Infineon Technologies IRF5210STRR
- Part No.:
- IRF5210STRR
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
IRF5210STRR.pdf
- Description:
- MOSFET P-CH 100V 40A D2PAK
- Quantity:
- Payment:

- Shipping:

Inventory:5,480
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IRF5210STRR from Infineon Technologies is a P-channel enhancement-mode MOSFET designed for high-power switching in DC-DC converters, motor drives, and load switching circuits. It delivers -100 V V(BR)DSS, 60 mΩ RDS(on) at VGS = -10 V, -38 A continuous drain current at TC = 25°C, and operates up to 150°C junction temperature - enabling robust performance in industrial power supplies and uninterruptible power systems.
For engineers reviewing the IRF5210STRR datasheet, IRF5210STRR pinout, IRF5210STRR application, or IRF5210STRR equivalent, key selection criteria include its ultra-low on-resistance, fast switching (tr = 63 ns, tf = 55 ns), repetitive avalanche rating (EAR = 120 mJ), body diode recovery characteristics (trr = 170–260 ns), and D2Pak (TO-263) surface-mount package compatibility with high-current PCB layouts.
Technical Context
This MOSFET employs advanced planar process technology optimized for low RDS(on) and high avalanche ruggedness. Its gate threshold voltage range of -2.0 V to -4.0 V ensures reliable turn-on control under negative bias, while the 150°C maximum operating junction temperature supports operation in thermally constrained enclosures without derating penalties.
The integrated body diode exhibits VSD = -1.6 V at IS = -23 A and reverse recovery charge Qrr = 1180–1770 nC, making it suitable for synchronous rectification and freewheeling paths where controlled diode conduction and recovery are critical to efficiency and EMI management.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| V(BR)DSS | -100 V - Withstands up to 100 V drain-source blocking voltage before avalanche onset. |
| RDS(on) | 60 mΩ max at VGS = -10 V, TC = 25°C - Enables low conduction loss in high-current switching paths. |
| ID (cont) | -38 A at TC = 25°C - Supports sustained high-current loads with appropriate heatsinking. |
| Qg | 150–230 nC - Determines gate drive energy requirement and switching speed trade-off. |
| tr / tf | 63 ns / 55 ns - Fast edge rates reduce switching losses in PWM-based topologies. |
| EAS | 170 mJ single-pulse avalanche energy - Provides transient overvoltage protection without external snubbers. |
| trr | 170–260 ns - Defines body diode recovery time impacting cross-conduction risk in bridge configurations. |
Pinout & Package
IRF5210STRR is housed in a D2Pak (TO-263) surface-mount package with three terminals: Gate (G), Drain (D), and Source (S). The exposed drain pad provides low thermal resistance (RθJC = 0.75 °C/W) and serves as the primary heat transfer path to the PCB copper plane.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G | Gate | Controls channel conduction via negative VGS; requires -10 V for full enhancement and low RDS(on). |
| D | Drain | Main high-side or low-side switching node; electrically connected to exposed metal tab for thermal and electrical sinking. |
| S | Source | Reference terminal for gate drive and current return path; tied to system ground or floating rail depending on topology. |
Key Features
| Feature | Design Value |
|---|---|
| P-channel enhancement mode | Enables high-side switching without level-shifting gate drivers in buck or half-bridge configurations. |
| Repetitive avalanche rated | Supports ≥120 mJ per pulse (EAR) - allows safe operation under inductive load switching transients. |
| Ultra-low RDS(on) | 60 mΩ typical at -10 V VGS - reduces I²R losses and thermal stress in 20–40 A power stages. |
| 150°C maximum junction temperature | Permits operation in sealed enclosures or high-ambient environments without forced air cooling. |
| Fast body diode recovery | trr = 170–260 ns with Qrr = 1180–1770 nC - minimizes shoot-through risk and improves efficiency in synchronous rectifiers. |
Applications
| Industrial DC-DC Converters | Uninterruptible Power Supplies (UPS) |
|---|---|
Use Scenario: High-efficiency 48 V to 12 V isolated buck converter delivering 30 A output. IC Role / Device Role / Timing Role: Primary-side synchronous rectifier switch in secondary-side synchronous rectification stage. Use Value: Low RDS(on) and fast trr reduce conduction and recovery losses, improving overall conversion efficiency by >1.2% at full load. | Use Scenario: Battery backup inverter stage handling 2 kVA peak load with bidirectional energy flow. IC Role / Device Role / Timing Role: Low-side switch in H-bridge inverter leg, conducting high pulsed currents during battery discharge. Use Value: Repetitive avalanche rating and 150°C TJ capability ensure reliability during grid fault transitions and battery surge events. |
| Motor Drive Half-Bridge | High-Current Load Switch |
