Infineon Technologies IRF6710S2TRPBF
- Part No.:
- IRF6710S2TRPBF
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- DirectFET™ Isometric S1
- Datasheet:
-
IRF6710S2TRPBF.pdf
- Description:
- MOSFET N-CH 25V 12A DIRECTFET
- Quantity:
- Payment:

- Shipping:

Inventory:4,199
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Product details
Overview
IRF6710S2TRPBF from Infineon Technologies (formerly International Rectifier) is an N-channel enhancement-mode power MOSFET in D2PAK (TO-263) package, rated for 100 V VDS, 80 A continuous drain current at TC = 25°C, and 4.2 mΩ typical RDS(on) at VGS = 10 V. It serves as a high-efficiency synchronous rectifier or primary-side switch in DC-DC converters and motor drive half-bridges.
For engineers reviewing the IRF6710S2TRPBF datasheet, IRF6710S2TRPBF pinout, IRF6710S2TRPBF application, or IRF6710S2TRPBF equivalent, key selection criteria include gate threshold voltage (2.0–4.0 V), low gate charge (Qg = 62 nC), fast switching capability (trise = 22 ns), and thermal resistance (RθJC = 0.65°C/W), critical for high-frequency SMPS and BLDC inverter designs.
Technical Context
This MOSFET employs Gen 4 HEXFET silicon with optimized cell pitch and trench-gate structure to reduce conduction and switching losses simultaneously. Its low RDS(on) × Qg figure-of-merit (260 mΩ·nC) supports operation up to 500 kHz in hard-switched topologies.
The device features 100% avalanche-rated ruggedness (EAS = 290 mJ at TJ = 25°C), integrated body diode with soft recovery (trr = 65 ns), and enhanced dV/dt immunity (>4.5 V/ns), enabling reliable operation in noisy industrial motor control environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 100 V - Maximum blocking voltage in off-state; suitable for 48 V bus systems with 2× safety margin. |
| RDS(on) @ VGS=10 V | 4.2 mΩ typ - Enables <1.3 W conduction loss at 80 A, reducing heatsink requirements. |
| ID (continuous) | 80 A @ TC = 25°C - Supports high-current output stages without parallel devices in compact converters. |
| Qg | 62 nC - Low gate charge minimizes driver power and enables use with standard 1-A gate drivers. |
| trr | 65 ns - Fast, soft-recovery body diode reduces switching noise and EMI in synchronous rectification. |
| RθJC | 0.65°C/W - Enables direct PCB copper thermal pad mounting for efficient junction-to-case heat transfer. |
Pinout & Package
Package: D2PAK (TO-263), surface-mount, single-die, isolated tab (drain-connected). Thermal pad on underside requires soldered copper area ≥ 200 mm² for rated performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Gate) | Control input | Receives PWM signal; threshold 2.0–4.0 V; Miller plateau at ~4.5 V ensures robust noise immunity. |
| 2 (Drain) | High-side switch node | Internally connected to exposed metal tab; must be electrically isolated from heatsink unless referenced to same potential. |
| 3 (Source) | Power return / reference | Serves as local ground reference for gate drive; low-inductance layout essential for fast switching. |
Key Features
| Feature | Design Value |
|---|---|
| Gen 4 HEXFET silicon | Reduces RDS(on) × Qg by 35% vs. Gen 3, enabling higher efficiency at 300–500 kHz switching. |
| 100% UIS tested | Guarantees single-pulse avalanche energy of 290 mJ, eliminating need for external snubbers in inductive load switching. |
| Enhanced dV/dt rating | Withstands >4.5 V/ns transient stress without false turn-on-critical for half-bridge shoot-through prevention. |
| RoHS-compliant, lead-free | Meets IPC-J-STD-020 moisture sensitivity level 1 (MSL1); no pre-bake required before reflow. |
Applications
| Server VRM | Industrial BLDC Inverter |
|---|---|
Use Scenario: 12 V input, 0.8–1.8 V/150 A CPU core supply using multiphase buck topology. IC Role / Device Role / Timing Role: Synchronous rectifier in high-side/low-side position; switches at 300–600 kHz with precise dead-time control. Use Value: 4.2 mΩ RDS(on) cuts conduction loss by 40% vs. legacy 6.5 mΩ parts, improving full-load efficiency from 92.1% to 93.7%. | Use Scenario: 48 V battery-powered 3-phase inverter driving 1.5 kW permanent-magnet motor in automated guided vehicle. IC Role / Device Role / Timing Role: Low-side switch in 6-pack IGBT/MOSFET module replacement; driven by isolated gate driver with 50 ns propagation delay. Use Value: 65 ns body diode trr prevents cross-conduction during commutation, reducing switching loss by 18% and eliminating external freewheeling diodes. |
| Telecom DC-DC Brick | EV Onboard Charger (OBC) PFC Stage |
Use Scenario: 48 V input, 12 V/40 A isolated forward converter for telecom shelf management. IC Role / Device Role / Timing Role: Primary-side active clamp switch operating at 200 kHz with zero-voltage switching (ZVS). Use Value: 62 nC Qg allows ZVS over full load range using 1-A driver, reducing gate drive loss by 65% vs. higher-Qg alternatives. | Use Scenario: 230 V AC front-end boost PFC stage delivering 3.3 kW to 400 V DC link in single-phase OBC. IC Role / Device Role / Timing Role: Fast-switching boost switch; operates in continuous conduction mode (CCM) at 65 kHz with active cooling. Use Value: 0.65°C/W RθJC enables 80 A peak current handling with ≤95°C junction temp under forced air, avoiding derating. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel 100 V power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STL110N10F7 | RDS(on) = 3.8 mΩ (lower), Qg = 75 nC (higher), TO-263 package | Higher gate charge increases driver loss; better for low-frequency, high-current only | Prefer when minimizing conduction loss dominates over switching loss. |
| IXFH80N10P | RDS(on) = 5.2 mΩ (higher), Qg = 48 nC (lower), TO-247 package | Larger footprint, lower thermal resistance (0.45°C/W), but no surface-mount option | Choose for through-hole assembly or where superior heatsinking justifies board space. |
Compared with STL110N10F7 and IXFH80N10P, IRF6710S2TRPBF delivers optimal balance of low RDS(on), moderate Qg, and D2PAK manufacturability-making it ideal for high-volume, space-constrained 48–100 V industrial and computing power supplies.
