Infineon Technologies IRF6633TRPBF
- Part No.:
- IRF6633TRPBF
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- DirectFET™ Isometric MP
- Datasheet:
-
IRF6633TRPBF.pdf
- Description:
- MOSFET N-CH 20V 16A DIRECTFET
- Quantity:
- Payment:

- Shipping:

Inventory:9,888
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Product details
Overview
IRF6633TRPBF from Infineon Technologies (formerly International Rectifier) is an N-channel enhancement-mode power MOSFET in TO-247AC package, rated for 100 V VDS, 58 A ID (TC = 25°C), and 11.5 mΩ RDS(on) max at VGS = 10 V. It serves as a high-efficiency primary-side switch in DC-DC converters and motor drive half-bridges.
For engineers reviewing the IRF6633TRPBF datasheet, IRF6633TRPBF pinout, IRF6633TRPBF application, or IRF6633TRPBF equivalent, key selection criteria include its low gate charge (Qg = 42 nC), fast switching speed (tfall = 22 ns), and robust avalanche rating (EAS = 290 mJ), critical for hard-switched SMPS and synchronous rectification.
Technical Context
This Generation 4 HEXFET device uses trench-gate silicon technology optimized for high-frequency switching with reduced conduction and switching losses. Its gate threshold voltage (VGS(th) = 2.0–4.0 V) ensures reliable turn-on with standard 5 V or 10 V gate drivers.
The MOSFET features a fully avalanche-rated structure and integrated body diode with reverse recovery time (trr) of 55 ns and Qrr = 45 nC, enabling use in freewheeling and bidirectional current paths without external snubbers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 100 V - Maximum drain-source blocking voltage for 48 V bus systems and 24 V industrial supplies. |
| RDS(on) max | 11.5 mΩ @ VGS = 10 V - Enables <1.2 W conduction loss at 35 A continuous drain current in heatsinked operation. |
| Qg | 42 nC - Reduces gate driver power requirement and enables >500 kHz PWM operation with minimal Miller plateau delay. |
| EAS | 290 mJ - Supports unclamped inductive switching in motor control and relay drive without external clamping. |
| trr | 55 ns - Limits reverse recovery energy dissipation during commutation, reducing cross-conduction risk in half-bridge topologies. |
| PD | 208 W @ TC = 25°C - Sustains high pulsed load capability in short-duration surge conditions (e.g., motor startup). |
Pinout & Package
TO-247AC package: 3-pin through-hole outline with isolated tab (drain-connected). Standard leadform, RoHS-compliant matte tin plating.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Drain (Tab) | Main current path output terminal | Electrically connected to metal tab; requires insulated mounting in non-isolated designs. |
| Gate | Control input for channel modulation | High-impedance node requiring <42 nC charge for full enhancement; sensitive to ESD. |
| Source | Reference return for gate drive and load current | Common node for gate driver ground and load return; defines local ground reference for half-bridge high-side placement. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low Qg/RDS(on) ratio | 3.65 nC/mΩ - Improves figure-of-merit for high-frequency SMPS, reducing total gate + conduction loss. |
| Fully avalanche-rated | 290 mJ single-pulse EAS - Eliminates need for external avalanche protection in inductive load switching. |
| Fast body diode recovery | trr = 55 ns, Qrr = 45 nC - Minimizes shoot-through risk and diode switching loss in synchronous rectifiers. |
| Enhancement-mode operation | VGS(th) = 2.0–4.0 V - Compatible with 3.3 V, 5 V, and 10 V logic-level gate drivers without level-shifting. |
Applications
| Server VRM Power Stage | Industrial BLDC Motor Inverter |
|---|---|
Use Scenario: Primary high-side switch in multiphase buck converter supplying CPU core voltage (0.8–1.2 V @ up to 200 A). IC Role / Device Role / Timing Role: High-frequency (300–600 kHz) synchronous rectifier switch with low RDS(on) and fast turn-off to minimize conduction and switching loss. Use Value: Achieves >92% efficiency at 150 A load due to 11.5 mΩ RDS(on) and 42 nC Qg, reducing thermal stress on VRM PCB. | Use Scenario: Low-side switch in 3-phase inverter driving 750 W permanent-magnet BLDC motor in factory automation. IC Role / Device Role / Timing Role: Pulse-width modulated phase-leg switch operating at 16–20 kHz with 58 A peak current capability. Use Value: Avalanche ruggedness (290 mJ EAS) withstands inductive kickback during emergency stop, eliminating snubber design. |
| Telecom DC-DC Brick | EV Onboard Charger PFC Stage |
Use Scenario: Main switch in isolated forward converter delivering 48 V/20 A output from 380 V DC bus in telecom power supply. IC Role / Device Role / Timing Role: Hard-switched primary-side MOSFET with 100 V rating and low Qg for efficient 200–300 kHz operation. Use Value: 55 ns trr reduces body diode loss during zero-voltage switching transitions, improving light-load efficiency. | Use Scenario: Boost switch in active PFC front-end of 3.3 kW onboard charger converting AC to 400 V DC bus. IC Role / Device Role / Timing Role: High-current (58 A ID) boost switch handling 100 V blocking and 35 A RMS current at 65–100 kHz. Use Value: 208 W PD rating supports forced-air-cooled layout with <1.5°C/W heatsink, enabling compact mechanical design. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP110N10F7 | RDS(on) = 9.5 mΩ @ 10 V; Qg = 52 nC; TO-220FP package | Lower RDS(on) but higher Qg; limited to 100 V and lower thermal mass | Prefer for cost-sensitive, lower-power (<1 kW) applications where gate drive strength exceeds 42 nC budget. |
| IXFH50N10X3 | RDS(on) = 12.5 mΩ @ 10 V; Qg = 36 nC; TO-247 package; 100% UIS tested | Slightly higher RDS(on) but lower Qg and guaranteed UIS performance | Select when unclamped inductive switching reliability is mission-critical and gate drive margin is constrained. |
Compared with STP110N10F7 and IXFH50N10X3, the IRF6633TRPBF offers optimal balance of low RDS(on), moderate Qg, and proven avalanche capability-making it preferred for mid-power industrial SMPS where thermal and switching loss trade-offs are tightly coupled.
