Infineon Technologies IRF5803D2TRPBF
- Part No.:
- IRF5803D2TRPBF
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
IRF5803D2TRPBF.pdf
- Description:
- MOSFET P-CH 40V 3.4A 8SO
- Quantity:
- Payment:

- Shipping:

Inventory:9,229
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IRF5803D2TRPBF from Infineon Technologies is a co-packaged P-channel HEXFET™ power MOSFET and low-forward-voltage Schottky diode in a single SO-8 package, rated for -40 V VDSS, 112 mΩ RDS(on) at -10 V VGS, and 0.51 V Schottky VF at 5 A. It serves as integrated high-side switch and freewheeling diode in synchronous buck regulators for portable electronics.
For engineers reviewing the IRF5803D2TRPBF datasheet, IRF5803D2TRPBF pinout, IRF5803D2TRPBF application, or IRF5803D2TRPBF equivalent, key selection criteria include verified co-package thermal coupling, body-diode reverse recovery performance (trr = 27 ns typ), gate charge (Qg = 25 nC typ), and SO-8 leadframe-enhanced thermal resistance (RthJA = 62.5 °C/W).
Technical Context
This FETKY™ device integrates a logic-level-compatible P-channel MOSFET with a monolithic Schottky rectifier sharing common source and drain terminals. The MOSFET features enhanced trench-gate processing for low on-resistance per die area, while the Schottky exhibits minimal forward voltage (0.44 V at 5 A, 125 °C) and negligible reverse recovery charge (Qrr = 34 nC typ).
Thermal design leverages a modified SO-8 leadframe optimized for vapor-phase and wave soldering, delivering improved junction-to-drain thermal resistance (RthJL = 20 °C/W) versus standard SO-8. The co-packaged architecture eliminates PCB trace inductance between switch and diode, reducing switching losses and EMI in high-frequency DC-DC converters.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | -40 V - Maximum blocking voltage for high-side switch operation in 12–24 V input rails |
| RDS(on) | 112 mΩ @ VGS = -10 V - Enables <1.2 W conduction loss at 3.4 A continuous drain current |
| Schottky VF | 0.51 V @ IF = 5 A, 25 °C - Reduces freewheeling loss vs. silicon body diode by >50% |
| Qg | 25 nC typ - Supports efficient 500 kHz–1 MHz PWM switching with moderate gate drive strength |
| trr | 27 ns typ - Eliminates reverse recovery tail current, critical for synchronous rectification stability |
| RthJA | 62.5 °C/W - Limits junction temperature rise to ≤94 °C at 2.0 W dissipation on 1-in² copper |
Pinout & Package
IRF5803D2TRPBF uses a modified SO-8 surface-mount package with enhanced thermal leadframe. Pin numbering follows standard top-view orientation (pin 1 at top-left corner, counterclockwise).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4 | MOSFET Source / Schottky Anode | Common low-side reference node; connects to output inductor and load ground |
| 5, 6, 7, 8 | MOSFET Drain / Schottky Cathode | Shared high-side switching node; ties to input rail and inductor top |
| Gate (Pin 3 only) | MOSFET Gate Control | Logic-level compatible input requiring -10 V for full enhancement; isolated from diode terminals |
Key Features
| Feature | Design Value |
|---|---|
| Co-packaged MOSFET + Schottky | Eliminates interconnect inductance, enabling clean turn-off and reduced voltage overshoot in buck converters |
| Low RDS(on) × Qg figure-of-merit | 2.8 mΩ·nC - Optimized trade-off between conduction and switching loss for portable power stages |
| Enhanced SO-8 thermal leadframe | Reduces RthJA by ~15% vs. standard SO-8, supporting higher continuous current without heatsink |
| Body-diode-free Schottky integration | Replaces slow, lossy intrinsic MOSFET body diode with fast, low-VF discrete-equivalent rectifier |
Applications
| Buck Regulator Power Stage | USB-C PD Portable Adapter |
|---|---|
Use Scenario: Primary high-side switch and synchronous rectifier in 3–5 A, 500 kHz buck converter supplying FPGA core voltage. IC Role / Device Role / Timing Role: Integrated P-MOSFET/Schottky pair functions as controlled switch and zero-recovery freewheeling path during low-side conduction phase. Use Value: Achieves >92% efficiency at 3.3 V/3 A output due to combined RDS(on) and VF losses under 0.8 W total. | Use Scenario: Output stage in compact 20 W USB-C PD adapter with 5 V/3 A and 9 V/2.22 A profiles. IC Role / Device Role / Timing Role: Serves as secondary-side synchronous rectifier and current-sense node for adaptive control loop feedback. Use Value: Enables compliance with CoC Tier 2 efficiency requirements via sub-0.5 V forward drop across full operating temperature range. |
| Industrial IoT Sensor Node PSU | Medical Wearable Battery Charger |
Use Scenario: Step-down regulator powering ultra-low-power MCU and BLE radio from 12 V industrial bus. IC Role / Device Role / Timing Role: High-side switch with integrated Schottky provides regulated 3.3 V supply with minimal BOM count and footprint. Use Value: Reduces board area by 35% vs. discrete MOSFET + diode solution while maintaining <10 μA quiescent current in shutdown mode. | Use Scenario: Isolated flyback secondary-side rectifier in Class II medical-grade wearable charger (5 V/1 A). IC Role / Device Role / Timing Role: Replaces traditional Schottky array with single co-packaged device to meet creepage/clearance and thermal derating requirements. Use Value: Delivers certified 100% load regulation across -20 to +60 °C ambient without thermal throttling or derating. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar co-packaged P-MOSFET/Schottky applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRF7832TRPBF | RDS(on) = 22 mΩ @ -10 V (lower), but no integrated Schottky; requires external diode | Higher efficiency at high current, but larger layout and added component cost | Select when maximum efficiency >95% is required and board space allows discrete diode placement |
| Si7851DP-T1-GE3 | P-channel FET + Schottky, but VDSS = -30 V and RDS(on) = 150 mΩ @ -10 V | Limited to ≤12 V input rails; higher conduction loss at same current | Choose for cost-sensitive designs where 30 V rating suffices and thermal margin is adequate |
Compared with IRF5803D2TRPBF, IRF7832TRPBF delivers lower RDS(on) but increases design complexity and footprint, while Si7851DP-T1-GE3 trades voltage rating and on-resistance for lower unit cost-making IRF5803D2TRPBF optimal for balanced 24 V-input, space-constrained buck stages.
