Infineon Technologies IRF7526D1TRPBF
- Part No.:
- IRF7526D1TRPBF
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
IRF7526D1TRPBF.pdf
- Description:
- MOSFET P-CH 30V 2A MICRO8
- Quantity:
- Payment:

- Shipping:

Inventory:9,176
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Product details
Overview
IRF7526D1TRPBF from Infineon Technologies (formerly International Rectifier) is a co-packaged P-channel HEXFET® Power MOSFET and low-forward-voltage Schottky diode in a single Micro8 surface-mount package. It delivers VDSS = −30 V, RDS(on) = 0.20 Ω @ VGS = −4.5 V, and Schottky VF = 0.39 V @ IF = 1.0 A, TJ = 125°C - optimized for synchronous buck converter high-side switching in portable power management.
For engineers reviewing the IRF7526D1TRPBF datasheet, IRF7526D1TRPBF pinout, IRF7526D1TRPBF application, or IRF7526D1TRPBF equivalent, key selection criteria include verified body-diode reverse recovery time (trr = 30–45 ns), gate charge (Qg = 7.5–11 nC), thermal resistance (RθJA = 100 °C/W), and Micro8 footprint compatibility with space-constrained DC-DC designs.
Technical Context
This FETKY device integrates a logic-level P-channel MOSFET and a low-VF Schottky rectifier on a shared die substrate within a thermally enhanced Micro8 package. The MOSFET features Generation 5 HEXFET processing for low RDS(on) density, while the Schottky diode provides fast recovery (trr ≤ 45 ns) and low forward drop (VF ≤ 0.62 V at 2 A, 25°C).
It operates with gate drive compatible with standard 3.3 V/5 V controllers, supports pulsed drain current up to −16 A, and maintains stable performance across −55°C to +150°C junction temperature range. The co-packaged architecture eliminates external diode routing, reducing parasitic inductance and layout area by ~50% versus discrete SO-8 solutions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | −30 V - maximum blocking voltage for high-side switch in 3.3 V/5 V input buck converters |
| RDS(on) | 0.20 Ω @ VGS = −4.5 V - enables <1.2 W conduction loss at 1.2 A continuous drain current |
| Schottky VF | 0.39 V @ IF = 1.0 A, TJ = 125°C - reduces body-diode conduction loss in light-load discontinuous mode |
| Qg | 7.5–11 nC - determines gate driver strength requirement and switching loss trade-off |
| trr | 30–45 ns - limits voltage overshoot and EMI during synchronous rectifier dead-time transitions |
| RθJA | 100 °C/W - defines thermal derating on 1-inch² copper board; requires heatsinking above 0.8 W dissipation |
| ID (cont) | −2.0 A @ TA = 25°C - sets maximum steady-state output current capability in compact PCB layouts |
Pinout & Package
IRF7526D1TRPBF uses the Micro8 surface-mount package (3.0 mm × 3.0 mm, height <1.1 mm), offering half the footprint of standard SO-8 and optimized for thin-profile portable electronics. Pin numbering follows top-view orientation with pins 1–4 on one side and 5–8 on the opposite side.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4 | Source (MOSFET) / Cathode (Schottky) | Common terminal for both devices; connects to output node and return path for diode conduction |
| 5, 6, 7 | Drain (MOSFET) / Anode (Schottky) | Shared high-side switching node; carries full load current and withstands −30 V reverse bias |
| 8 | Gate | Control input for MOSFET; requires −4.5 V to −10 V for full enhancement; isolated from power terminals |
Key Features
| Feature | Design Value |
|---|---|
| Co-packaged FET + Schottky | Eliminates interconnect inductance and saves >40% board area vs. discrete SO-8 pair |
| Generation 5 HEXFET | Delivers 0.20 Ω RDS(on) at −4.5 V gate drive - enables efficient operation with 3.3 V controllers |
| Low Schottky VF | 0.39 V at 1 A, 125°C - minimizes conduction loss during body-diode conduction in DCM |
| Micro8 footprint | 3.0 × 3.0 mm outline with exposed thermal pad - supports automated reflow and improved thermal transfer |
| Lead-free & RoHS-compliant | Meets IPC/JEDEC J-STD-020D moisture sensitivity level 1 - suitable for standard SMT assembly |
Applications
| Smartphone Power Management | USB-C PD Portable Adapters |
|---|---|
Use Scenario: High-efficiency 3.3 V/5 V buck converter supplying application processor core voltage in slim smartphone form factor. IC Role / Device Role: High-side synchronous switch with integrated Schottky for freewheeling path during low-duty-cycle operation. Use Value: Reduces total solution size by eliminating discrete diode and associated trace routing; lowers trr-induced voltage spikes under dynamic load steps. | Use Scenario: Secondary-side synchronous rectification in compact 20–30 W USB-C PD adapter with <12 mm profile. IC Role / Device Role: Co-packaged P-MOSFET + Schottky enabling zero-voltage switching and reduced conduction loss at light loads. Use Value: Achieves >92% efficiency at 25% load via low VF Schottky and 0.20 Ω RDS(on), meeting CoC Tier 2 requirements. |
| Wearable Fitness Tracker PMIC | Industrial IoT Sensor Node Regulator |
