Infineon Technologies IRF7420
- Part No.:
- IRF7420
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
IRF7420.pdf
- Description:
- MOSFET P-CH 12V 11.5A 8SO
- Quantity:
- Payment:

- Shipping:

Inventory:6,761
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Product details
Overview
IRF7420 from Infineon Technologies (formerly International Rectifier) is a P-channel enhancement-mode HEXFET® Power MOSFET in SO-8 package, rated for -12 V VDS, 14 mΩ RDS(on) at VGS = -4.5 V, and -11.5 A continuous drain current at TA = 25°C. It serves as a low-side load switch or battery disconnect device in portable power management circuits.
For engineers reviewing the IRF7420 datasheet, IRF7420 pinout, IRF7420 application, or IRF7420 equivalent, key selection considerations include its ultra-low on-resistance at logic-level gate drive, integrated body diode with 62 ns reverse recovery time, thermal resistance of 50°C/W, and SO-8 leadframe optimization for board-space-constrained DC-DC and USB power delivery designs.
Technical Context
This MOSFET employs trench-gate silicon processing to achieve high channel density and low specific on-resistance. Its gate threshold voltage range (-0.4 V to -0.9 V) enables reliable turn-on with standard 3.3 V or 5 V logic controllers, while the 38 nC total gate charge supports moderate-speed switching up to ~200 kHz in synchronous buck or OR-ing configurations.
The device integrates a fast-recovery body diode (trr = 62–93 ns, Qrr = 61–92 µC) with forward voltage of -1.2 V at -2.5 A, supporting bidirectional current handling in battery backup paths. Thermal design is anchored by a 50°C/W junction-to-ambient resistance on 1-in² copper, validated per JEDEC JESD51-3 standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | -12 V - Maximum blocking voltage for low-voltage battery-side switching (e.g., Li-ion 3S systems). |
| RDS(on) | 14 mΩ @ VGS = -4.5 V - Enables ≤165 mW conduction loss at 11.5 A, critical for thermally constrained PCBs. |
| ID (TA=25°C) | -11.5 A - Continuous current rating under natural convection on standard FR4 with 1-in² copper pour. |
| Qg | 38 nC - Determines gate driver current requirement (~1.9 mA avg. for 50 kHz switching at 5 V drive). |
| trr | 62 ns - Limits shoot-through risk and EMI in synchronous rectification when paired with external high-side FET. |
| RθJA | 50 °C/W - Defines maximum power dissipation before exceeding 150°C junction temperature in typical surface-mount layout. |
| VGS(th) | -0.4 to -0.9 V - Ensures robust turn-on margin with 3.3 V GPIO, avoiding partial enhancement near logic thresholds. |
Pinout & Package
IRF7420 uses the standard SO-8 surface-mount package with exposed drain pad for enhanced thermal performance. The leadframe is modified for improved heat spreading and multi-die compatibility.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4, 5, 7, 8 | Drain (D) | Internally paralleled drain terminals - connected to exposed pad; primary current path and thermal interface to PCB. |
| 6 | Gate (G) | Control input; requires <100 nA leakage current compliance and 38 nC charge for full enhancement. |
| Source (S) | Source (S) | Reference node for gate drive and load return; tied to system ground or battery negative in high-side switch configurations. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low RDS(on) | 14 mΩ @ -4.5 V - Reduces I²R losses by >30% vs. legacy P-channel MOSFETs at same voltage rating, extending battery runtime. |
| Logic-level gate drive | VGS(th) max -0.9 V - Eliminates need for gate boosters in 3.3 V microcontroller-based power sequencing. |
| Fast body diode | trr = 62 ns - Minimizes reverse recovery energy loss during freewheeling in DC-DC converters. |
| Enhanced SO-8 thermal design | RθJA = 50 °C/W - Achieves 2.5 W dissipation on minimal copper area, enabling compact power modules. |
| Lead-free and RoHS compliant | Pb-free marking per IRF7420PbF designation - Meets IPC-J-STD-609A Class 1 moisture sensitivity and halogen-free requirements. |
Applications
| Battery Protection Circuit | USB Type-C Power Delivery Switch |
|---|---|
Use Scenario: Reverse-current blocking and overcurrent shutdown in single-cell Li-ion battery packs. IC Role / Device Role / Timing Role: Low-side main discharge switch controlled by protection IC's OC/OD outputs. Use Value: 14 mΩ RDS(on) limits voltage drop to <170 mV at 12 A, preserving pack capacity and enabling accurate current sensing. |
Use Scenario: VBUS path control in dual-role USB-C ports supporting 3 A @ 5 V. IC Role / Device Role / Timing Role: Bidirectional load switch managing power flow between host and peripheral during role swap. Use Value: Integrated body diode with 62 ns trr prevents cross-conduction during CC logic transitions, meeting USB PD 3.0 timing constraints. |
| Hot-Swap Controller Interface | Industrial 24 V DC Input Protection |
Use Scenario: Inrush limiting and fault isolation in modular PLC I/O cards with hot-plug capability. IC Role / Device Role / Timing Role: Controlled turn-on element driven by hot-swap controller's gate ramp output. Use Value: 38 nC Qg allows precise slew-rate control via external resistor, limiting dI/dt to <10 A/ms without oscillation. |
Use Scenario: Reverse-polarity and overvoltage protection in DIN-rail mounted sensors and actuators. IC Role / Device Role / Timing Role: High-reliability series pass element in discrete protection stage ahead of LDOs or DC-DCs. Use Value: -55°C to +150°C operating range and 100 nA gate leakage ensure stable operation in unventilated enclosures at 70°C ambient. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar P-channel load switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Si2301DS-T1-BE3 | RDS(on) = 105 mΩ @ -2.5 V; lower VDS (-20 V); 2.2 nC Qg | Higher conduction loss but faster switching; suited for <1 A loads with tight gate drive budgets. | Prefer for space-constrained, low-current IoT nodes where gate drive efficiency outweighs thermal loss. |
| DMG2305UVT-7 | RDS(on) = 48 mΩ @ -4.5 V; SO-8; 12 nC Qg; -20 V VDS | Higher voltage rating and lower Qg, but 3.4× higher RDS(on) than IRF7420 at same VGS. | Choose when system requires -20 V blocking margin and gate drive current is limited to <1 mA average. |
Compared with Si2301DS-T1-BE3 and DMG2305UVT-7, IRF7420 delivers the lowest conduction loss in the -12 V class, making it optimal for high-current battery switches where thermal headroom is constrained and gate drive voltage is ≥ -4.5 V.
