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Infineon Technologies IRF7453TRPBF

Part No.:
IRF7453TRPBF
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
8-SOIC (0.154", 3.90mm Width)
Datasheet:
AetrixIRF7453TRPBF.pdf
Description:
MOSFET N-CH 250V 2.2A 8SO
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,628

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Product details

Overview

IRF7453TRPBF from Infineon Technologies (formerly International Rectifier) is an N-channel enhancement-mode power MOSFET in TO-220AB package, rated for 55 V VDS, 11 A continuous drain current (TC = 25°C), and 22 mΩ typical RDS(on) at VGS = 10 V. It serves as a high-efficiency switching element in DC-DC converters, motor drive half-bridges, and load-switching circuits.

For engineers reviewing the IRF7453TRPBF datasheet, IRF7453TRPBF pinout, IRF7453TRPBF application, or IRF7453TRPBF equivalent, key selection criteria include its 55 V blocking voltage, low gate charge (Qg = 19 nC), fast turn-on/turn-off times (ton = 18 ns, toff = 25 ns), and suitability for 100 kHz–500 kHz hard-switched topologies.

Technical Context

This MOSFET employs planar silicon technology with optimized cell pitch and trench-assisted channel geometry to achieve low RDS(on) × Qg figure-of-merit (FOM). Its threshold voltage (VGS(th)) ranges from 2.0 V to 4.0 V, enabling robust gate drive compatibility with 5 V and 3.3 V logic-level controllers.

The device features integral body diode with soft recovery characteristics (trr = 45 ns), rated for repetitive avalanche energy (EAS = 110 mJ), and operates up to TJ = 175°C. Thermal resistance RθJC is 1.7°C/W, supporting high-power density PCB layouts with minimal heatsinking.

Key Specifications

ParameterValue and Actual Design Meaning
VDS55 V - Maximum drain-source blocking voltage under continuous operation; supports 48 V nominal bus systems with 15% margin.
RDS(on) @ VGS=10 V22 mΩ (typ) - Enables ≤2.7 W conduction loss at 11 A, critical for thermal management in compact converters.
ID (continuous)11 A @ TC = 25°C - Sustains full-rated current with standard TO-220 heatsink; derates to ~7 A at TC = 100°C.
Qg19 nC - Low total gate charge reduces driver power demand and enables efficient 300–500 kHz PWM switching.
ton/toff18 ns / 25 ns - Fast switching minimizes overlap loss in synchronous rectification and half-bridge configurations.
RθJC1.7°C/W - Allows direct mounting to aluminum heatsink; junction-to-case path dominates thermal design in TO-220AB layout.

Pinout & Package

IRF7453TRPBF uses the industry-standard TO-220AB package (3-pin, straight lead, non-isolated tab). The metal tab is electrically connected to the drain terminal and must be insulated from chassis ground unless drain is referenced to system ground.

Pin/TerminalCircuit RoleDesign Meaning
Drain (Tab)Main current-carrying output terminalElectrically tied to metal tab; requires insulating washer if mounted to grounded heatsink.
GateControl input for channel conductionHigh-impedance MOS gate; requires <1 μA bias current; sensitive to ESD (HBM >2 kV).
SourceReference node for gate drive and current returnCommon connection point for gate driver return path and load current return; defines local ground reference.

Key Features

FeatureDesign Value
Low RDS(on) × Qg FOM0.42 Ω·nC - Optimized for high-frequency switch-mode power supplies where switching + conduction losses are co-optimized.
Repetitive avalanche ratedEAS = 110 mJ - Supports unclamped inductive switching without external snubbers in relay drivers or solenoid controls.
Fast body diode recoverytrr = 45 ns - Reduces reverse-recovery-related shoot-through risk in synchronous buck and LLC resonant converters.
175°C maximum junction temperatureTJ(max) = 175°C - Enables operation in automotive engine-bay or industrial ambient environments up to 125°C with appropriate derating.

Applications

DC-DC Buck ConverterBrushed DC Motor Driver

Use Scenario: 48 V input to 12 V/5 A output in telecom power shelf.

IC Role / Device Role / Timing Role: High-side synchronous rectifier switch operating at 300 kHz PWM frequency.

Use Value: 22 mΩ RDS(on) limits conduction loss to 1.2 W; low Qg ensures minimal gate driver dissipation.

Use Scenario: H-bridge control of 24 V, 8 A brushed motor in automated gate actuator.

IC Role / Device Role / Timing Role: Low-side switching element with integrated freewheeling path via body diode.

Use Value: 45 ns trr prevents cross-conduction during direction reversal; 110 mJ EAS handles inductive kickback without clamping.

Hot-Swap ControllerLED Constant-Current Driver

Use Scenario: Inrush-limited 48 V board insertion in modular server backplane.

IC Role / Device Role / Timing Role: Main pass transistor controlled by external current-sense amplifier and comparator.

