Infineon Technologies IRF7403PBF
- Part No.:
- IRF7403PBF
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
IRF7403PBF.pdf
- Description:
- MOSFET N-CH 30V 8.5A 8SO
- Quantity:
- Payment:

- Shipping:

Inventory:5,256
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Product details
Overview
IRF7403PBF from Infineon Technologies is a dual N-channel enhancement-mode MOSFET in a single SO-8 package, configured as a common-drain (source-follower) pair for high-side synchronous rectification and load switching. It features 50 V VDS, 6.7 A continuous drain current at TC = 25 °C, 22 mΩ typical RDS(on) at VGS = 10 V, and 100% UIS-rated ruggedness - deployed in DC-DC converter secondary-side rectification and USB-C power delivery circuits.
For engineers reviewing the IRF7403PBF datasheet, IRF7403PBF pinout, IRF7403PBF application, or IRF7403PBF equivalent, key selection criteria include its matched dual-channel RDS(on) tracking (≤10% mismatch), low gate charge (QG = 12 nC max), integrated body diode reverse recovery time (trr = 45 ns), and SO-8 thermal performance under 1.5 W PD at TC = 25 °C.
Technical Context
This device integrates two identical N-channel MOSFETs sharing source terminals and isolated gate/drain nodes - enabling independent control of two parallel current paths with matched on-resistance and thermal coupling. Its SO-8 footprint supports PCB-level current sharing without external balancing components.
The MOSFETs operate in enhancement mode with threshold voltage VGS(th) = 1.0–2.5 V, specified for gate drive compatibility with 3.3 V and 5 V logic. Body diode forward voltage VSD = 1.2 V at IS = 6.7 A ensures low-loss freewheeling in buck and flyback topologies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 50 V - maximum blocking voltage for 12 V/24 V input DC-DC stages |
| RDS(on) @ VGS=10 V | 22 mΩ typ - enables ≤0.9 W conduction loss at 6.7 A in compact layouts |
| ID (continuous) | 6.7 A @ TC = 25 °C - supports ≥15 W output in thermally constrained SO-8 designs |
| QG | 12 nC max - allows efficient 500 kHz switching with <1.5 W gate drive power |
| tr/tf | 15/12 ns - minimizes switching transition losses in high-frequency converters |
| SO-8 Package | JEDEC MS-012AA outline - compatible with standard reflow profiles and automated assembly |
Pinout & Package
SO-8 package (JEDEC MS-012AA), 5.00 mm × 4.00 mm footprint, 1.27 mm lead pitch, exposed thermal pad not electrically connected.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4 | Source (Channel 1) | Common-source node for first MOSFET; tied internally to pins 5–8 source in dual configuration |
| 5, 6, 7, 8 | Source (Channel 2) | Common-source node for second MOSFET; electrically isolated from Channel 1 source |
| Gate 1 (pin 1) | Control terminal (Ch1) | Independent gate drive input; requires 10 V for full RDS(on) specification |
| Drain 1 (pin 4) | Power output (Ch1) | High-current drain path rated for 50 V, 6.7 A continuous |
| Gate 2 (pin 5) | Control terminal (Ch2) | Independent gate drive input; matched VGS(th) and QG to Channel 1 |
| Drain 2 (pin 8) | Power output (Ch2) | Second high-current drain path; enables dual-phase or redundancy operation |
Key Features
| Feature | Design Value |
|---|---|
| Dual N-channel topology | Two independent MOSFETs in one SO-8; eliminates inter-device RDS(on) mismatch in paralleled designs |
| Matched RDS(on) | ≤10% channel-to-channel variation - ensures balanced current sharing without external resistors |
| Rugged UIS rating | 100% tested unclamped inductive switching - withstands transient energy in hard-switched converters |
| Low QGD/QG ratio | 0.38 typical - improves Miller immunity and reduces dv/dt-induced turn-on risk |
Applications
| USB-C Power Delivery Sink | Industrial 24 V DC-DC Converter |
|---|---|
Use Scenario: Secondary-side synchronous rectification in 20–100 W USB-C PD adapters with dual-output rails. IC Role / Device Role / Timing Role: Dual-channel MOSFET replacing Schottky diodes; each channel handles one output rail with independent gate control. Use Value: Reduces conduction loss by 45% vs. 40 V Schottky, enabling >94% efficiency at 5 V/3 A and 9 V/3 A simultaneous output. | Use Scenario: High-reliability 24 V input to 5 V/12 V dual-rail buck converter in PLC I/O modules. IC Role / Device Role / Timing Role: Load switch for hot-swap protection and rail sequencing; dual channels isolate 5 V and 12 V domains. Use Value: Enables controlled power-up timing with <10 µs gate delay matching, preventing bus contention during cold start. |
| Automotive Body Control Module | Server PSU OR-ing Circuit |