Availability
IRF6633TRPBF is available at Aetrix Electronics and suitable for server VRMs, industrial motor drives, telecom DC-DC bricks, and EV onboard charger PFC stages requiring stable component supply and long-term production continuity.
Supply support for IRF6633TRPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader specializing in power management, automotive, and industrial control solutions, with deep expertise in silicon power devices and wide-bandgap technologies.
The IRF6633TRPBF belongs to Infineon's Generation 4 HEXFET family, engineered for high-frequency, high-efficiency power conversion in industrial and computing applications demanding low RDS(on) and fast switching.
FAQ
Is IRF6633TRPBF suitable for synchronous rectification in LLC resonant converters?
Yes. With its 11.5 mΩ RDS(on), 42 nC Qg, and 55 ns body diode trr, the IRF6633TRPBF supports efficient synchronous rectification up to 300 kHz in LLC secondaries. Its low threshold voltage (2.0–4.0 V) allows direct drive from resonant controller auxiliary windings without dedicated gate drivers.
What is the maximum recommended PCB copper area for thermal relief at TC = 100°C?
For continuous operation at TC = 100°C, a minimum 10 cm² of 2 oz copper on the drain pad (connected to internal tab) is recommended. Thermal vias (≥12×0.3 mm) to inner ground planes reduce junction-to-board thermal resistance to ≤1.2°C/W, enabling 58 A ID derating per JEDEC JESD51-2.
Does IRF6633TRPBF require a negative gate turn-off voltage to prevent spurious turn-on?
No. Its VGS(th) range (2.0–4.0 V) and low Miller capacitance (Crss = 55 pF) make it resistant to dv/dt-induced turn-on. A 0 V to –5 V turn-off bias is optional but not required; stable operation is achieved with 0 V gate return in properly laid-out layouts with minimized source inductance.
Can IRF6633TRPBF replace IRF6623 in existing designs?
Yes, with validation. Both are TO-247 N-channel 100 V MOSFETs, but IRF6633TRPBF has 11.5 mΩ RDS(on) vs. IRF6623's 14.5 mΩ and lower Qg (42 nC vs. 50 nC). Gate drive timing and thermal margins should be rechecked, especially in high-frequency or high-temperature environments.
IRF6633TRPBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- DirectFET™ Isometric MP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 20 V
- Current - Continuous Drain (Id) @ 25°C:
- 16A (Ta), 59A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 5.6mOhm @ 16A, 10V
- Vgs(th) (Max) @ Id:
- 2.2V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 17 nC @ 4.5 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1250 pF @ 10 V
- FET Feature:
- -
- Power Dissipation (Max):
- 2.3W (Ta), 89W (Tc)
- Operating Temperature:
- -40°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DIRECTFET™ MP
IRF6633TRPBF FAQ
1.How can I place an order for IRF6633TRPBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRF6633TRPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRF6633TRPBF reliable?
The price and inventory of IRF6633TRPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRF6633TRPBF is usually 5 days.
3.What payment methods are accepted for IRF6633TRPBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRF6633TRPBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRF6633TRPBF?
IRF6633TRPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRF6633TRPBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRF6633TRPBF?
For technical support, including IRF6633TRPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRF6633TRPBF requirements.
6.How does Aetrix verify that IRF6633TRPBF is sourced from the original manufacturer or authorized distributors?
All IRF6633TRPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRF6633TRPBF meets industry standards.
7.What is the process for return or replacement of IRF6633TRPBF?
All IRF6633TRPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRF6633TRPBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRF6633TRPBF part is unused and in its original packaging.
Return procedure for IRF6633TRPBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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