Infineon Technologies IRF7240PBF
- Part No.:
- IRF7240PBF
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
IRF7240PBF.pdf
- Description:
- MOSFET P-CH 40V 10.5A 8SO
- Quantity:
- Payment:

- Shipping:

Inventory:2,721
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IRF7240PBF from International Rectifier is a P-Channel enhancement-mode HEXFET Power MOSFET in SO-8 package, rated for -40 V VDSS, 0.015 Ω RDS(on) at VGS = -10 V, and -10.5 A continuous drain current at 25°C. It integrates a low-loss body diode (VSD = -1.2 V @ -2.5 A) and supports high-efficiency battery disconnect and load switching in portable power systems.
For engineers reviewing the IRF7240PBF datasheet, IRF7240PBF pinout, IRF7240PBF application, or IRF7240PBF equivalent, key selection criteria include verified RDS(on) temperature stability, SO-8 thermal resistance (50°C/W), gate charge profile (Qg = 73 nC typ), and body diode reverse recovery performance (trr = 43 ns).
Technical Context
This device operates as a single N-channel depletion-free P-MOSFET with voltage-controlled conduction, designed for low-side switching in DC-DC converters, battery protection circuits, and hot-swap controllers. Its gate threshold voltage range (-1.0 to -3.0 V) enables reliable turn-on with standard logic-level drive, while the 17 S forward transconductance ensures fast switching response under load.
The SO-8 package features a customized leadframe for enhanced thermal dissipation and multi-die compatibility, supporting board-space-constrained designs. Electrical behavior is characterized across junction temperatures from -55°C to +150°C, with normalized RDS(on) drift of ≤2.0× over full range and breakdown voltage temperature coefficient of -0.025 V/°C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | -40 V - Maximum blocking voltage before avalanche; defines safe operating range in 24 V and 36 V battery systems. |
| RDS(on) max | 0.015 Ω @ VGS = -10 V - Enables <150 mW conduction loss at 10 A, critical for thermally constrained PCB layouts. |
| ID cont | -10.5 A @ TA = 25°C - Supports high-current load switching without external heatsinking on standard FR4. |
| Qg | 73 nC typ - Determines gate driver power requirement and switching speed in PWM applications. |
| trr | 43 ns typ - Limits body diode reverse recovery losses during synchronous rectification or bidirectional switching. |
| RθJA | 50 °C/W - Thermal resistance from junction to ambient on 1-in² copper pad; sets maximum power derating slope (20 mW/°C). |
| VGS(th) | -1.0 to -3.0 V - Ensures robust turn-on with 3.3 V or 5 V logic-level gate drivers without level-shifting. |
Pinout & Package
IRF7240PBF uses the JEDEC MS-012AA-compliant SO-8 surface-mount package with exposed drain pads on pins 1–3 and 5–7, gate on pin 4, and source on pins 6 and 8. The leadframe design improves thermal transfer and supports multiple die configurations.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 5, 7 | Drain (D) | High-current output node; electrically tied internally; requires thermal pad connection to PCB ground plane. |
| 4 | Gate (G) | Control input; sensitive to ESD; requires series resistor (≤10 Ω) to limit ringing and gate charge current. |
| 6, 8 | Source (S) | Return path for load current; connects to system ground or negative rail; forms cathode of integrated body diode. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low RDS(on) | 0.015 Ω at -10 V gate drive reduces I²R losses by >40% vs. legacy P-MOSFETs in 12 V load switches. |
| Optimized SO-8 thermal design | Custom leadframe lowers RθJA to 50°C/W-enables 2.5 W continuous dissipation without forced air. |
| Fast body diode recovery | trr = 43 ns minimizes shoot-through risk and switching loss in half-bridge or OR-ing configurations. |
| Lead-free and RoHS-compliant | e1 marking confirms Pb-free terminations and halogen-free molding compound per JEDEC J-STD-020. |
Applications
| Battery Protection Circuit | Hot-Swap Controller |
|---|---|
Use Scenario: Preventing reverse current flow and over-discharge in dual-battery backup systems for industrial IoT gateways. IC Role / Device Role / Timing Role: Low-side P-MOSFET switch controlling battery isolation; activated only when main supply fails. Use Value: 0.015 Ω RDS(on) limits voltage drop to <150 mV at 10 A, preserving runtime and enabling precise voltage monitoring. | Use Scenario: Safe insertion/removal of pluggable modules in telecom line cards without disrupting backplane power. IC Role / Device Role / Timing Role: Inrush current limiter and fault-isolation switch placed between input bus and module load. Use Value: Fast trr (43 ns) and low Qg (73 nC) allow microsecond-scale fault response and minimal energy dissipation during transient events. |
| DC-DC Converter Synchronous Rectifier | Load Switch for Portable Medical Devices |
