct heatsinking to PCB copper or external heatsink; supports >150 W steady-state dissipation with proper thermal interface. |
| tr/tf | 58 ns / 47 ns - Fast edge rates reduce switching losses in hard-switched topologies operating up to 200 kHz. |
Pinout & Package
The IRF3710SPBF is housed in a D2Pak (TO-263) surface-mount package with exposed drain pad for thermal and electrical connection. It features three terminals: Gate (G), Drain (D), and Source (S), with Drain electrically connected to the large bottom-side thermal pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G | Gate control terminal | Receives 0–10 V logic-level signal to modulate channel conductivity; requires 130 nC charge for full turn-on. |
| D | Drain current path & thermal interface | High-current output node; electrically and thermally tied to exposed copper pad-must be soldered to ≥1 in² copper pour. |
| S | Source reference & return path | Common return for load current and gate drive reference; internal source inductance (LS) impacts di/dt-induced ringing. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low RDS(on) | 23 mΩ enables < 1.3 W conduction loss at 57 A, reducing heatsink size and system footprint in high-current SMPS. |
| Full avalanche rating | 1060 mJ EAS allows safe operation during inductive turn-off transients without external snubbers in motor control. |
| D2Pak thermal performance | 0.75 °C/W RθJC supports 150+ W power handling with direct PCB heatsinking-no through-hole mounting required. |
| High dv/dt immunity | Rated for 5.8 V/ns peak diode recovery dv/dt, minimizing false turn-on risk in high-speed half-bridge configurations. |
| Lead-free and RoHS-compliant | Meets IPC-J-STD-020 moisture sensitivity level 1 (MSL-1); suitable for lead-free reflow without preconditioning. |
Applications
| Motor Drive Inverter | DC-DC Boost Converter |
|---|---|
Use Scenario: High-current 3-phase BLDC inverter stage in industrial pumps and HVAC fans. IC Role / Device Role / Timing Role: Low-side switching element in 60–100 kHz PWM-controlled H-bridge leg, conducting up to 57 A continuous. Use Value: 23 mΩ RDS(on) reduces conduction loss by >35% vs. comparable 40 mΩ MOSFETs, lowering thermal stress on gate driver ICs and PCB copper. | Use Scenario: Primary switch in 48 V–400 V isolated boost converter for solar microinverters. IC Role / Device Role / Timing Role: Main power switch handling 20–30 A peak currents with 100 V blocking capability and fast 47 ns fall time. Use Value: 100 V VBR(DSS) and 1060 mJ EAS eliminate need for clamping circuits during line surges or transformer leakage spikes. |
| Uninterruptible Power Supply (UPS) | Battery Protection Circuit |
Use Scenario: Bidirectional DC bus switch in online double-conversion UPS with Li-ion backup. IC Role / Device Role / Timing Role: Synchronous rectifier and reverse-current blocking device in 12–48 V battery interface, rated for 57 A continuous discharge. Use Value: Body diode VSD = 1.2 V at 28 A ensures low-loss freewheeling during battery charging cycles without external Schottky. | Use Scenario: Overcurrent and short-circuit protection switch in 24 V/48 V telecom battery management systems. IC Role / Device Role / Timing Role: Load disconnect FET triggered by protection IC, with fast 12 ns turn-on delay to limit fault energy. Use Value: Fully avalanche-rated design withstands 28 A inductive fault currents without latch-up, eliminating fuse dependency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP110N10F7 | 100 V, 110 A, 9.5 mΩ RDS(on), TO-220FP package, lower RθJA but no exposed drain pad | Requires through-hole mounting and external heatsink; unsuitable for space-constrained SMT designs | Select when higher current headroom and lower on-resistance are prioritized over surface-mount integration. |
| IXTP110N10T | 100 V, 110 A, 10.5 mΩ, TO-220 package, 175 °C rating, but 180 nC Qg | Higher gate charge increases driver loss and limits max switching frequency to ~80 kHz | Choose for legacy through-hole layouts where thermal mass outweighs switching speed requirements. |
Compared with STP110N10F7 and IXTP110N10T, the IRF3710SPBF offers optimal balance of SMT integration, 23 mΩ on-resistance, and 130 nC gate charge-making it preferred for compact, high-efficiency 50–150 kHz power stages where PCB thermal management is feasible.
Availability
IRF3710SPBF is available at Aetrix Electronics and suitable for motor drive inverters, DC-DC boost converters, and uninterruptible power supplies requiring stable component supply, long-lifecycle support, and traceable sourcing.
Supply support for IRF3710SPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader specializing in power management, automotive, and industrial control solutions, with deep expertise in silicon-based power devices.
The HEXFET® product line was developed by International Rectifier (acquired by Infineon in 2015) to deliver ultra-low on-resistance, fast-switching, and avalanche-rugged power MOSFETs for high-reliability industrial and renewable energy systems.
FAQ
Is IRF3710SPBF suitable for 48 V automotive applications?
No-while rated for 100 V VBR(DSS), the IRF3710SPBF lacks AEC-Q101 qualification, has no guaranteed operation below -40 °C, and is not screened for automotive vibration or humidity testing. It is intended for industrial, telecom, and consumer power systems only.
What is the maximum recommended PCB copper area for thermal relief?
Per Application Note AN-994, a minimum 1 in² (645 mm²) FR-4 copper pour connected to the D2Pak drain pad via ≥6 thermal vias (0.3 mm diameter, filled) is required to achieve the rated 0.75 °C/W RθJC and sustain 57 A continuous current at TC = 25 °C.
Does IRF3710SPBF have integrated gate protection?
No-it lacks built-in gate Zener clamping or series resistance. External gate protection (e.g., 15 V Zener + 10 Ω series resistor) is required to prevent damage from VGS transients exceeding ±20 V absolute maximum rating, especially in high-noise motor drive environments.
Can IRF3710SPBF replace IRF3710L in existing designs?
Yes-both share identical electrical specs and die, but IRF3710SPBF uses D2Pak (surface-mount) while IRF3710L uses TO-262 (through-hole). Replacement requires PCB redesign for SMT pads and thermal land pattern; mechanical height clearance improves, but manual rework compatibility decreases.
IRF3710SPBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tube
- Product Status:
- Discontinued at Digi-Key
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 100 V
- Current - Continuous Drain (Id) @ 25°C:
- 57A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 23mOhm @ 28A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 130 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 3130 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 200W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- D2PAK
IRF3710SPBF FAQ
1.How can I place an order for IRF3710SPBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRF3710SPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRF3710SPBF reliable?
The price and inventory of IRF3710SPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRF3710SPBF is usually 5 days.
3.What payment methods are accepted for IRF3710SPBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRF3710SPBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRF3710SPBF?
IRF3710SPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRF3710SPBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRF3710SPBF?
For technical support, including IRF3710SPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRF3710SPBF requirements.
6.How does Aetrix verify that IRF3710SPBF is sourced from the original manufacturer or authorized distributors?
All IRF3710SPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRF3710SPBF meets industry standards.
7.What is the process for return or replacement of IRF3710SPBF?
All IRF3710SPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRF3710SPBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRF3710SPBF part is unused and in its original packaging.
Return procedure for IRF3710SPBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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