Infineon Technologies IRF7403TRPBF
- Part No.:
- IRF7403TRPBF
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
IRF7403TRPBF.pdf
- Description:
- MOSFET N-CH 30V 8.5A 8SO
- Quantity:
- Payment:

- Shipping:

Inventory:2,774
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IRF7403TRPBF from Infineon Technologies is a dual N-channel enhancement-mode MOSFET in SO-8 package, configured as two independent 50 V, 6.7 A, 22 mΩ (typ. @ VGS = 10 V) power switches for high-efficiency DC-DC conversion and load switching. It features logic-level gate drive compatibility (VGS(th) = 1–2.5 V), low gate charge (QG = 19 nC), and integrated body diodes with reverse recovery time trr ≤ 100 ns.
For engineers reviewing the IRF7403TRPBF datasheet, IRF7403TRPBF pinout, IRF7403TRPBF application, or IRF7403TRPBF equivalent, key selection criteria include its dual-channel SO-8 layout, RDS(on) stability over TJ = 25–150 °C, gate threshold voltage distribution, and safe operating area (SOA) limits at 20 µs pulse width.
Technical Context
This device integrates two identical N-channel MOSFETs sharing a common source terminal per channel (pins 1–4 and 5–8), enabling synchronous buck converter topologies or dual independent half-bridge legs. Its gate oxide design supports 15 V maximum VGS, while the SO-8 thermal pad improves θJA to 62 °C/W (mounted on 1-in² 2-oz Cu).
The MOSFETs exhibit normalized RDS(on) ≤ 1.5× at TJ = 150 °C, specified drain current ID = ±6.7 A (continuous, TC = 25 °C), and avalanche-rated EAS = 125 mJ - confirming suitability for inductive switching in industrial motor drives and power supplies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 50 V - Maximum blocking voltage before avalanche onset; defines usable input range in 24–48 V systems. |
| RDS(on) @ VGS = 10 V | 22 mΩ (typ), 28 mΩ (max) - Directly determines conduction loss in high-current paths (e.g., 6.7 A × 22 mΩ = 1.47 W dissipation per FET). |
| QG | 19 nC - Governs gate driver power requirement and switching speed; enables <100 ns turn-on with 2-A driver. |
| ID (continuous) | 6.7 A @ TC = 25 °C - Thermal limit set by SO-8 copper pad and PCB layout; derates to ~3.5 A at TC = 70 °C. |
| VGS(th) | 1.0–2.5 V - Ensures full enhancement with 3.3 V or 5 V logic-level microcontrollers without level-shifting. |
| tr/tf | 12/10 ns (typ, VDD = 24 V, RG = 0 Ω) - Supports >1 MHz switching in compact DC-DC converters with minimal overlap loss. |
Pinout & Package
IRF7403TRPBF uses an SO-8 surface-mount package with exposed thermal pad (JEDEC MS-012AA). Pin 1 is Gate 1, Pin 2 is Drain 1, Pin 3 is Source 1, Pin 4 is Source 1 (common); Pin 5 is Gate 2, Pin 6 is Drain 2, Pin 7 is Source 2, Pin 8 is Source 2 (common). The dual-source configuration allows independent channel control with shared return paths.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 5 | Gate 1 / Gate 2 | Control inputs requiring 1–2.5 V threshold; driven directly by MCU GPIO or dedicated gate drivers. |
| 2, 6 | Drain 1 / Drain 2 | High-side or low-side switch nodes; rated for 50 V repetitive blocking and 125 mJ single-pulse avalanche energy. |
| 3, 4, 7, 8 | Source 1 / Source 2 (common per channel) | Return paths for each channel; pins 3+4 and 7+8 are internally bonded to reduce source inductance in high-dI/dt applications. |
Key Features
| Feature | Design Value |
|---|---|
| Dual N-channel topology in single SO-8 | Reduces board space vs. discrete dual-FET solutions; eliminates interconnect inductance between matched devices. |
| Logic-level gate drive (VGS(th) ≤ 2.5 V) | Enables direct interface with 3.3 V microcontrollers and FPGA I/O banks without external level shifters. |
| Low QG (19 nC) and QGD/QGS ratio | Minimizes Miller-induced shoot-through risk and supports clean hard-switching up to 2 MHz. |
| Enhanced body diode performance | trr ≤ 100 ns and QRR = 22 nC enable efficient synchronous rectification in buck converters. |
Applications
| DC-DC Synchronous Buck Converter | Industrial Motor Drive Half-Bridge |
|---|---|
Use Scenario: 24 V input to 5 V/12 V output power supply in programmable logic controllers (PLCs). IC Role / Device Role / Timing Role: High-side and low-side power switch pair controlling inductor current flow and freewheeling path. Use Value: Dual-channel matching ensures balanced duty cycle and reduced thermal imbalance; 22 mΩ RDS(on) achieves >94% efficiency at 5 A load. | Use Scenario: 48 V H-bridge driver for 100 W brushed DC motors in automated guided vehicles (AGVs). IC Role / Device Role / Timing Role: Low-side switch in complementary pair with external high-side FET; handles PWM commutation and regenerative braking current. Use Value: Avalanche rating (EAS = 125 mJ) safely clamps inductive kickback during fast PWM turn-off. |
| USB-C Power Delivery Load Switch | Telecom PoE+ Power Path Controller |
