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Infineon Technologies IRF7403TRPBF

Part No.:
IRF7403TRPBF
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
8-SOIC (0.154", 3.90mm Width)
Datasheet:
AetrixIRF7403TRPBF.pdf
Description:
MOSFET N-CH 30V 8.5A 8SO
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,774

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Product details

Overview

IRF7403TRPBF from Infineon Technologies is a dual N-channel enhancement-mode MOSFET in SO-8 package, configured as two independent 50 V, 6.7 A, 22 mΩ (typ. @ VGS = 10 V) power switches for high-efficiency DC-DC conversion and load switching. It features logic-level gate drive compatibility (VGS(th) = 1–2.5 V), low gate charge (QG = 19 nC), and integrated body diodes with reverse recovery time trr ≤ 100 ns.

For engineers reviewing the IRF7403TRPBF datasheet, IRF7403TRPBF pinout, IRF7403TRPBF application, or IRF7403TRPBF equivalent, key selection criteria include its dual-channel SO-8 layout, RDS(on) stability over TJ = 25–150 °C, gate threshold voltage distribution, and safe operating area (SOA) limits at 20 µs pulse width.

Technical Context

This device integrates two identical N-channel MOSFETs sharing a common source terminal per channel (pins 1–4 and 5–8), enabling synchronous buck converter topologies or dual independent half-bridge legs. Its gate oxide design supports 15 V maximum VGS, while the SO-8 thermal pad improves θJA to 62 °C/W (mounted on 1-in² 2-oz Cu).

The MOSFETs exhibit normalized RDS(on) ≤ 1.5× at TJ = 150 °C, specified drain current ID = ±6.7 A (continuous, TC = 25 °C), and avalanche-rated EAS = 125 mJ - confirming suitability for inductive switching in industrial motor drives and power supplies.

Key Specifications

ParameterValue and Actual Design Meaning
VDS50 V - Maximum blocking voltage before avalanche onset; defines usable input range in 24–48 V systems.
RDS(on) @ VGS = 10 V22 mΩ (typ), 28 mΩ (max) - Directly determines conduction loss in high-current paths (e.g., 6.7 A × 22 mΩ = 1.47 W dissipation per FET).
QG19 nC - Governs gate driver power requirement and switching speed; enables <100 ns turn-on with 2-A driver.
ID (continuous)6.7 A @ TC = 25 °C - Thermal limit set by SO-8 copper pad and PCB layout; derates to ~3.5 A at TC = 70 °C.
VGS(th)1.0–2.5 V - Ensures full enhancement with 3.3 V or 5 V logic-level microcontrollers without level-shifting.
tr/tf12/10 ns (typ, VDD = 24 V, RG = 0 Ω) - Supports >1 MHz switching in compact DC-DC converters with minimal overlap loss.

Pinout & Package

IRF7403TRPBF uses an SO-8 surface-mount package with exposed thermal pad (JEDEC MS-012AA). Pin 1 is Gate 1, Pin 2 is Drain 1, Pin 3 is Source 1, Pin 4 is Source 1 (common); Pin 5 is Gate 2, Pin 6 is Drain 2, Pin 7 is Source 2, Pin 8 is Source 2 (common). The dual-source configuration allows independent channel control with shared return paths.

Pin/TerminalCircuit RoleDesign Meaning
1, 5Gate 1 / Gate 2Control inputs requiring 1–2.5 V threshold; driven directly by MCU GPIO or dedicated gate drivers.
2, 6Drain 1 / Drain 2High-side or low-side switch nodes; rated for 50 V repetitive blocking and 125 mJ single-pulse avalanche energy.
3, 4, 7, 8Source 1 / Source 2 (common per channel)Return paths for each channel; pins 3+4 and 7+8 are internally bonded to reduce source inductance in high-dI/dt applications.

Key Features

FeatureDesign Value
Dual N-channel topology in single SO-8Reduces board space vs. discrete dual-FET solutions; eliminates interconnect inductance between matched devices.
Logic-level gate drive (VGS(th) ≤ 2.5 V)Enables direct interface with 3.3 V microcontrollers and FPGA I/O banks without external level shifters.
Low QG (19 nC) and QGD/QGS ratioMinimizes Miller-induced shoot-through risk and supports clean hard-switching up to 2 MHz.
Enhanced body diode performancetrr ≤ 100 ns and QRR = 22 nC enable efficient synchronous rectification in buck converters.

Applications

DC-DC Synchronous Buck ConverterIndustrial Motor Drive Half-Bridge

Use Scenario: 24 V input to 5 V/12 V output power supply in programmable logic controllers (PLCs).

IC Role / Device Role / Timing Role: High-side and low-side power switch pair controlling inductor current flow and freewheeling path.

Use Value: Dual-channel matching ensures balanced duty cycle and reduced thermal imbalance; 22 mΩ RDS(on) achieves >94% efficiency at 5 A load.

Use Scenario: 48 V H-bridge driver for 100 W brushed DC motors in automated guided vehicles (AGVs).

IC Role / Device Role / Timing Role: Low-side switch in complementary pair with external high-side FET; handles PWM commutation and regenerative braking current.

Use Value: Avalanche rating (EAS = 125 mJ) safely clamps inductive kickback during fast PWM turn-off.

