Infineon Technologies IRF7475TRPBF
- Part No.:
- IRF7475TRPBF
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
IRF7475TRPBF.pdf
- Description:
- MOSFET N-CH 12V 11A 8SO
- Quantity:
- Payment:

- Shipping:

Inventory:5,513
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Product details
Overview
IRF7475TRPBF from Infineon Technologies is a 12 V, 11.5 mΩ (typ), 8.8 A N-channel enhancement-mode HEXFET® Power MOSFET in SO-8 package, optimized for high-frequency synchronous buck converter control FETs in point-of-load applications for networking and computing systems.
For engineers reviewing the IRF7475TRPBF datasheet, IRF7475TRPBF pinout, IRF7475TRPBF application, or IRF7475TRPBF equivalent, key selection criteria include RDS(on) @ 4.5 V (15 mΩ max), Qg (13–19 nC), Ciss/Coss/Crss (1590/1310/260 pF), avalanche energy rating (180 mJ), and SO-8 thermal performance (RθJA = 50 °C/W).
Technical Context
This device operates as a low-side control FET in non-isolated DC/DC converters, where fast switching, low gate charge, and robust body diode recovery are critical. Its 12 V VDSS, 11.5 mΩ RDS(on) at 4.5 V VGS, and 19 nC total gate charge enable efficient operation at >500 kHz switching frequencies.
The integrated body diode exhibits trr = 42–63 ns and Qrr = 44–66 nC, directly impacting shoot-through risk and loss distribution in synchronous rectification. Thermal design leverages SO-8's RθJL = 20 °C/W and linear derating of 0.02 W/°C above 70 °C ambient.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 12 V - Maximum blocking voltage compatible with 12 V input rails and transient margin in PoL converters. |
| RDS(on) @ 4.5 V | 15 mΩ max - Enables low conduction loss at logic-level gate drive, critical for 3.3 V/5 V controller compatibility. |
| Qg | 13–19 nC - Determines gate drive power and switching speed; lower Qg reduces driver stress and EMI in high-fSW designs. |
| Ciss/Coss/Crss | 1590/1310/260 pF - Governs turn-on/off dynamics and Miller-induced dv/dt turn-on risk; low Crss/Ciss ratio improves noise immunity. |
| EAS | 180 mJ - Specifies single-pulse unclamped inductive avalanche capability, supporting robustness during load dump or short-circuit events. |
| trr/Qrr | 42–63 ns / 44–66 nC - Quantifies body diode reverse recovery behavior; directly impacts cross-conduction loss and thermal stress in synchronous FET position. |
Pinout & Package
IRF7475TRPBF is housed in a standard SO-8 surface-mount package with exposed drain pad for enhanced thermal dissipation. Pin numbering follows JEDEC MS-012AA, with pins 1–3 and 5–7 forming parallel drain terminals, pin 4 as gate, and pins 6–8 as source.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 5, 7 | Drain (D) | High-current output node; multiple parallel pins reduce package inductance and resistive loss in high-di/dt switching paths. |
| 4 | Gate (G) | Control input; low gate impedance enables fast edge rates with minimal external gate resistance. |
| 6, 8 | Source (S) | Power return path; dual-source pins improve current sharing and reduce source inductance in synchronous FET layout. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low RDS(on) @ 4.5 V | 11.5 mΩ typ - Reduces I²R conduction loss by >30% vs. legacy 20 mΩ devices at 8.8 A, improving efficiency in 12 V input PoL stages. |
| Low Qgd/Qgs1 ratio | 3.9 nC / 2.6 nC ≈ 1.5 - Minimizes Miller-induced dv/dt turn-on risk when used as synchronous FET in buck converters with high dV/dt switching nodes. |
| Characterized avalanche performance | 180 mJ EAS - Allows safe operation under unclamped inductive switching without external snubbers in compact board layouts. |
| Lead-free and RoHS-compliant | Meets IPC-J-STD-020 moisture sensitivity level 1 - Enables standard reflow assembly without pre-bake, reducing manufacturing cost and cycle time. |
Applications
| Server VRM Control FET | Networking ASIC Core Supply |
|---|---|
Use Scenario: High-current, high-frequency buck converter supplying 0.8–1.2 V to multi-core CPUs in 1U rack servers. IC Role / Device Role / Timing Role: Control FET switching node; handles 8.8 A continuous drain current with <10 ns turn-off delay to support >1 MHz operation. Use Value: Low Qg and RDS(on) reduce switching and conduction losses, enabling >92% efficiency at 12 V input and 50 A load. | Use Scenario: Point-of-load regulator delivering stable 1.0 V to 100 GbE switch ASICs with tight transient response requirements. IC Role / Device Role / Timing Role: Synchronous rectifier FET; body diode recovery (trr = 42 ns) minimizes dead-time loss and prevents shoot-through during phase transitions. Use Value: Optimized Crss/Ciss ratio suppresses dv/dt-induced false turn-on, eliminating need for negative gate drive in compact PCB layouts. |
| Enterprise Storage Controller Supply | AI Accelerator Memory Rail |