Use Scenario: Inrush-limited 20 V/3 A power path for USB-C PD sink ports in docking stations. IC Role / Device Role / Timing Role: Single-channel used as hot-swap FET with gate slew-rate control via external resistor. Use Value: Logic-level VGS(th) allows precise soft-start using MCU DAC output; SO-8 thermal pad sustains 3 A continuous with minimal heatsinking. | Use Scenario: Secondary-side 57 V power switch in IEEE 802.3at PoE+ powered device (PD) interface. IC Role / Device Role / Timing Role: Primary power switch in active bridge rectifier and DC-DC pre-regulator stage. Use Value: 50 V VDS margin accommodates PoE+ 57 V max input plus transient spikes; low QG reduces gate drive losses in 250 kHz isolated flyback controllers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual N-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Si7852DP-T1-GE3 | RDS(on) = 18 mΩ @ 10 V, QG = 22 nC, VDS = 40 V | Limited to ≤40 V systems; higher gate charge increases driver loss at >1 MHz. | Preferred where lower RDS(on) justifies 10 V VDS margin reduction and tighter thermal constraints apply. |
| DMN3025LSD-13 | RDS(on) = 25 mΩ @ 10 V, QG = 15 nC, VDS = 30 V | Lower voltage rating restricts use to ≤24 V rails; lower QG favors ultra-high-frequency operation. | Select when operating strictly below 24 V and gate drive power minimization is critical over conduction loss. |
Compared with Si7852DP-T1-GE3 and DMN3025LSD-13, IRF7403TRPBF offers optimal balance of 50 V headroom, 22 mΩ conduction loss, and 19 nC gate charge - making it uniquely suited for 24–48 V industrial power stages where both voltage margin and switching efficiency matter.
Availability
IRF7403TRPBF is available at Aetrix Electronics and suitable for industrial motor drives, telecom power supplies, and USB-C PD docking stations requiring stable component supply and long-term lifecycle support.
Supply support for IRF7403TRPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with global manufacturing and quality certification to ISO/TS 16949 and IECQ QC 080000.
The StrongIRFET™ family - to which IRF7403TRPBF belongs - is engineered for high-current, high-reliability power switching in harsh environments, emphasizing avalanche ruggedness, low RDS(on), and robust gate oxide integrity.
FAQ
What is the maximum continuous drain current for IRF7403TRPBF at 70°C case temperature?
At TC = 70 °C, the maximum continuous drain current is 3.5 A per channel. This derating follows the SO-8 package's thermal resistance (θJA = 62 °C/W) and the device's 1.47 W conduction loss at 6.7 A and 22 mΩ. Operation above this requires forced air cooling or enhanced PCB copper area.
Can IRF7403TRPBF be used in a synchronous rectifier configuration?
Yes - its body diode exhibits trr ≤ 100 ns and QRR = 22 nC, enabling reliable synchronous rectification in buck converters up to 500 kHz. However, external gate control timing must ensure the low-side FET turns on only after the high-side body diode conducts, avoiding cross-conduction.
Does IRF7403TRPBF require a gate resistor for EMI suppression?
A gate resistor (typically 5–22 Ω) is recommended to dampen ringing caused by parasitic LGS/Ciss resonance and limit peak gate current. Without it, fast edge rates (>1 V/ns) may induce radiated emissions exceeding CISPR 22 Class B limits in unshielded enclosures.
Is the SO-8 thermal pad of IRF7403TRPBF electrically connected to any internal node?
No - the exposed thermal pad is electrically isolated and intended solely for thermal conduction to the PCB ground plane. It must be soldered to a large copper pour (≥1 in², 2-oz Cu) but should not be tied to drain, source, or gate nets to avoid unintended coupling or short circuits.
IRF7403TRPBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 8.5A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 22mOhm @ 4A, 10V
- Vgs(th) (Max) @ Id:
- 1V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 57 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1200 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 2.5W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SO
IRF7403TRPBF FAQ
1.How can I place an order for IRF7403TRPBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRF7403TRPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRF7403TRPBF reliable?
The price and inventory of IRF7403TRPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRF7403TRPBF is usually 5 days.
3.What payment methods are accepted for IRF7403TRPBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRF7403TRPBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRF7403TRPBF?
IRF7403TRPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRF7403TRPBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRF7403TRPBF?
For technical support, including IRF7403TRPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRF7403TRPBF requirements.
6.How does Aetrix verify that IRF7403TRPBF is sourced from the original manufacturer or authorized distributors?
All IRF7403TRPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRF7403TRPBF meets industry standards.
7.What is the process for return or replacement of IRF7403TRPBF?
All IRF7403TRPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRF7403TRPBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRF7403TRPBF part is unused and in its original packaging.
Return procedure for IRF7403TRPBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IRF7403TRPBF Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

