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Infineon Technologies IRF3808LPBF

Part No.:
IRF3808LPBF
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
TO-262-3 Long Leads, I2PAK, TO-262AA
Datasheet:
AetrixIRF3808LPBF.pdf
Description:
MOSFET N-CH 75V 106A TO262
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,180

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Product details

Overview

IRF3808LPBF from Infineon Technologies is a 75 V, 106 A N-channel enhancement-mode HEXFET® Power MOSFET in TO-262 (ISOTOP) package, featuring 7.0 mΩ RDS(on) at VGS = 10 V, 175°C maximum junction temperature, and 430 mJ single-pulse avalanche energy - designed for high-current industrial motor drive inverters.

For engineers reviewing the IRF3808LPBF datasheet, IRF3808LPBF pinout, IRF3808LPBF application, or IRF3808LPBF equivalent, key selection criteria include continuous drain current derating above 100°C, gate charge (150–220 nC), body diode reverse recovery performance (trr = 93–140 ns), and thermal resistance (RθJC = 0.75°C/W).

Technical Context

This MOSFET employs Advanced Planar Stripe processing to achieve ultra-low on-resistance per silicon area while maintaining robust unclamped inductive switching capability. Its 175°C TJ rating and low RθJC support high-power density designs without forced cooling in motor control H-bridges.

The device integrates a fast-recovery body diode with 1.3 V forward voltage at 82 A and supports repetitive avalanche operation up to TJmax, enabled by controlled dynamic dv/dt rating (5.5 V/ns) and optimized internal inductance (LD/LS specified).

Key Specifications

ParameterValue and Actual Design Meaning
VDSS75 V - Maximum blocking voltage in off-state; defines upper limit of DC bus voltage in half-bridge motor drives
RDS(on)7.0 mΩ max @ VGS = 10 V, ID = 82 A - Directly determines conduction loss and heatsink sizing at 106 A continuous
ID @ TC = 25°C106 A - Continuous current capability with case-mounted heatsinking; enables single-device 5–7 kW motor phase legs
EAS430 mJ - Single-pulse avalanche energy; allows safe operation during inductive turn-off transients without snubbers
Qg220 nC max - Total gate charge; sets minimum gate driver peak current (≥3 A) and switching loss trade-off
RθJC0.75°C/W - Junction-to-case thermal resistance; enables direct mounting to cold plates with predictable ΔTJ-C
trr140 ns max - Body diode reverse recovery time; constrains maximum PWM frequency before cross-conduction risk

Pinout & Package

TO-262 (ISOTOP) package: 3-pin, through-hole, isolated tab (drain-connected), standard footprint compatible with TO-220 heatsink mounts. Tab is electrically connected to drain.

Pin/TerminalCircuit RoleDesign Meaning
Drain (Tab)Main power output terminalElectrically tied to metal tab; requires insulated mounting or direct cold-plate contact for thermal path
SourcePower return / reference nodeLow-inductance source connection critical for gate drive stability and diode commutation
GateControl inputHigh-impedance MOS control node; requires <2.5 Ω series resistance to damp ringing during 140 ns fall time

Key Features

FeatureDesign Value
Ultra-low RDS(on)7.0 mΩ enables ≤0.6 W conduction loss at 82 A, reducing heatsink mass by >40% vs. legacy 10 mΩ devices
175°C TJ ratingPermits sustained operation in sealed enclosures or high-ambient environments without derating below 100°C case temp
Repetitive avalanche capabilityValidated up to TJmax per Fig. 15/16; eliminates need for external avalanche-rated snubbers in motor phase-legs
Fast body diode recoverytrr = 93–140 ns with Qrr = 340–510 nC - reduces shoot-through risk and EMI in 20–50 kHz PWM inverters

Applications

Industrial Motor Drive InverterDC-AC Solar Microinverter

Use Scenario: Three-phase 3–5 kW BLDC motor drive with space-constrained heatsink and no forced air.

IC Role / Device Role / Timing Role: High-side/low-side switch in 6-pack inverter leg; handles 106 A continuous phase current with 50 kHz PWM.

Use Value: 0.75°C/W RθJC and 175°C TJ allow passive cooling; 430 mJ EAS prevents failure during load dump events.

Use Scenario: Single-phase transformerless solar microinverter with bidirectional current flow and grid-synchronization.

IC Role / Device Role / Timing Role: Synchronous rectifier and active switch in H-bridge; conducts reverse current via body diode during zero-crossing.

Use Value: Low Qrr (340–510 nC) and fast trr (93–140 ns) minimize reactive losses and EMI during bidirectional commutation.

Uninterruptible Power Supply (UPS) Output StageAutomotive HVAC Blower Driver

Use Scenario: Online double-conversion UPS delivering clean 230 VAC with battery backup and high crest factor loads.