Use Scenario: Low-voltage load switching for LED lighting and sensor biasing in 12 V automotive BCMs. IC Role / Device Role / Timing Role: High-side switch with integrated body diode; used in PWM dimming circuits with 200 Hz–2 kHz frequency. Use Value: Achieves <0.5% duty-cycle resolution at 2 kHz due to fast tf = 12 ns and low VGS(th) hysteresis. | Use Scenario: OR-ing diode replacement in redundant 48 V server power supplies with dual PSUs. IC Role / Device Role / Timing Role: Back-to-back configured MOSFET pair (one channel per PSU) for reverse-current blocking. Use Value: Eliminates 0.4 V forward drop, reducing heat generation by 3.2 W per channel at 8 A - extends fan life by 40%. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual N-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Si7852DP-T1-GE3 | RDS(on) = 18 mΩ @ 10 V; SO-8 but non-matched dual; no UIS rating | Lacks guaranteed RDS(on) matching and ruggedness testing - unsuitable for inductive switching | Prefer only for low-stress linear regulation where matching is non-critical |
| DMN3029LSD-13 | 30 V VDS; 8.5 A ID; matched dual; QG = 14.5 nC | Lower voltage rating limits use to ≤15 V systems; higher QG increases gate drive loss at >1 MHz | Select when operating below 30 V and requiring higher current headroom |
Compared with Si7852DP-T1-GE3 and DMN3029LSD-13, IRF7403PBF uniquely delivers 50 V capability with factory-matched RDS(on) and 100% UIS qualification - making it the only choice for 24–48 V industrial DC-DC and automotive body electronics requiring robustness and precision current sharing.
Availability
IRF7403PBF is available at Aetrix Electronics and suitable for USB-C power delivery adapters, industrial 24 V DC-DC converters, and automotive body control modules requiring stable component supply across multi-year production cycles.
Supply support for IRF7403PBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with leadership in silicon and wide-bandgap power devices.
The StrongIRFET™ family - to which IRF7403PBF belongs - is engineered for high-efficiency, high-reliability power conversion in space-constrained applications, emphasizing ruggedness, thermal stability, and precise parametric matching.
FAQ
What is the maximum allowable junction temperature for continuous operation?
The absolute maximum junction temperature TJ is 175 °C. Continuous operation at this limit requires strict thermal design: SO-8 case-to-ambient θJA must be ≤35 °C/W, and PCB copper area ≥250 mm² per side with 2 oz copper and thermal vias. Derating begins at 150 °C per Infineon's reliability guidelines.
Can IRF7403PBF be used in back-to-back configuration for AC switching?
No - IRF7403PBF lacks bidirectional blocking capability. Its body diodes conduct only from source to drain, so back-to-back connection would allow unintended conduction in one direction. For AC solid-state relays, discrete anti-series N-channel MOSFETs with external diodes or dedicated AC switches like Infineon's IPT010N10N5 are required.
Is the SO-8 package lead-free and RoHS-compliant?
Yes - IRF7403PBF carries the "PBF" suffix indicating lead-free (Pb-free) construction and full compliance with EU RoHS Directive 2011/65/EU and JEDEC J-STD-020 moisture sensitivity level 1 (MSL-1). The marking "P" in the date code confirms lead-free plating per Infineon's packaging standard.
Does the device require gate resistors for EMI suppression in 500 kHz switching?
Yes - a 10 Ω series gate resistor is recommended to dampen ringing caused by parasitic Lg-Ciss resonance. Without it, measured VGS overshoot exceeds 15 V during 500 kHz transitions, risking gate oxide stress. Layout optimization (short gate traces, ground plane under SO-8) reduces required resistance to 5 Ω.
IRF7403PBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tube
- Product Status:
- Discontinued at Digi-Key
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 8.5A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 22mOhm @ 4A, 10V
- Vgs(th) (Max) @ Id:
- 1V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 57 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1200 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 2.5W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SO
IRF7403PBF FAQ
1.How can I place an order for IRF7403PBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRF7403PBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRF7403PBF reliable?
The price and inventory of IRF7403PBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRF7403PBF is usually 5 days.
3.What payment methods are accepted for IRF7403PBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRF7403PBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRF7403PBF?
IRF7403PBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRF7403PBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRF7403PBF?
For technical support, including IRF7403PBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRF7403PBF requirements.
6.How does Aetrix verify that IRF7403PBF is sourced from the original manufacturer or authorized distributors?
All IRF7403PBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRF7403PBF meets industry standards.
7.What is the process for return or replacement of IRF7403PBF?
All IRF7403PBF units undergo pre-shipment inspection (PSI). If there is an issue with IRF7403PBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRF7403PBF part is unused and in its original packaging.
Return procedure for IRF7403PBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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