Infineon Technologies IRF6714MTR1PBF
- Part No.:
- IRF6714MTR1PBF
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- DirectFET™ Isometric MX
- Datasheet:
-
IRF6714MTR1PBF.pdf
- Description:
- MOSFET N-CH 25V 29A DIRECTFET
- Quantity:
- Payment:

- Shipping:

Inventory:6,590
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Product details
Overview
IRF6714MTR1PBF from Infineon Technologies is a 25 V, 29 A N-channel DirectFET™ Power MOSFET optimized for synchronous buck converter high-side and low-side switching in CPU core DC-DC converters. It delivers 1.6 mΩ RDS(on) @ 10 V, 29 nC total gate charge, and ultra-low package inductance in a 0.6 mm profile surface-mount package with dual-sided cooling capability.
For engineers reviewing the IRF6714MTR1PBF datasheet, IRF6714MTR1PBF pinout, IRF6714MTR1PBF application, or IRF6714MTR1PBF equivalent, key selection criteria include Cdv/dt immunity for synchronous FET operation, thermal resistance (RθJC = 1.4 °C/W), conduction loss at 4.5 V gate drive, and compatibility with vapor-phase and convection reflow soldering per AN-1035.
Technical Context
This MOSFET employs HEXFET® silicon on a DirectFET™ copper substrate to achieve simultaneous low RDS(on) (1.6 mΩ typ. @ 10 V) and low Qg (29 nC), enabling high-frequency switching with minimized conduction and switching losses. Its gate threshold voltage (1.9 V typ.) and negative temperature coefficient of VGS(th) (−6.5 mV/°C) support stable parallel operation.
The device integrates a robust body diode with 36 nC reverse recovery charge (Qrr) and 26 ns trr, rated for unclamped inductive switching up to 234 A pulsed drain current and 800 mJ single-pulse avalanche energy. Its 490 pF Crss and 1.2 Ω gate resistance further optimize dv/dt immunity and gate drive efficiency.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 25 V - Maximum blocking voltage for 12 V input rail applications with margin |
| RDS(on) @ 10 V | 1.6 mΩ - Enables <1 W conduction loss at 25 A continuous drain current |
| Qg total | 29 nC - Reduces gate driver power demand and switching transition time |
| Ciss | 3890 pF - Low input capacitance supports fast turn-on with minimal Miller effect |
| RθJC | 1.4 °C/W - Enables efficient heat extraction via top-side (Drain) and PCB-side cooling |
| VGS(th) | 1.9 V - Ensures reliable enhancement-mode turn-on with standard 3.3 V or 5 V logic-level drivers |
| Qrr | 36 nC - Limits body diode recovery loss during hard-switched synchronous rectification |
Pinout & Package
DirectFET™ package (outline SQ/SX per IRF documentation): ultra-low-profile (0.6 mm max), copper-can construction with exposed Drain on top and bottom surfaces; no traditional leadframe; terminals accessed via top-side Gate and Source pads and bottom-side Drain pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Top Pad (G) | Gate | Control terminal; connects to gate driver output; requires low-inductance routing due to 29 nC Qg |
| Top Pad (S) | Source | Reference node for gate drive; tied to power ground plane; carries full load current |
| Bottom Pad (D) | Drain | High-current power path; thermally coupled to both PCB and heatsink; serves as primary heat sink interface |
Key Features
| Feature | Design Value |
|---|---|
| Dual-sided cooling | Thermal resistance reduced by 80% vs. SO-8; enables >2× power density in space-constrained CPU VRMs |
| Cdv/dt immunity | Optimized layout and gate structure suppress false turn-on in high-dv/dt synchronous buck nodes |
| Ultra-low package inductance | Minimizes voltage overshoot and ringing during 100+ A/ns switching transitions |
| RoHS & halogen-free | Complies with IPC-J-STD-020 moisture sensitivity level 1 (MSL1); suitable for lead-free reflow |
| 100% Rg tested | Ensures consistent gate resistance (1.2–2.2 Ω) for predictable switching timing across production lots |
Applications
| CPU Core Voltage Regulator | GPU Power Delivery |
|---|---|
Use Scenario: High-efficiency 1–2 V, 100+ A DC-DC conversion for modern x86 and ARM processors. IC Role / Device Role / Timing Role: Low-side synchronous FET in multiphase buck converter; switched at 300–1000 kHz. Use Value: 1.6 mΩ RDS(on) and 29 nC Qg reduce combined conduction + switching loss below 2.5 W per phase at 25 A. | Use Scenario: Compact, high-density VRM for discrete and integrated GPUs requiring rapid transient response. IC Role / Device Role / Timing Role: High-side switch in interleaved buck stage; driven by dedicated gate controller. Use Value: Dual-sided cooling maintains TJ < 105°C under 70°C ambient with 15 A continuous load and 100 kHz switching. |
| Server Memory Regulator | AI Accelerator Power Stage |
Use Scenario: Point-of-load regulation for DDR5 memory modules with tight voltage tolerance (±3%) and fast load steps. IC Role / Device Role / Timing Role: Synchronous rectifier in 5 V input → 1.1 V output buck; operates with 4.5 V gate drive. Use Value: 2.6 mΩ RDS(on) @ 4.5 V ensures <1.7 W conduction loss at 23 A, critical for thermal management in DIMM slots. | Use Scenario: High-current power delivery to FPGA-based AI inference accelerators with dynamic power ranging 50–300 W. IC Role / Device Role / Timing Role: Bottom-side FET in 3-phase 48 V → 0.8 V buck converter; handles peak currents >200 A. Use Value: 800 mJ EAS rating and 234 A IDM support safe operation during sudden load transients without avalanche failure. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRF6662MTR1PBF | RDS(on) = 2.0 mΩ @ 10 V; Qg = 25 nC; same DirectFET SQ package | Slightly higher conduction loss but lower gate charge reduces driver stress in high-frequency designs | Prefer when gate drive capability is limited and switching frequency exceeds 1 MHz |
| SiR626DP-T1-GE3 | RDS(on) = 1.7 mΩ @ 10 V; Qg = 32 nC; PowerPAK® SO-8 package; RθJA = 45 °C/W | Higher thermal resistance limits power density; no dual-sided cooling | Select only if existing SO-8 layout must be retained and thermal headroom ≥15°C is available |
Compared with IRF6714MTR1PBF, IRF6662MTR1PBF trades 0.4 mΩ higher RDS(on) for 4 nC lower Qg, improving gate drive efficiency at cost of 2.5% higher conduction loss; SiR626DP-T1-GE3 offers similar RDS(on) but lacks dual-sided cooling and has 32× higher RθJA, limiting use to lower-power or forced-air-cooled systems.