USB-C Power Delivery Load SwitchTelecom PoE+ Power Path Controller

Use Scenario: Inrush-limited 20 V/3 A power path for USB-C PD sink ports in docking stations.

IC Role / Device Role / Timing Role: Single-channel used as hot-swap FET with gate slew-rate control via external resistor.

Use Value: Logic-level VGS(th) allows precise soft-start using MCU DAC output; SO-8 thermal pad sustains 3 A continuous with minimal heatsinking.

Use Scenario: Secondary-side 57 V power switch in IEEE 802.3at PoE+ powered device (PD) interface.

IC Role / Device Role / Timing Role: Primary power switch in active bridge rectifier and DC-DC pre-regulator stage.

Use Value: 50 V VDS margin accommodates PoE+ 57 V max input plus transient spikes; low QG reduces gate drive losses in 250 kHz isolated flyback controllers.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual N-channel MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Si7852DP-T1-GE3RDS(on) = 18 mΩ @ 10 V, QG = 22 nC, VDS = 40 VLimited to ≤40 V systems; higher gate charge increases driver loss at >1 MHz.Preferred where lower RDS(on) justifies 10 V VDS margin reduction and tighter thermal constraints apply.
DMN3025LSD-13RDS(on) = 25 mΩ @ 10 V, QG = 15 nC, VDS = 30 VLower voltage rating restricts use to ≤24 V rails; lower QG favors ultra-high-frequency operation.Select when operating strictly below 24 V and gate drive power minimization is critical over conduction loss.

Compared with Si7852DP-T1-GE3 and DMN3025LSD-13, IRF7403TRPBF offers optimal balance of 50 V headroom, 22 mΩ conduction loss, and 19 nC gate charge - making it uniquely suited for 24–48 V industrial power stages where both voltage margin and switching efficiency matter.

Availability

IRF7403TRPBF is available at Aetrix Electronics and suitable for industrial motor drives, telecom power supplies, and USB-C PD docking stations requiring stable component supply and long-term lifecycle support.

Supply support for IRF7403TRPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with global manufacturing and quality certification to ISO/TS 16949 and IECQ QC 080000.

The StrongIRFET™ family - to which IRF7403TRPBF belongs - is engineered for high-current, high-reliability power switching in harsh environments, emphasizing avalanche ruggedness, low RDS(on), and robust gate oxide integrity.

FAQ

What is the maximum continuous drain current for IRF7403TRPBF at 70°C case temperature?

At TC = 70 °C, the maximum continuous drain current is 3.5 A per channel. This derating follows the SO-8 package's thermal resistance (θJA = 62 °C/W) and the device's 1.47 W conduction loss at 6.7 A and 22 mΩ. Operation above this requires forced air cooling or enhanced PCB copper area.

Can IRF7403TRPBF be used in a synchronous rectifier configuration?

Yes - its body diode exhibits trr ≤ 100 ns and QRR = 22 nC, enabling reliable synchronous rectification in buck converters up to 500 kHz. However, external gate control timing must ensure the low-side FET turns on only after the high-side body diode conducts, avoiding cross-conduction.

Does IRF7403TRPBF require a gate resistor for EMI suppression?

A gate resistor (typically 5–22 Ω) is recommended to dampen ringing caused by parasitic LGS/Ciss resonance and limit peak gate current. Without it, fast edge rates (>1 V/ns) may induce radiated emissions exceeding CISPR 22 Class B limits in unshielded enclosures.

Is the SO-8 thermal pad of IRF7403TRPBF electrically connected to any internal node?

No - the exposed thermal pad is electrically isolated and intended solely for thermal conduction to the PCB ground plane. It must be soldered to a large copper pour (≥1 in², 2-oz Cu) but should not be tied to drain, source, or gate nets to avoid unintended coupling or short circuits.

IRF7403TRPBF Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HEXFET®
Package/Case:
8-SOIC (0.154", 3.90mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
30 V
Current - Continuous Drain (Id) @ 25°C:
8.5A (Ta)
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Rds On (Max) @ Id, Vgs:
22mOhm @ 4A, 10V
Vgs(th) (Max) @ Id:
1V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
57 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
1200 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
2.5W (Ta)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-SO

IRF7403TRPBF FAQ

1.How can I place an order for IRF7403TRPBF through Aetrix?

Please submit a Request for Quotation (RFQ) for IRF7403TRPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IRF7403TRPBF reliable?

The price and inventory of IRF7403TRPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRF7403TRPBF is usually 5 days.

3.What payment methods are accepted for IRF7403TRPBF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRF7403TRPBF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IRF7403TRPBF?

IRF7403TRPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IRF7403TRPBF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IRF7403TRPBF?

For technical support, including IRF7403TRPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRF7403TRPBF requirements.

6.How does Aetrix verify that IRF7403TRPBF is sourced from the original manufacturer or authorized distributors?

All IRF7403TRPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRF7403TRPBF meets industry standards.

7.What is the process for return or replacement of IRF7403TRPBF?

All IRF7403TRPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRF7403TRPBF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IRF7403TRPBF part is unused and in its original packaging.

Return procedure for IRF7403TRPBF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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