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Infineon Technologies IRF3710ZGPBF

Part No.:
IRF3710ZGPBF
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
TO-220-3
Datasheet:
AetrixIRF3710ZGPBF.pdf
Description:
MOSFET N-CH 100V 59A TO220AB
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:9,815

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Product details

Overview

IRF3710ZGPBF from Infineon Technologies (formerly International Rectifier) is an N-channel enhancement-mode HEXFET® Power MOSFET in TO-220AB package, rated for 100V VDSS, 18 mΩ RDS(on) at VGS = 10 V, and 59 A continuous drain current at TC = 25°C. It serves as a high-efficiency main switch in DC-DC converters, motor drives, and power supplies where low conduction loss and robust avalanche capability are critical.

For engineers reviewing the IRF3710ZGPBF datasheet, IRF3710ZGPBF pinout, IRF3710ZGPBF application, or IRF3710ZGPBF equivalent, key selection factors include its 175°C maximum junction temperature, 120 nC total gate charge, 280 pF effective output capacitance, repetitive avalanche rating up to Tjmax, and TO-220AB thermal resistance of 0.92°C/W (junction-to-case).

Technical Context

This device employs advanced silicon processing to minimize RDS(on) per die area while maintaining ruggedness against voltage transients. Its dynamic dv/dt rating and 300 mJ single-pulse avalanche energy (tested) support reliable operation in inductive switching circuits with fast di/dt (≤380 A/µs) and unclamped inductive loads.

The MOSFET integrates a low-VSD (1.3 V) body diode with 50–75 ns reverse recovery time and 100–160 nC Qrr, enabling synchronous rectification and freewheeling in half-bridge topologies. Gate drive requirements are defined by 82–120 nC Qg, 19–28 nC Qgs, and 27–40 nC Qgd at VDS = 50 V.

Key Specifications

Parameter Value and Actual Design Meaning
VDSS 100 V - Maximum blocking voltage before avalanche onset; defines upper limit for bus voltage in buck converters and motor phase drivers.
RDS(on) 14–18 mΩ @ VGS = 10 V - Directly determines I²R conduction loss; enables ≤1.0 W dissipation at 59 A in thermally optimized layouts.
ID (continuous) 59 A @ TC = 25°C - Specifies maximum steady-state current under ideal heatsinking; derates to 42 A at TC = 100°C.
EAS 300 mJ (tested) - Quantifies single-pulse avalanche energy handling; supports safe operation during inductive turn-off without external snubbers.
Qg 82–120 nC - Governs gate driver power and switching speed; requires ≥1 A peak drive capability for <100 ns turn-on in hard-switched applications.
RθJC 0.92 °C/W - Enables direct thermal path to heatsink; allows ~100 W power dissipation before reaching 175°C junction limit with 80°C case rise.
VGS(th) 2.0–4.0 V - Threshold voltage range ensures reliable turn-on with standard 5 V or 10 V logic-level gate drivers.
Coss(eff) 280 pF - Effective output capacitance governing turn-off loss and resonant behavior in ZVS/ZCS topologies.

Pinout & Package

IRF3710ZGPBF is housed in a through-hole TO-220AB package with isolated tab (drain-connected), standardized for mechanical mounting and thermal interface to heatsinks. The package features three leads: Source (S), Drain (D), and Gate (G), arranged left-to-right when viewed from the front (label side) with tab facing down.

Pin/Terminal Circuit Role Design Meaning
Drain (Tab) Main high-side current path and thermal interface Electrically connected to metal tab; must be electrically isolated from heatsink unless circuit topology permits common-drain configuration.
Source (Lead 1) Reference node for gate drive and current return path Serves as ground reference for gate control; internal source inductance (7.5 nH) impacts high-di/dt switching noise and body diode commutation.
Gate (Lead 2) Control terminal for channel modulation High-impedance input requiring low-inductance gate loop; Miller charge (Qgd) dominates turn-off timing and dV/dt-induced false triggering risk.

Key Features

Feature Design Value
Ultra-low on-resistance 14–18 mΩ RDS(on) at 10 V gate drive reduces conduction losses by >30% vs. legacy 100 V MOSFETs in 48 V telecom power stages.
175°C operating junction temperature Enables sustained operation in sealed enclosures or high-ambient environments (e.g., industrial motor controllers) without derating penalties.
Repetitive avalanche rated Validated for repeated unclamped inductive switching up to Tjmax, eliminating need for external avalanche clamps in UPS and battery protection circuits.
Fast switching with low Qgd/Qg ratio Qgd = 27–40 nC / Qg = 82–120 nC yields ~33% Miller fraction - improves controllability and reduces shoot-through risk in bridge configurations.
Lead-free and halogen-free construction Complies with RoHS Directive 2011/65/EU and JEDEC J-STD-020 moisture sensitivity level (MSL) 1 - suitable for lead-free reflow assembly without preconditioning.

Applications

DC-DC Buck Converter Brushed DC Motor Drive

Use Scenario: Primary high-side switch in 48 V input, 12 V output synchronous buck converter delivering up to 40 A.

IC Role / Device Role / Timing Role: Main power switch controlling duty cycle and energy transfer; operates at 200–500 kHz with hard switching.

Use Value: 18 mΩ RDS(on) limits conduction loss to <1.2 W at full load, while 120 nC Qg enables efficient gate drive with integrated controller ICs like MP2451.

Use Scenario: H-bridge upper-arm switch driving 24 V, 20 A brushed DC motor in automated gate operator.

IC Role / Device Role / Timing Role: High-side switching element subjected to inductive kickback during PWM commutation and direction reversal.