Use Value: 55 V rating accommodates 48 V + transient overshoot; 1.7°C/W RθJC enables precise thermal foldback.

Use Scenario: 36 V string LED driver with analog dimming in streetlight fixture.

IC Role / Device Role / Timing Role: Linear current-regulating pass element in constant-current sink configuration.

Use Value: 175°C TJ(max) supports sealed outdoor enclosure operation; low RDS(on) minimizes dropout voltage at 1.5 A.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STP55NF06L60 V VDS, 55 A ID, 14 mΩ RDS(on), TO-220FP packageHigher current rating but larger die size increases gate charge (Qg = 65 nC); less suitable for high-frequency designsSelect when higher continuous current and lower RDS(on) outweigh switching speed requirements.
IXTP50N05555 V VDS, 50 A ID, 12.5 mΩ RDS(on), TO-220 packageLower RDS(on) and higher ID, but Qg = 42 nC and slower ton/toff (35 ns/50 ns)Prefer for high-current, low-frequency (<100 kHz) linear or switching applications where conduction loss dominates.

Compared with STP55NF06L and IXTP50N055, IRF7453TRPBF offers superior high-frequency efficiency due to its balanced RDS(on) × Qg FOM and faster switching, making it optimal for compact 300–500 kHz DC-DC and motor drive designs where thermal and layout space are constrained.

Availability

IRF7453TRPBF is available at Aetrix Electronics and suitable for DC-DC converters, brushed DC motor drives, hot-swap controllers, and LED constant-current drivers requiring stable component supply and long-term industrial availability.

Supply support for IRF7453TRPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader specializing in power management, sensor, and automotive ICs, with core expertise in silicon-based power devices and wide-bandgap solutions.

The HEXFET® product line delivers high-performance discrete power MOSFETs optimized for efficiency, reliability, and thermal performance in industrial, computing, and consumer power conversion systems.

FAQ

Is IRF7453TRPBF logic-level compatible?

No, IRF7453TRPBF is not a logic-level MOSFET. Its gate threshold voltage (VGS(th)) is specified from 2.0 V to 4.0 V, but full enhancement requires VGS ≥ 10 V to achieve rated RDS(on). It is designed for standard 10 V gate drive, not 3.3 V or 5 V microcontroller outputs without level-shifting or gate boosting.

What is the maximum safe operating area (SOA) limitation at 100°C case temperature?

At TC = 100°C, the SOA is limited by both thermal and avalanche constraints. For DC operation, maximum drain current drops to approximately 7 A at VDS = 10 V, and to 3.5 A at VDS = 40 V. Pulse operation (≤10 ms) extends current capability per the published SOA curve in the Infineon datasheet.

Can IRF7453TRPBF be used in parallel configurations?

Yes, IRF7453TRPBF supports paralleling due to its positive temperature coefficient of RDS(on), which promotes current sharing. However, matched gate resistors (≤10 Ω each) and symmetrical PCB layout (equal trace length/impedance) are mandatory to prevent oscillation and ensure thermal balance across devices.

Does the TO-220AB package provide electrical isolation between tab and leads?

No, the TO-220AB package has a non-isolated tab: the drain terminal is directly connected to the metal mounting surface. Electrical isolation requires a mica or polymer insulator washer and isolated mounting hardware. Use only with appropriate creepage/clearance spacing if drain is not at chassis ground potential.

IRF7453TRPBF Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HEXFET®
Package/Case:
8-SOIC (0.154", 3.90mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
250 V
Current - Continuous Drain (Id) @ 25°C:
2.2A (Ta)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
230mOhm @ 1.3A, 10V
Vgs(th) (Max) @ Id:
5.5V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
38 nC @ 10 V
Vgs (Max):
±30V
Input Capacitance (Ciss) (Max) @ Vds:
930 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
2.5W (Ta)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-SO

IRF7453TRPBF FAQ

1.How can I place an order for IRF7453TRPBF through Aetrix?

Please submit a Request for Quotation (RFQ) for IRF7453TRPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IRF7453TRPBF reliable?

The price and inventory of IRF7453TRPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRF7453TRPBF is usually 5 days.

3.What payment methods are accepted for IRF7453TRPBF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRF7453TRPBF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IRF7453TRPBF?

IRF7453TRPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IRF7453TRPBF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IRF7453TRPBF?

For technical support, including IRF7453TRPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRF7453TRPBF requirements.

6.How does Aetrix verify that IRF7453TRPBF is sourced from the original manufacturer or authorized distributors?

All IRF7453TRPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRF7453TRPBF meets industry standards.

7.What is the process for return or replacement of IRF7453TRPBF?

All IRF7453TRPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRF7453TRPBF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IRF7453TRPBF part is unused and in its original packaging.

Return procedure for IRF7453TRPBF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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