Infineon Technologies IRF3710ZLPBF
- Part No.:
- IRF3710ZLPBF
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-262-3 Long Leads, I2PAK, TO-262AA
- Datasheet:
-
IRF3710ZLPBF.pdf
- Description:
- MOSFET N-CH 100V 59A TO262
- Quantity:
- Payment:

- Shipping:

Inventory:9,056
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IRF3710ZLPBF from Infineon Technologies (formerly International Rectifier) is a 100V, 59A N-channel enhancement-mode Power MOSFET in TO-262 (I²PAK) package, featuring 14–18 mΩ RDS(on) at VGS = 10 V, 175°C maximum junction temperature, and rated for repetitive avalanche operation. It serves as a high-current, low-loss switching element in DC-DC converters, motor drives, and uninterruptible power supplies.
For engineers reviewing the IRF3710ZLPBF datasheet, IRF3710ZLPBF pinout, IRF3710ZLPBF application, or IRF3710ZLPBF equivalent, key selection criteria include its 100V VDS, 59A continuous drain rating at TC = 25°C, 82–120 nC total gate charge, fast 77 ns rise time, and robust 170 mJ single-pulse avalanche energy - all critical for hard-switched industrial power stages.
Technical Context
This MOSFET employs advanced planar HEXFET® process technology to minimize conduction losses while maintaining ruggedness under transient overloads. Its design supports unclamped inductive switching with validated repetitive avalanche capability up to IAS = 35 A and EAR = 200 mJ at TJ = 25°C.
The device integrates an intrinsic body diode with 1.3 V forward voltage (VSD) at 35 A and 50–75 ns reverse recovery time (trr), enabling synchronous rectification and freewheeling in buck and half-bridge topologies without external diodes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 100 V - Withstands up to 100 V drain-source blocking voltage, suitable for 48 V bus and 100 V industrial input systems. |
| RDS(on) | 14–18 mΩ @ VGS = 10 V - Enables <1.1 W conduction loss at 35 A, reducing heatsink requirements in high-current switch nodes. |
| ID (continuous) | 59 A @ TC = 25°C - Delivers high output current in TO-262 package with 0.92 °C/W junction-to-case thermal resistance. |
| Qg | 82–120 nC - Determines gate drive power and switching speed; compatible with standard 1–2 A peak gate drivers. |
| EAS | 170 mJ - Specifies single-pulse avalanche energy limit; allows safe operation during inductive turn-off transients without snubbers. |
| tr/tf | 77 ns / 56 ns - Fast edge rates support >100 kHz switching in SMPS designs while limiting switching loss. |
| TJ(max) | 175°C - Supports operation in high-ambient environments such as enclosed motor controllers or sealed UPS enclosures. |
Pinout & Package
IRF3710ZLPBF is housed in a TO-262 (I²PAK) surface-mount-compatible package with isolated tab (drain-connected), optimized for PCB thermal management using a large copper pour and thermal vias.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Drain (Tab) | Main current path from source to load | Electrically connected to metal tab; requires insulated mounting or isolation pad when mounted to heatsink. |
| Source | Reference node for gate control and current return | Low-inductance connection point for gate driver return and sense resistor placement; internal source inductance = 7.5 nH. |
| Gate | Control terminal for channel modulation | High-impedance input requiring <120 nC charge; sensitive to ringing - layout must minimize loop area with gate resistor close to package. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low RDS(on) | 14–18 mΩ enables <1.1 W conduction loss at 35 A, reducing thermal stress in high-current power stages. |
| Repetitive avalanche rated | Validated for repeated unclamped inductive switching up to IAS = 35 A and EAR = 200 mJ, eliminating need for external clamping in many motor drive applications. |
| 175°C operating junction temperature | Allows full-rated performance in ambient temperatures up to 100°C with proper PCB thermal design, extending reliability in sealed enclosures. |
| Fast switching with low Qgd/Qgs | 27–40 nC Miller charge and 19–28 nC gate-to-source charge reduce susceptibility to dv/dt-induced turn-on and improve hard-switching efficiency. |
Applications
| DC-DC Converters | Motor Drives |
|---|---|
Use Scenario: High-efficiency 48 V–12 V synchronous buck converter in telecom power shelves. IC Role / Device Role / Timing Role: Primary high-side switching FET handling 50 A peak currents with 100 kHz PWM. Use Value: Low 14–18 mΩ RDS(on) reduces conduction loss by >30% vs. comparable 20 mΩ devices, improving full-load efficiency to >95%. | Use Scenario: Three-phase inverter stage in 1 kW BLDC motor controller for HVAC compressors. IC Role / Device Role / Timing Role: Low-side switching element in 60 kHz PWM-driven half-bridge, conducting freewheeling current via body diode. Use Value: 50–75 ns trr and 100–160 nC Qrr minimize diode recovery loss and EMI during commutation. |
| Uninterruptible Power Supplies | Industrial Power Supplies |