Use Value: 300 mJ EAS and 175°C Tjmax prevent failure during stall conditions and rapid direction changes without external flyback diodes.

Uninterruptible Power Supply (UPS) Industrial AC-DC Front-End

Use Scenario: Battery discharge switch in line-interactive UPS supporting 1 kVA output with 20 ms transfer time.

IC Role / Device Role / Timing Role: Bidirectional current-handling switch managing battery-to-inverter power flow during mains failure.

Use Value: Body diode forward voltage (VSD = 1.3 V) and Qrr = 100–160 nC ensure low-loss freewheeling during inverter dead-time, minimizing THD in output waveform.

Use Scenario: PFC boost switch in 3 kW industrial AC-DC power supply with universal input (90–264 VAC).

IC Role / Device Role / Timing Role: Fast-switching power transistor in continuous conduction mode (CCM) boost stage operating at 65–100 kHz.

Use Value: Coss(eff) = 280 pF and low Qgd reduce turn-off loss and improve efficiency above 96%, while TO-220AB package supports forced-air cooling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
STP110N10F7 100 V, 110 A, 9.5 mΩ RDS(on), D2PAK package, lower Qg (72 nC) Higher current rating but larger footprint; requires PCB space for surface-mount heatsinking Preferred for new designs needing higher current headroom and SMT assembly; not drop-in compatible due to package and pinout mismatch.
IXTH50N10L2 100 V, 50 A, 22 mΩ RDS(on), TO-247 package, higher RθJC (0.55°C/W) Lower thermal resistance enables higher power density but demands larger heatsink mounting area Selected when thermal performance outweighs cost and board space constraints; gate charge (105 nC) closely matches IRF3710ZGPBF for driver reuse.

Compared with STP110N10F7 and IXTH50N10L2, IRF3710ZGPBF offers optimal balance of cost, through-hole manufacturability, and proven reliability in legacy industrial power designs-especially where TO-220AB mechanical retention and serviceability are prioritized over ultimate RDS(on) or current density.

Availability

IRF3710ZGPBF is available at Aetrix Electronics and suitable for DC-DC converters, motor drives, and uninterruptible power supplies requiring stable component supply, long-term lifecycle support, and traceable sourcing from authorized channels.

Supply support for IRF3710ZGPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with global manufacturing and quality certification to ISO 9001 and IATF 16949.

This device belongs to Infineon's legacy HEXFET® Power MOSFET product line, originally developed by International Rectifier and optimized for high-reliability, medium-power switching applications in industrial, telecom, and consumer power systems.

FAQ

Is IRF3710ZGPBF suitable for logic-level gate drive?

No-IRF3710ZGPBF is not a logic-level MOSFET. Its VGS(th) ranges from 2.0 V to 4.0 V, but full enhancement requires VGS ≥ 10 V to achieve rated RDS(on) of 18 mΩ. Driving it with 3.3 V or 5 V microcontroller outputs results in significantly higher on-resistance (>100 mΩ) and excessive heating. A dedicated gate driver (e.g., TC4427) or level-shifting circuit is required for reliable operation.

What is the maximum allowable case temperature for continuous operation?

The maximum continuous case temperature is 100°C, beyond which the continuous drain current rating drops from 59 A to 42 A. At TC = 100°C, power dissipation must remain below 110 W to avoid exceeding the 175°C junction limit, assuming RθJC = 0.92°C/W. Derating curves in Figure 9 of the datasheet confirm linear reduction to zero current at TC = 175°C.

Can IRF3710ZGPBF replace IRF3710PbF?

Yes-IRF3710ZGPBF is the lead-free, halogen-free successor to IRF3710PbF, sharing identical electrical specifications, pinout, and TO-220AB package dimensions. The "Z" suffix denotes compliance with RoHS Directive 2011/65/EU and JEDEC J-STD-020 MSL-1 rating. No layout or thermal redesign is needed for drop-in replacement in existing assemblies.

Does the body diode support synchronous rectification?

No-the integrated body diode is not optimized for synchronous rectification. Its VSD = 1.3 V and Qrr = 100–160 nC result in higher conduction and switching losses compared to discrete Schottky or MOSFET-based synchronous rectifiers. It functions reliably for freewheeling and protection, but efficiency-critical synchronous designs require external low-VF diodes or dedicated SR controllers.

IRF3710ZGPBF Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HEXFET®
Package/Case:
TO-220-3
Packaging:
Tube
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
100 V
Current - Continuous Drain (Id) @ 25°C:
59A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
18mOhm @ 35A, 10V
Vgs(th) (Max) @ Id:
4V @ 250mA
Gate Charge (Qg) (Max) @ Vgs:
120 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
2900 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
160W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
TO-220AB

IRF3710ZGPBF FAQ

1.How can I place an order for IRF3710ZGPBF through Aetrix?

Please submit a Request for Quotation (RFQ) for IRF3710ZGPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IRF3710ZGPBF reliable?

The price and inventory of IRF3710ZGPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRF3710ZGPBF is usually 5 days.

3.What payment methods are accepted for IRF3710ZGPBF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRF3710ZGPBF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IRF3710ZGPBF?

IRF3710ZGPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IRF3710ZGPBF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IRF3710ZGPBF?

For technical support, including IRF3710ZGPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRF3710ZGPBF requirements.

6.How does Aetrix verify that IRF3710ZGPBF is sourced from the original manufacturer or authorized distributors?

All IRF3710ZGPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRF3710ZGPBF meets industry standards.

7.What is the process for return or replacement of IRF3710ZGPBF?

All IRF3710ZGPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRF3710ZGPBF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IRF3710ZGPBF part is unused and in its original packaging.

Return procedure for IRF3710ZGPBF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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