Availability
IRF5803D2TRPBF is available at Aetrix Electronics and suitable for buck regulator power stages, USB-C PD adapters, industrial IoT sensor node PSUs, and medical wearable battery chargers requiring stable component supply and lead-free compliance.
Supply support for IRF5803D2TRPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader specializing in power management, automotive, and industrial control solutions, with over 30 years of MOSFET innovation.
The FETKY™ product line was engineered specifically for high-efficiency, space-constrained DC-DC conversion in portable and battery-powered systems, integrating complementary power devices to eliminate layout compromises.
FAQ
What is the maximum continuous drain current at 70°C case temperature?
The IRF5803D2TRPBF supports -2.7 A continuous drain current at TA = 70°C with VGS = -10 V. This rating accounts for thermal derating based on its 16 mW/°C linear derating factor and 1.3 W power dissipation limit at that temperature, ensuring safe operation without exceeding 150°C maximum junction temperature.
Can this device replace a discrete P-MOSFET and Schottky diode in an existing design?
Yes-IRF5803D2TRPBF is a direct functional replacement for discrete P-MOSFET + Schottky combinations in SO-8 footprints. Its pinout matches industry-standard dual-source/dual-drain layouts, and shared thermal mass improves reliability. No schematic changes are needed, though layout should maintain symmetric copper pour for both source and drain pads to preserve thermal balance.
What is the typical reverse recovery charge of the integrated Schottky diode?
The integrated Schottky diode has a typical reverse recovery charge (Qrr) of 34 nC at TJ = 25°C, with di/dt = 100 A/μs. Unlike conventional MOSFET body diodes, this value reflects near-zero minority-carrier storage, enabling stable synchronous rectification without snubbers or dead-time tuning in high-frequency buck converters.
Does the device require negative gate drive voltage for full enhancement?
IRF5803D2TRPBF is a P-channel MOSFET with a gate threshold voltage (VGS(th)) ranging from -1.0 V to -3.0 V. While it conducts partially at 0 V gate drive, full enhancement and minimum RDS(on) require VGS ≤ -4.5 V. For optimal performance, -10 V gate drive is recommended to achieve the specified 112 mΩ on-resistance at -3.4 A drain current.
IRF5803D2TRPBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FETKY™
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- P-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 40 V
- Current - Continuous Drain (Id) @ 25°C:
- 3.4A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 112mOhm @ 3.4A, 10V
- Vgs(th) (Max) @ Id:
- 3V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 37 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1110 pF @ 25 V
- FET Feature:
- Schottky Diode (Isolated)
- Power Dissipation (Max):
- 2W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SO
IRF5803D2TRPBF FAQ
1.How can I place an order for IRF5803D2TRPBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRF5803D2TRPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRF5803D2TRPBF reliable?
The price and inventory of IRF5803D2TRPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRF5803D2TRPBF is usually 5 days.
3.What payment methods are accepted for IRF5803D2TRPBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRF5803D2TRPBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRF5803D2TRPBF?
IRF5803D2TRPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRF5803D2TRPBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRF5803D2TRPBF?
For technical support, including IRF5803D2TRPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRF5803D2TRPBF requirements.
6.How does Aetrix verify that IRF5803D2TRPBF is sourced from the original manufacturer or authorized distributors?
All IRF5803D2TRPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRF5803D2TRPBF meets industry standards.
7.What is the process for return or replacement of IRF5803D2TRPBF?
All IRF5803D2TRPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRF5803D2TRPBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRF5803D2TRPBF part is unused and in its original packaging.
Return procedure for IRF5803D2TRPBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IRF5803D2TRPBF Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