Use Scenario: Dual-phase buck converter powering NVMe SSD controllers requiring <10 mV ripple and fast load-step response. IC Role / Device Role / Timing Role: Low-side control switch; SO-8 thermal performance (RθJA = 50 °C/W) maintains <100 °C junction temperature under 100% duty cycling. Use Value: Fully characterized avalanche rating (180 mJ) ensures reliability during hot-plug transients and PCIe link retraining events. | Use Scenario: Multi-phase VRM supplying 0.75 V to HBM2E memory stacks in AI training accelerators with >200 A peak current demand. IC Role / Device Role / Timing Role: Synchronous FET in interleaved topology; parallel drain/source pins reduce package parasitics for clean current sharing across phases. Use Value: 11.5 mΩ RDS(on) at 4.5 V enables use of 3.3 V gate drivers, simplifying power sequencing and reducing BOM count vs. bootstrap-based solutions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Si7852DP-T1-GE3 | RDS(on) = 12.5 mΩ @ 4.5 V; Qg = 22 nC; Crss = 320 pF | Higher gate charge increases driver loss; higher Crss raises dv/dt susceptibility in high-dV/dt nodes | Preferred for lower-cost industrial PoL where switching frequency ≤300 kHz |
| DMN3025LSD-13 | RDS(on) = 2.5 mΩ @ 10 V but 25 mΩ @ 4.5 V; Qg = 10 nC; SO-8 with dual drain/source | Higher RDS(on) at logic-level drive degrades light-load efficiency; lower Qg benefits ultra-high-fSW designs | Preferred for 10 V gate drive systems or where lowest possible Qg dominates over RDS(on) at 4.5 V |
Compared with Si7852DP-T1-GE3 and DMN3025LSD-13, IRF7475TRPBF delivers the best balance of low RDS(on) at 4.5 V and moderate Qg for 500 kHz–1 MHz synchronous buck converters, while its fully characterized avalanche rating provides superior ruggedness in mission-critical computing power delivery.
Availability
IRF7475TRPBF is available at Aetrix Electronics and suitable for server VRMs, networking ASIC core supplies, and AI accelerator memory rails requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for IRF7475TRPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs and discrete devices, with global manufacturing and quality certification to ISO/TS 16949 and IECQ QC 080000.
The HEXFET® Power MOSFET product line targets high-efficiency, high-reliability power conversion in computing, telecom, and industrial applications, emphasizing low RDS(on), fast switching, and rugged avalanche performance.
FAQ
Is IRF7475TRPBF suitable for use as a synchronous rectifier FET?
Yes. IRF7475TRPBF is specifically designed for synchronous rectification in buck converters, with characterized body diode parameters (trr = 42–63 ns, Qrr = 44–66 nC) and low RDS(on) at 4.5 V, enabling efficient replacement of Schottky diodes in 12 V input PoL stages without compromising thermal or EMI performance.
What is the maximum recommended gate drive voltage for reliable operation?
The absolute maximum VGS is ±12 V, but Infineon specifies full RDS(on) characterization at 4.5 V and 10 V. For optimal reliability and lifetime, gate drive should be limited to 10 V maximum in continuous operation; exceeding 12 V risks oxide degradation and parametric shift over time.
Does IRF7475TRPBF require a heatsink in SO-8 footprint applications?
No external heatsink is required for typical PoL applications up to 8.8 A continuous current at TA ≤ 70 °C, due to its SO-8 package RθJA of 50 °C/W and RθJL of 20 °C/W. However, PCB copper area ≥ 200 mm² per drain pad and thermal vias to inner ground planes are mandatory to maintain TJ < 125 °C under full load.
How does the avalanche rating impact system-level reliability?
The 180 mJ single-pulse avalanche energy rating allows IRF7475TRPBF to safely absorb inductive energy during fault conditions-such as output short-circuits or controller timing faults-without catastrophic failure. This eliminates the need for external clamping circuits in space-constrained server and networking power modules, improving system MTBF.
IRF7475TRPBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 12 V
- Current - Continuous Drain (Id) @ 25°C:
- 11A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 2.8V, 4.5V
- Rds On (Max) @ Id, Vgs:
- 15mOhm @ 8.8A, 4.5V
- Vgs(th) (Max) @ Id:
- 2V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 19 nC @ 4.5 V
- Vgs (Max):
- ±12V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1590 pF @ 6 V
- FET Feature:
- -
- Power Dissipation (Max):
- 2.5W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SO
IRF7475TRPBF FAQ
1.How can I place an order for IRF7475TRPBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRF7475TRPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRF7475TRPBF reliable?
The price and inventory of IRF7475TRPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRF7475TRPBF is usually 5 days.
3.What payment methods are accepted for IRF7475TRPBF?
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IRF7475TRPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRF7475TRPBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRF7475TRPBF?
For technical support, including IRF7475TRPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRF7475TRPBF requirements.
6.How does Aetrix verify that IRF7475TRPBF is sourced from the original manufacturer or authorized distributors?
All IRF7475TRPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRF7475TRPBF meets industry standards.
7.What is the process for return or replacement of IRF7475TRPBF?
All IRF7475TRPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRF7475TRPBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRF7475TRPBF part is unused and in its original packaging.
Return procedure for IRF7475TRPBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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