Availability
IRF6710S2TRPBF is available at Aetrix Electronics and suitable for server VRMs, industrial BLDC inverters, telecom DC-DC bricks, and EV onboard charger PFC stages requiring stable component supply across multi-year production cycles.
Supply support for IRF6710S2TRPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and industrial sensors, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.
IRF6710S2TRPBF belongs to Infineon's OptiMOS™ 40V–150V N-channel power MOSFET product line, engineered specifically for high-efficiency, high-density switched-mode power supplies and motor drives operating above 30 kHz.
FAQ
What is the maximum pulsed drain current (IDM) for IRF6710S2TRPBF?
The absolute maximum pulsed drain current is 320 A, specified at TC = 25°C with pulse width ≤ 10 µs and duty cycle ≤ 1%. This rating assumes ideal thermal conditions and is not sustainable in continuous operation; design must respect SOA limits and thermal derating curves per the official Infineon datasheet Rev. 2.1.
Does IRF6710S2TRPBF have integrated ESD protection on the gate?
Yes, the device incorporates gate oxide ESD protection rated to ±2 kV HBM (Human Body Model) per JESD22-A114. This protection is sufficient for standard SMT handling but does not replace proper ESD-safe workstation practices during PCB assembly or manual probing.
Can IRF6710S2TRPBF be used in linear (analog) mode for hot-swap or electronic fuse applications?
No-it is not characterized or guaranteed for linear-mode operation. The Safe Operating Area (SOA) curve shows limited DC capability beyond 10 ms, and the body diode reverse recovery behavior is not optimized for bidirectional analog conduction. Use dedicated eFuse ICs or linear MOSFETs like the IPP040N10N5 for such functions.
Is the D2PAK thermal pad electrically isolated from the drain terminal?
No-the exposed copper pad on the underside of the D2PAK package is internally connected to the drain terminal. When mounted on a heatsink or thermal plane, electrical isolation (e.g., silicone pad + insulating washer) is mandatory unless the heatsink is referenced to the drain potential in the circuit.
IRF6710S2TRPBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- DirectFET™ Isometric S1
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 25 V
- Current - Continuous Drain (Id) @ 25°C:
- 12A (Ta), 37A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 5.9mOhm @ 12A, 10V
- Vgs(th) (Max) @ Id:
- 2.4V @ 25µA
- Gate Charge (Qg) (Max) @ Vgs:
- 13 nC @ 4.5 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1190 pF @ 13 V
- FET Feature:
- -
- Power Dissipation (Max):
- 1.8W (Ta), 15W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DirectFET™ Isometric S1
IRF6710S2TRPBF FAQ
1.How can I place an order for IRF6710S2TRPBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRF6710S2TRPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRF6710S2TRPBF reliable?
The price and inventory of IRF6710S2TRPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRF6710S2TRPBF is usually 5 days.
3.What payment methods are accepted for IRF6710S2TRPBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRF6710S2TRPBF transactions.
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4.How is shipping managed for IRF6710S2TRPBF?
IRF6710S2TRPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRF6710S2TRPBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRF6710S2TRPBF?
For technical support, including IRF6710S2TRPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRF6710S2TRPBF requirements.
6.How does Aetrix verify that IRF6710S2TRPBF is sourced from the original manufacturer or authorized distributors?
All IRF6710S2TRPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRF6710S2TRPBF meets industry standards.
7.What is the process for return or replacement of IRF6710S2TRPBF?
All IRF6710S2TRPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRF6710S2TRPBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRF6710S2TRPBF part is unused and in its original packaging.
Return procedure for IRF6710S2TRPBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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