Availability
IRF7420 is available at Aetrix Electronics and suitable for battery protection circuits, USB Type-C power delivery switches, hot-swap interfaces, and industrial 24 V DC input protection requiring stable component supply across production lifecycles.
Supply support for IRF7420 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader specializing in power management, automotive, and industrial control solutions, with core expertise in silicon and wide-bandgap power devices.
The IRF7420 belongs to the HEXFET® Power MOSFET product line, engineered specifically for high-efficiency, low-voltage DC power distribution in portable and space-constrained systems.
FAQ
What is the maximum safe operating voltage for IRF7420 in continuous DC operation?
The IRF7420 has a guaranteed drain-source breakdown voltage (V(BR)DSS) of -12 V at ID = -250 µA and TJ = 25°C. Derating applies above 25°C: the temperature coefficient is +0.007 V/°C, so at 125°C junction temperature, the effective rating drops to approximately -11.3 V. Operation beyond -12 V risks avalanche failure even with current limiting.
Can IRF7420 be used in a high-side switch configuration with 5 V gate drive?
Yes - its gate threshold voltage range (-0.4 V to -0.9 V) ensures full enhancement with 5 V logic-level drive. However, high-side use requires a floating gate driver or charge pump to maintain VGS ≤ -4.5 V relative to the source node, which rises toward VIN. Without level-shifting, gate drive collapses as the source voltage increases, causing incomplete turn-on and excessive RDS(on).
How does the SO-8 package's thermal performance compare to DPAK for IRF7420?
The IRF7420 is only offered in SO-8; no DPAK variant exists. Its modified SO-8 leadframe achieves RθJA = 50°C/W on 1-in² copper - comparable to many DPAK devices despite smaller footprint. The exposed drain pad provides direct thermal path to PCB, making it more efficient per mm² than standard SO-8, though absolute power handling remains lower than larger packages like TO-252.
Is the body diode suitable for synchronous rectification in a 500 kHz buck converter?
No - while the body diode has fast trr (62 ns), its Qrr (61–92 µC) and VSD (-1.2 V) cause significant switching loss and conduction loss at 500 kHz. Synchronous rectification at this frequency requires an external Schottky or GaN FET with lower Qrr and forward voltage. IRF7420 is best applied in <200 kHz topologies or non-synchronous freewheeling.
IRF7420 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- FET Type:
- P-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 12 V
- Current - Continuous Drain (Id) @ 25°C:
- 11.5A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 1.8V, 4.5V
- Rds On (Max) @ Id, Vgs:
- 14mOhm @ 11.5A, 4.5V
- Vgs(th) (Max) @ Id:
- 900mV @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 38 nC @ 4.5 V
- Vgs (Max):
- ±8V
- Input Capacitance (Ciss) (Max) @ Vds:
- 3529 pF @ 10 V
- FET Feature:
- -
- Power Dissipation (Max):
- 2.5W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SO
IRF7420 FAQ
1.How can I place an order for IRF7420 through Aetrix?
Please submit a Request for Quotation (RFQ) for IRF7420 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRF7420 reliable?
The price and inventory of IRF7420 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRF7420 is usually 5 days.
3.What payment methods are accepted for IRF7420?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRF7420 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRF7420?
IRF7420 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRF7420 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRF7420?
For technical support, including IRF7420 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRF7420 requirements.
6.How does Aetrix verify that IRF7420 is sourced from the original manufacturer or authorized distributors?
All IRF7420 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRF7420 meets industry standards.
7.What is the process for return or replacement of IRF7420?
All IRF7420 units undergo pre-shipment inspection (PSI). If there is an issue with IRF7420, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRF7420 part is unused and in its original packaging.
Return procedure for IRF7420:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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