Use Scenario: 24 V brushed DC motor controller driving 25 A stall current with PWM frequency up to 20 kHz. IC Role / Device Role / Timing Role: Low-side switch in half-bridge configuration, commutating motor current through internal body diode during off-time. Use Value: Optimized body diode VSD (-1.6 V) and Qrr minimize freewheeling losses and thermal rise during continuous PWM operation. | Use Scenario: Remote-controlled 48 V telecom power distribution unit switching 35 A server rack loads. IC Role / Device Role / Timing Role: Solid-state replacement for mechanical relay, providing zero-crossing-free, bounce-free, and arcless switching. Use Value: 60 µs pulse-rated ID = -140 A (IDM) and robust SOA enable safe hot-swap and inrush current handling without external current limiting. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar P-channel high-voltage power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP100P06 | 60 V V(BR)DSS, 11 mΩ RDS(on), TO-220 package | Limited to ≤60 V systems; lower voltage rating precludes use in 100 V bus designs. | Select when lower voltage and higher current density are prioritized over 100 V blocking capability. |
| IXTP120P05T | 50 V V(BR)DSS, 9.5 mΩ RDS(on), TO-220 package, 175°C TJ max | Not rated for 100 V operation; higher temperature rating but incompatible with same voltage class. | Prefer for ultra-high-temp environments where 50 V operation suffices and thermal margin is critical. |
Compared with STP100P06 and IXTP120P05T, IRF5210STRR uniquely balances 100 V blocking, 60 mΩ on-resistance, D2Pak thermal performance, and repetitive avalanche capability - making it the only viable option for 48–100 V industrial switching applications requiring both voltage headroom and ruggedness.
Availability
IRF5210STRR is available at Aetrix Electronics and suitable for industrial DC-DC converters, uninterruptible power supplies (UPS), and motor drive half-bridges requiring stable component supply across multi-year production cycles.
Supply support for IRF5210STRR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs and discrete devices.
The IRF5210STRR belongs to Infineon's legacy HEXFET® P-channel MOSFET product line, engineered for high-reliability power switching in industrial, telecom, and renewable energy systems where voltage robustness and thermal resilience are critical.
FAQ
What is the maximum continuous drain current for IRF5210STRR at 100°C case temperature?
The maximum continuous drain current ID at TC = 100°C is -24 A, specified at VGS = -10 V. This reflects thermal derating due to reduced channel conductivity and increased RDS(on) at elevated temperatures, requiring careful thermal design to maintain safe junction temperature below 150°C.
Does IRF5210STRR have a built-in body diode, and what are its key parameters?
Yes, IRF5210STRR integrates a planar body diode with VSD = -1.6 V at IS = -23 A, trr = 170–260 ns, and Qrr = 1180–1770 nC. These values are measured under standardized conditions (IF = -23 A, di/dt = -100 A/µs, TJ = 25°C) and define its freewheeling behavior in inductive switching applications.
Can IRF5210STRR be used in parallel configurations, and what layout considerations apply?
Yes, IRF5210STRR supports paralleling for higher current capacity. Critical layout requirements include matched gate trace lengths, Kelvin source connections to minimize common-source inductance, symmetrical thermal coupling to the PCB, and individual gate resistors (≥10 Ω) to suppress oscillation and ensure current sharing stability.
Is IRF5210STRR lead-free and RoHS compliant?
Yes, IRF5210STRR is lead-free and RoHS compliant, as confirmed by Infineon's official documentation and packaging markings (PbF suffix). It meets EU Directive 2011/65/EU and is compatible with standard lead-free reflow profiles (peak temperature ≤ 260°C, 20–40 sec above 217°C).
IRF5210STRR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- P-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 100 V
- Current - Continuous Drain (Id) @ 25°C:
- 40A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 60mOhm @ 24A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 180 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2700 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 3.8W (Ta), 200W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- D2PAK
IRF5210STRR FAQ
1.How can I place an order for IRF5210STRR through Aetrix?
Please submit a Request for Quotation (RFQ) for IRF5210STRR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRF5210STRR reliable?
The price and inventory of IRF5210STRR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRF5210STRR is usually 5 days.
3.What payment methods are accepted for IRF5210STRR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRF5210STRR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRF5210STRR?
IRF5210STRR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRF5210STRR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRF5210STRR?
For technical support, including IRF5210STRR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRF5210STRR requirements.
6.How does Aetrix verify that IRF5210STRR is sourced from the original manufacturer or authorized distributors?
All IRF5210STRR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRF5210STRR meets industry standards.
7.What is the process for return or replacement of IRF5210STRR?
All IRF5210STRR units undergo pre-shipment inspection (PSI). If there is an issue with IRF5210STRR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRF5210STRR part is unused and in its original packaging.
Return procedure for IRF5210STRR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IRF5210STRR Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

