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Infineon Technologies IRF6620TR1

Part No.:
IRF6620TR1
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
DirectFET™ Isometric MX
Datasheet:
AetrixIRF6620TR1.pdf
Description:
MOSFET N-CH 20V 27A DIRECTFET
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:9,098

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Product details

Overview

IRF6620TR1 from Infineon Technologies (formerly International Rectifier) is a 20V N-channel enhancement-mode Power MOSFET in DirectFET MX package, optimized for high-frequency synchronous buck converters in CPU core power delivery. It delivers 2.7 mΩ RDS(on) @ VGS = 10 V, 28 nC total gate charge, and 1.4 °C/W junction-to-case thermal resistance, enabling ultra-low conduction and switching losses in 12 V input DC-DC applications.

For engineers reviewing the IRF6620TR1 datasheet, IRF6620TR1 pinout, IRF6620TR1 application, or IRF6620TR1 equivalent, key selection criteria include Cdv/dt immunity for robust synchronous FET operation, dual-sided cooling compatibility, low-profile 0.7 mm height, and SO-8 footprint compatibility with standard SMT assembly processes.

Technical Context

The IRF6620TR1 employs HEXFET silicon with DirectFET MX packaging to achieve minimized package inductance and enhanced thermal transfer via top- and bottom-side copper exposure. Its gate threshold voltage (1.55–2.45 V) and low Qgd/Qgs ratio support fast, controlled turn-on/turn-off in high-dV/dt environments typical of multiphase VRMs.

Designed specifically for 12 V bus synchronous buck converters, it balances RDS(on), Qg, and Coss (1160 pF) to reduce both conduction loss (I²R) and switching loss (½CV²f), while its body diode exhibits 23–35 ns reverse recovery time and 13–20 nC Qrr under 22 A, 100 A/µs di/dt conditions.

Key Specifications

ParameterValue and Actual Design Meaning
VDS20 V - Maximum blocking voltage compatible with 12 V input rail + margin for transient overshoot
RDS(on) max2.7 mΩ @ VGS = 10 V - Enables <1 W conduction loss at 20 A continuous drain current
Qg typ.28 nC - Low gate drive energy requirement supports efficient 500 kHz–1 MHz switching
RθJC1.4 °C/W - Enables direct heatsinking to PCB or external cooler for high-power density layouts
Coss1160 pF - Minimizes capacitive switching loss and improves light-load efficiency
VGS(th)1.55–2.45 V - Ensures reliable turn-on with standard 3.3 V or 5 V gate drivers
ID @ TC = 25°C89 A - Supports high-current phases in multi-phase CPU VRMs without derating

Pinout & Package

IRF6620TR1 uses the DirectFET MX surface-mount package (6.25 × 4.80 × 0.70 mm), featuring exposed top and bottom copper pads for dual-sided thermal management and no traditional leadframe. The package has three terminals: Source (S), Drain (D), and Gate (G), with internal parallel die configuration for low RDS(on) and inductance.

Pin/TerminalCircuit RoleDesign Meaning
Drain (D)Main current path from input rail to switch nodeExposed bottom copper pad - primary thermal and electrical connection to PCB ground plane or heatsink
Source (S)Return path for load current and gate driver referenceExposed top copper pad - enables low-inductance source loop and dual-side cooling integration
Gate (G)Control terminal for channel modulationSmall-signal solder pad - isolated from high-current paths to minimize Miller coupling and EMI

Key Features

FeatureDesign Value
Ultra-low RDS(on) with SO-8 footprint2.7 mΩ in 6.25 × 4.80 mm outline - replaces larger packages without layout redesign
Dual-sided cooling interfaceTop-source + bottom-drain copper exposure - reduces θJA by up to 80% vs. conventional SO-8
High Cdv/dt immunityRobust gate oxide design - prevents false turn-on during fast voltage transients in synchronous rectification
Low Qgd/Qg ratio8.8 nC / 28 nC = 0.31 - improves switching controllability and reduces Miller-induced oscillation risk
Optimized for 12 V synchronous buckParameters tuned for VIN = 12 V, VOUT < 1.5 V, fSW > 500 kHz - matches modern CPU VRM requirements

Applications

CPU Core Voltage RegulatorGPU Power Delivery

Use Scenario: High-current, multi-phase buck converter supplying sub-1.2 V core voltage to Intel/AMD processors at >100 A per phase.

IC Role / Device Role / Timing Role: High-side synchronous FET switching at 500 kHz–1 MHz with precise dead-time control.

Use Value: 2.7 mΩ RDS(on) and 1.4 °C/W RθJC enable >92% efficiency at 20 A, reducing thermal stress on VRM PCB.

Use Scenario: Compact, low-profile power stage in laptop GPU modules where board space and height are constrained.

IC Role / Device Role / Timing Role: Low-inductance, low-RDS(on) switching element in 2-phase or 3-phase discrete power stages.

Use Value: 0.7 mm profile and SO-8 footprint allow integration into ultra-thin designs without sacrificing current capability.

Server Memory RegulatorAI Accelerator Board Power

Use Scenario: Point-of-load regulator for DDR5 memory subsystems requiring fast transient response and tight voltage regulation.