Use Scenario: Secondary-side rectification in isolated 24 V → 5 V flyback converters powering patient monitors. IC Role / Device Role / Timing Role: Synchronous rectifier replacing Schottky diode; driven complementary to primary-side MOSFET. Use Value: Body diode VSD = -1.2 V at -2.5 A reduces conduction loss by 35% vs. 0.45 V Schottky, improving efficiency above 85% at full load. | Use Scenario: Controlled power-up of ultrasound transducer arrays requiring sequential activation to avoid surge currents. IC Role / Device Role / Timing Role: High-side load switch (with external level shifter) enabling precise enable timing and soft-start control. Use Value: Gate threshold (-1.0 to -3.0 V) allows direct interface with 3.3 V microcontroller GPIO, eliminating discrete bias networks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar P-Channel load switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Si7157DP-T1-GE3 | RDS(on) = 0.012 Ω @ -10 V; higher Qg (95 nC); SO-8 with different pinout (G/S/D layout differs). | Requires PCB redesign due to non-identical pin mapping; better RDS(on) but slower switching. | Choose only if lower conduction loss outweighs gate drive complexity and layout change cost. |
| DMG2305UVT-7 | RDS(on) = 0.045 Ω @ -4.5 V; smaller 1.6 mm × 1.6 mm package; no thermal pad. | Limited to ≤3 A continuous loads; unsuitable for high-power battery management without derating. | Select for space-constrained, low-current applications where thermal performance is secondary to footprint size. |
Compared with Si7157DP-T1-GE3 and DMG2305UVT-7, IRF7240PBF delivers optimal balance of low RDS(on), proven SO-8 thermal reliability, and gate drive compatibility with 3.3 V/5 V controllers-making it preferred for industrial-grade battery and load management designs.
Availability
IRF7240PBF is available at Aetrix Electronics and suitable for battery protection circuits, hot-swap controllers, and DC-DC synchronous rectifiers requiring stable component supply and long-term manufacturing continuity.
Supply support for IRF7240PBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
International Rectifier (now part of Infineon Technologies) specialized in high-performance power semiconductors, with leadership in MOSFET, IGBT, and driver IC technologies for industrial, automotive, and computing markets.
The HEXFET® product line was engineered specifically for high-efficiency power conversion and robust load switching, emphasizing ultra-low on-resistance, fast switching, and rugged thermal packaging for demanding embedded power applications.
FAQ
What is the maximum safe operating voltage for IRF7240PBF?
The absolute maximum drain-to-source voltage (VDSS) is -40 V. Operation beyond this rating risks avalanche breakdown and permanent damage. Derating is recommended for reliability in noisy environments-designers should maintain ≥20% margin (i.e., ≤-32 V) in 24 V systems with transient spikes.
Can IRF7240PBF be used in high-frequency PWM applications?
Yes-its 73 nC total gate charge and 490 ns rise time support operation up to 500 kHz in hard-switched topologies. However, switching losses increase above 200 kHz; for >1 MHz designs, consider devices with lower Qg and optimized Crss/Ciss ratios.
Does IRF7240PBF require a gate resistor?
A series gate resistor (4.7–10 Ω) is strongly recommended to dampen parasitic oscillation, limit peak gate current during fast transitions, and reduce EMI. Omitting it may cause erratic switching or gate oxide stress under high dV/dt conditions.
Is the body diode suitable for continuous conduction mode?
The integrated body diode supports continuous conduction in OR-ing and reverse-polarity protection, but its 1.2 V forward drop and 75 nC reverse recovery charge make it less efficient than external Schottky diodes above 2 A. Use only where simplicity outweighs efficiency loss.
IRF7240PBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tube
- Product Status:
- Discontinued at Digi-Key
- FET Type:
- P-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 40 V
- Current - Continuous Drain (Id) @ 25°C:
- 10.5A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 15mOhm @ 10.5A, 10V
- Vgs(th) (Max) @ Id:
- 3V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 110 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 9250 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 2.5W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SO
IRF7240PBF FAQ
1.How can I place an order for IRF7240PBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRF7240PBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRF7240PBF reliable?
The price and inventory of IRF7240PBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRF7240PBF is usually 5 days.
3.What payment methods are accepted for IRF7240PBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRF7240PBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRF7240PBF?
IRF7240PBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRF7240PBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRF7240PBF?
For technical support, including IRF7240PBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRF7240PBF requirements.
6.How does Aetrix verify that IRF7240PBF is sourced from the original manufacturer or authorized distributors?
All IRF7240PBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRF7240PBF meets industry standards.
7.What is the process for return or replacement of IRF7240PBF?
All IRF7240PBF units undergo pre-shipment inspection (PSI). If there is an issue with IRF7240PBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRF7240PBF part is unused and in its original packaging.
Return procedure for IRF7240PBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IRF7240PBF Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