Use Scenario: Output stage of online double-conversion UPS delivering 2 kVA with battery backup. IC Role / Device Role / Timing Role: Inverter switch in full-bridge topology operating at 20 kHz with 100 V DC link. Use Value: 170 mJ EAS and 175°C TJ(max) ensure reliable operation during line dropouts and short-circuit events without derating. | Use Scenario: Primary-side switch in 1.5 kW industrial AC-DC front-end with PFC + LLC stages. IC Role / Device Role / Timing Role: LLC resonant switch handling 59 A pulsed drain current with zero-voltage switching assist. Use Value: Low Coss (290 pF) and Crss (150 pF) enable clean ZVS transition and reduce capacitive switching loss at 300 kHz. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP110N10F7 | 100 V, 110 A, 7.5 mΩ RDS(on), TO-220FP package, lower RDS(on) but higher Qg (130 nC) | Higher current rating suits larger inverters; less suitable for space-constrained TO-262 layouts | Select when board space permits TO-220FP and lower conduction loss outweighs gate drive complexity. |
| IXTH50N10L2 | 100 V, 50 A, 12 mΩ RDS(on), TO-247 package, 150°C TJ(max), no repetitive avalanche rating | Limited avalanche capability requires external protection in inductive loads; better thermal performance in forced-air cooling | Prefer for high-reliability linear-regulated supplies where avalanche stress is absent and heatsinking is optimized. |
Compared with STP110N10F7 and IXTH50N10L2, IRF3710ZLPBF offers balanced trade-offs: TO-262 footprint compatibility, verified repetitive avalanche behavior, and mid-range RDS(on)/Qg ideal for cost-sensitive industrial motor drives and UPS systems requiring field-proven ruggedness.
Availability
IRF3710ZLPBF is available at Aetrix Electronics and suitable for DC-DC converters, motor drives, uninterruptible power supplies, and industrial power supplies requiring stable component supply and long-term manufacturing continuity.
Supply support for IRF3710ZLPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader specializing in power management, automotive, and industrial control solutions, with deep expertise in silicon-based power devices.
The IRF3710ZLPBF belongs to Infineon's legacy HEXFET® Power MOSFET product line, engineered for high-current, high-ruggedness switching in industrial power conversion and motor control applications.
FAQ
Is IRF3710ZLPBF RoHS-compliant and lead-free?
Yes. IRF3710ZLPBF carries the "PbF" suffix per Infineon's marking convention, confirming full compliance with RoHS Directive 2011/65/EU and exemption 7a. The device uses lead-free terminations and meets JEDEC J-STD-020 moisture sensitivity level 1 (MSL-1) for unlimited floor life at ≤30°C/85% RH.
What is the recommended gate resistor value for IRF3710ZLPBF in a 100 kHz buck converter?
A 10 Ω non-inductive gate resistor is recommended for 100 kHz operation, balancing switching speed (tr/tf ≈ 77/56 ns) against gate driver stress and EMI. Layout must keep gate loop inductance <5 nH; values below 5 Ω increase risk of oscillation due to 7.5 nH internal source inductance.
Does IRF3710ZLPBF require a heatsink in TO-262 mounting?
Yes. At 59 A continuous current, junction-to-ambient thermal resistance is 40 °C/W (PCB mount). With 1.1 W conduction loss and 0.5 W switching loss, ΔTJ-A exceeds 60°C - necessitating a minimum 25 cm² copper pour with 6+ thermal vias, or an external heatsink for ambient >50°C.
Can IRF3710ZLPBF replace IRF3710PBF in existing designs?
Yes, with mechanical verification. Both share identical electrical specs and TO-262 package outline, but IRF3710ZLPBF uses enhanced leadframe plating for improved solderability and wirebond reliability. No circuit requalification is needed unless the original design operated near thermal limits - then verify junction temperature with the updated RθJC = 0.92 °C/W.
IRF3710ZLPBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- TO-262-3 Long Leads, I2PAK, TO-262AA
- Packaging:
- Tube
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 100 V
- Current - Continuous Drain (Id) @ 25°C:
- 59A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 18mOhm @ 35A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 120 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2900 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 160W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- TO-262
IRF3710ZLPBF FAQ
1.How can I place an order for IRF3710ZLPBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRF3710ZLPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRF3710ZLPBF reliable?
The price and inventory of IRF3710ZLPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRF3710ZLPBF is usually 5 days.
3.What payment methods are accepted for IRF3710ZLPBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRF3710ZLPBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRF3710ZLPBF?
IRF3710ZLPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRF3710ZLPBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRF3710ZLPBF?
For technical support, including IRF3710ZLPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRF3710ZLPBF requirements.
6.How does Aetrix verify that IRF3710ZLPBF is sourced from the original manufacturer or authorized distributors?
All IRF3710ZLPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRF3710ZLPBF meets industry standards.
7.What is the process for return or replacement of IRF3710ZLPBF?
All IRF3710ZLPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRF3710ZLPBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRF3710ZLPBF part is unused and in its original packaging.
Return procedure for IRF3710ZLPBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IRF3710ZLPBF Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