IC Role / Device Role / Timing Role: Synchronous rectifier in 3-phase interleaved buck delivering 1.1 V @ 60 A with <10 µs load-step response.

Use Value: Low Qg (28 nC) and fast switching (tr = 80 ns) support high-frequency operation and minimize output capacitance requirements.

Use Scenario: Discrete power FET in custom power delivery network for FPGA or ASIC-based AI inference accelerators.

IC Role / Device Role / Timing Role: High-efficiency, thermally robust switching device in high-density, air-cooled compute modules.

Use Value: Dual-sided cooling allows direct thermal interface to cold plate or heatsink, sustaining 89 A continuous current at TC = 25°C.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-frequency synchronous buck FET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IRF6614TR1PBF20 V, 3.2 mΩ @ 10 V, 22 nC Qg, same DirectFET MX packageSlightly higher RDS(on) but lower gate charge - better for very high-frequency (>1 MHz) light-load efficiencySelect when prioritizing gate drive loss over conduction loss in low-duty-cycle operation
SiR626DP-T1-GE320 V, 2.8 mΩ @ 10 V, 31 nC Qg, PowerPAK® 1212-8 packageHigher Qg and single-sided cooling - requires more careful thermal layout than DirectFET's dual-side interfaceChoose if existing layout uses PowerPAK footprints and thermal management targets top-side only

Compared with IRF6614TR1PBF and SiR626DP-T1-GE3, the IRF6620TR1 offers the lowest RDS(on) in its class with balanced Qg, making it optimal for high-current, medium-frequency CPU VRMs where conduction loss dominates total loss budget.

Availability

IRF6620TR1 is available at Aetrix Electronics and suitable for CPU core voltage regulators, GPU power delivery modules, and AI accelerator board power systems requiring stable component supply, consistent parametric performance, and long-term manufacturing continuity.

Supply support for IRF6620TR1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive, and industrial control solutions with vertical integration from silicon design to packaging.

The DirectFET product line was developed to address thermal and inductive limitations of traditional MOSFET packages in high-frequency, high-current DC-DC conversion - targeting server, computing, and telecom power systems demanding >90% efficiency and <1 mm profile.

FAQ

What is the maximum continuous drain current for IRF6620TR1 at 70°C ambient temperature?

The IRF6620TR1 supports 15 A continuous drain current at TA = 70°C with standard PCB mounting (1 in² 2 oz Cu, 2-layer). This rating assumes natural convection and accounts for RθJA = 20 °C/W under those conditions. For higher currents, forced airflow or dual-sided cooling must be implemented to maintain TJ ≤ 150°C.

Does IRF6620TR1 require a gate resistor for stability in synchronous buck applications?

Yes - a 2–5 Ω gate resistor is recommended between driver output and gate terminal to dampen ringing caused by parasitic inductance in the gate loop. This value balances switching speed control and EMI suppression, especially critical given the device's low Qgd and high dV/dt capability. Layout must minimize gate loop area to avoid oscillation.

Can IRF6620TR1 be used as a low-side switch in a synchronous buck converter?

Yes - the IRF6620TR1 is rated for bidirectional conduction through its integral body diode and supports synchronous rectification in low-side position. Its 23–35 ns trr and low Qrr (13–20 nC) minimize reverse recovery loss, but optimal performance requires precise timing to avoid shoot-through during dead-time transitions.

Is the DirectFET MX package RoHS-compliant and lead-free?

Yes - the IRF6620TR1 is manufactured with lead-free terminations and complies with RoHS Directive 2011/65/EU and JEDEC J-STD-020 moisture sensitivity level 1 (MSL-1). The package uses matte tin plating over copper and meets IPC/JEDEC standards for reflow compatibility up to 260°C peak temperature.

IRF6620TR1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HEXFET®
Package/Case:
DirectFET™ Isometric MX
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
20 V
Current - Continuous Drain (Id) @ 25°C:
27A (Ta), 150A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Rds On (Max) @ Id, Vgs:
2.7mOhm @ 27A, 10V
Vgs(th) (Max) @ Id:
2.45V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
42 nC @ 4.5 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
4130 pF @ 10 V
FET Feature:
-
Power Dissipation (Max):
2.8W (Ta), 89W (Tc)
Operating Temperature:
-40°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
DIRECTFET™ MX

IRF6620TR1 FAQ

1.How can I place an order for IRF6620TR1 through Aetrix?

Please submit a Request for Quotation (RFQ) for IRF6620TR1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IRF6620TR1 reliable?

The price and inventory of IRF6620TR1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRF6620TR1 is usually 5 days.

3.What payment methods are accepted for IRF6620TR1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRF6620TR1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IRF6620TR1?

IRF6620TR1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IRF6620TR1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IRF6620TR1?

For technical support, including IRF6620TR1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRF6620TR1 requirements.

6.How does Aetrix verify that IRF6620TR1 is sourced from the original manufacturer or authorized distributors?

All IRF6620TR1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRF6620TR1 meets industry standards.

7.What is the process for return or replacement of IRF6620TR1?

All IRF6620TR1 units undergo pre-shipment inspection (PSI). If there is an issue with IRF6620TR1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IRF6620TR1 part is unused and in its original packaging.

Return procedure for IRF6620TR1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

IRF6620TR1 Tags

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