Availability
IRF6714MTR1PBF is available at Aetrix Electronics and suitable for CPU core voltage regulators, GPU power delivery modules, and AI accelerator power stages requiring stable component supply, long-term lifecycle support, and traceable RoHS-compliant sourcing.
Supply support for IRF6714MTR1PBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs and discrete devices, with global manufacturing and quality certification to ISO/TS 16949 and IECQ QC 080000.
This part belongs to Infineon's DirectFET™ Power MOSFET product line, engineered specifically for high-frequency, high-efficiency DC-DC conversion in computing and data center power supplies where thermal density and switching loss are critical constraints.
FAQ
What is the maximum continuous drain current at 70°C ambient temperature?
The IRF6714MTR1PBF supports 175 A continuous drain current at TA = 70°C when mounted on a 1 in² copper board with dual-sided cooling and proper thermal interface. This rating assumes VGS = 10 V, TJ ≤ 150°C, and adherence to AN-1035 assembly guidelines for DirectFET™ packages.
Does this MOSFET require a negative gate voltage for reliable turn-off in synchronous buck applications?
No. The IRF6714MTR1PBF has a gate threshold voltage of 1.9 V (typ.) and is fully enhanced at 0 V gate-to-source bias. A 0 V turn-off is sufficient; applying −5 V is unnecessary and not recommended, as its gate oxide is rated only for ±20 V and negative bias adds no reliability benefit.
Can it be used as a high-side switch with bootstrap gate drive?
Yes. The device supports bootstrap gate drive in high-side configurations up to 25 V VDS. Its 1.2–2.2 Ω gate resistance and 29 nC Qg allow reliable switching at 500–1000 kHz with standard 12 V bootstrap supplies and 10 Ω gate resistors, provided dead-time exceeds 100 ns to prevent shoot-through.
Is the RDS(on) value specified at junction temperature or case temperature?
RDS(on) is characterized at TJ = 25°C and 125°C, with typical values of 1.6 mΩ and 2.6 mΩ respectively at VGS = 10 V. The datasheet provides normalized curves (Fig. 7) showing RDS(on) increases linearly with junction temperature, enabling accurate loss calculation across the full −40°C to +150°C operating range.
IRF6714MTR1PBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- DirectFET™ Isometric MX
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 25 V
- Current - Continuous Drain (Id) @ 25°C:
- 29A (Ta), 166A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 2.1mOhm @ 29A, 10V
- Vgs(th) (Max) @ Id:
- 2.4V @ 100µA
- Gate Charge (Qg) (Max) @ Vgs:
- 44 nC @ 4.5 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 3890 pF @ 13 V
- FET Feature:
- -
- Power Dissipation (Max):
- 2.8W (Ta), 89W (Tc)
- Operating Temperature:
- -40°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DIRECTFET™ MX
IRF6714MTR1PBF FAQ
1.How can I place an order for IRF6714MTR1PBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRF6714MTR1PBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRF6714MTR1PBF reliable?
The price and inventory of IRF6714MTR1PBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRF6714MTR1PBF is usually 5 days.
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Once your IRF6714MTR1PBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRF6714MTR1PBF?
For technical support, including IRF6714MTR1PBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRF6714MTR1PBF requirements.
6.How does Aetrix verify that IRF6714MTR1PBF is sourced from the original manufacturer or authorized distributors?
All IRF6714MTR1PBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRF6714MTR1PBF meets industry standards.
7.What is the process for return or replacement of IRF6714MTR1PBF?
All IRF6714MTR1PBF units undergo pre-shipment inspection (PSI). If there is an issue with IRF6714MTR1PBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRF6714MTR1PBF part is unused and in its original packaging.
Return procedure for IRF6714MTR1PBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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