IC Role / Device Role / Timing Role: Final output stage switch handling peak currents ≥3× RMS; subjected to frequent overload and short-circuit stress.

Use Value: Repetitive avalanche rating allows safe clamping during output shorts; 550 A IDM supports 10 ms surge without desaturation.

Use Scenario: 12 V automotive HVAC blower with PWM speed control, operating from -40°C to +125°C under hood.

IC Role / Device Role / Timing Role: Low-side switch controlling brushed DC motor; exposed to load dump transients and cold-crank voltage dips.

Use Value: 75 V VDSS withstands 35 V load dump spikes; -55°C to +175°C TSTG/TJ range ensures reliability across full automotive temperature profile.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IRF3205PbFRDS(on) = 8.0 mΩ, ID = 110 A, EAS = 320 mJ, TO-220 packageLower avalanche robustness; higher conduction loss at >60 A; requires larger heatsinkSelect when cost sensitivity outweighs avalanche margin and thermal density requirements
STP110N8F6RDS(on) = 6.5 mΩ, ID = 100 A, EAS = 520 mJ, TO-220FP packageHigher avalanche energy but lower continuous current; surface-mount variant limits thermal path optionsSelect when higher avalanche margin is critical and PCB layout permits TO-220FP mounting

Compared with IRF3205PbF and STP110N8F6, IRF3808LPBF offers optimal balance of low RDS(on), high continuous current, and proven repetitive avalanche behavior in through-hole industrial packages - making it preferred for thermally constrained motor drive legs where reliability under transient overloads is non-negotiable.

Availability

IRF3808LPBF is available at Aetrix Electronics and suitable for industrial motor drive inverters, solar microinverters, and uninterruptible power supply (UPS) output stages requiring stable component supply and long-term production continuity.

Supply support for IRF3808LPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs and discrete devices.

The HEXFET® Power MOSFET product line targets high-efficiency, high-reliability power conversion systems - specifically engineered for motor drives, renewable energy inverters, and industrial SMPS where thermal robustness and avalanche tolerance are critical.

FAQ

What is the maximum allowable gate-to-source voltage for IRF3808LPBF?

The absolute maximum VGS is ±20 V. Operation beyond ±20 V risks permanent gate oxide damage. For reliable switching, gate drive should be limited to +10 V to +15 V for turn-on and –5 V to 0 V for turn-off, per the device's 2.0–4.0 V threshold range and transconductance curve.

Can IRF3808LPBF be used in synchronous rectification applications?

Yes - its low RDS(on) (7.0 mΩ), fast body diode (trr = 93–140 ns), and low Qrr (340–510 nC) make it suitable for synchronous rectification in DC-DC converters up to 100 kHz. However, external gate control timing must precisely align with current zero-crossing to avoid shoot-through.

Is IRF3808LPBF lead-free and RoHS compliant?

Yes - the "PbF" suffix confirms lead-free termination and full compliance with EU RoHS Directive 2011/65/EU and JEDEC JS-709B. The device uses matte tin plating on leads and meets IPC/JEDEC J-STD-020 moisture sensitivity level (MSL) 1 for unlimited floor life at ≤30°C/60% RH.

Does IRF3808LPBF require a gate resistor, and what value is recommended?

Yes - a series gate resistor is required to control dV/dt and suppress oscillation. For 106 A switching with 220 nC Qg, a 2.5 Ω resistor is specified in the datasheet for turn-off delay testing. Typical design values range from 1.5 Ω (fast switching, higher EMI) to 5.6 Ω (slower, lower EMI), depending on driver capability and layout parasitics.

IRF3808LPBF Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HEXFET®
Package/Case:
TO-262-3 Long Leads, I2PAK, TO-262AA
Packaging:
Tube
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
75 V
Current - Continuous Drain (Id) @ 25°C:
106A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
7mOhm @ 82A, 10V
Vgs(th) (Max) @ Id:
4V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
220 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
5310 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
200W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
TO-262

IRF3808LPBF FAQ

1.How can I place an order for IRF3808LPBF through Aetrix?

Please submit a Request for Quotation (RFQ) for IRF3808LPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IRF3808LPBF reliable?

The price and inventory of IRF3808LPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRF3808LPBF is usually 5 days.

3.What payment methods are accepted for IRF3808LPBF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRF3808LPBF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IRF3808LPBF?

IRF3808LPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IRF3808LPBF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IRF3808LPBF?

For technical support, including IRF3808LPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRF3808LPBF requirements.

6.How does Aetrix verify that IRF3808LPBF is sourced from the original manufacturer or authorized distributors?

All IRF3808LPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRF3808LPBF meets industry standards.

7.What is the process for return or replacement of IRF3808LPBF?

All IRF3808LPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRF3808LPBF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IRF3808LPBF part is unused and in its original packaging.

Return procedure for IRF3808LPBF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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