Use Scenario: Ultra-thin wearable with stacked PCB layers where component height must be <1.1 mm. IC Role / Device Role: Input-stage switch in 3.7 V Li-ion to 1.8 V LDO pre-regulator, leveraging Micro8's low profile. Use Value: Enables mechanical stack-up compliance without sacrificing thermal performance - RθJA remains 100 °C/W even at 0.6 mm board thickness. | Use Scenario: Remote battery-powered sensor node requiring long-term reliability and wide temperature operation. IC Role / Device Role: Primary DC-DC switch in −40°C to +85°C ambient environment with no derating up to 1.2 A output. Use Value: Maintains stable RDS(on) and trr across full industrial temperature range - validated per JEDEC JESD22-A108F. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar co-packaged P-MOSFET + Schottky applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Si7851DP-T1-GE3 | RDS(on) = 0.18 Ω @ −4.5 V but higher Qg = 14 nC; VDSS = −30 V; same Micro8 package | Better conduction loss at high current, but higher switching loss and gate drive demand | Prefer when efficiency at >1.5 A dominates over gate driver complexity |
| DMG6968UVT-7 | P-channel only (no integrated Schottky); RDS(on) = 0.19 Ω @ −4.5 V; same Micro8 footprint | Requires external Schottky, increasing BOM count and layout area | Select only if discrete diode placement is needed for thermal separation or custom VF tuning |
Compared with Si7851DP-T1-GE3 and DMG6968UVT-7, IRF7526D1TRPBF uniquely balances low gate charge (7.5–11 nC), verified body-diode trr (30–45 ns), and integrated Schottky - making it optimal for space-constrained, high-frequency synchronous buck designs where layout simplicity and EMI control are critical.
Availability
IRF7526D1TRPBF is available at Aetrix Electronics and suitable for smartphone power management, USB-C PD portable adapters, and wearable fitness tracker PMICs requiring stable component supply and consistent Micro8 footprint sourcing.
Supply support for IRF7526D1TRPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader specializing in power management, automotive, and industrial control ICs and discrete devices.
The FETKY product line was developed to address board-area constraints in portable power conversion, integrating optimized P-MOSFETs and Schottky diodes using proprietary co-packaging to reduce parasitics and improve system-level efficiency.
FAQ
What is the maximum continuous drain current for IRF7526D1TRPBF at 70°C ambient?
The maximum continuous drain current is −1.6 A at TA = 70°C, based on thermal derating from the 1.25 W power dissipation limit and 100 °C/W junction-to-ambient thermal resistance. This value assumes mounting on a 1-inch² copper board and accounts for self-heating under steady-state conditions.
Does IRF7526D1TRPBF require a negative gate drive voltage?
Yes - as a P-channel MOSFET, IRF7526D1TRPBF requires a gate voltage lower than its source to turn on. Full enhancement occurs at VGS = −4.5 V to −10 V. With source tied to input voltage (e.g., 5 V), the gate must be driven to 0.5–1.0 V or ground to achieve low RDS(on).
Can the integrated Schottky diode replace an external freewheeling diode in a synchronous buck converter?
Yes - the integrated Schottky serves as the freewheeling path during the low-side conduction phase. Its 0.39 V forward drop at 1 A and 125°C, plus 30–45 ns reverse recovery, make it suitable for high-frequency (>1 MHz) buck converters operating in discontinuous conduction mode without requiring external diode substitution.
Is IRF7526D1TRPBF pin-compatible with other Micro8 dual-FET or FET+diode devices?
No - IRF7526D1TRPBF has a unique pinout: pins 1–4 are common Source/Cathode, pins 5–7 are common Drain/Anode, and pin 8 is Gate. Other Micro8 FET+diode parts (e.g., Si7851DP) use different internal configurations and terminal assignments; direct replacement requires schematic and layout verification.
IRF7526D1TRPBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FETKY™
- Package/Case:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- P-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 2A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 200mOhm @ 1.2A, 10V
- Vgs(th) (Max) @ Id:
- 1V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 11 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 180 pF @ 25 V
- FET Feature:
- Schottky Diode (Isolated)
- Power Dissipation (Max):
- 1.25W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- Micro8™
IRF7526D1TRPBF FAQ
1.How can I place an order for IRF7526D1TRPBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRF7526D1TRPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRF7526D1TRPBF reliable?
The price and inventory of IRF7526D1TRPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRF7526D1TRPBF is usually 5 days.
3.What payment methods are accepted for IRF7526D1TRPBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRF7526D1TRPBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRF7526D1TRPBF?
IRF7526D1TRPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRF7526D1TRPBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRF7526D1TRPBF?
For technical support, including IRF7526D1TRPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRF7526D1TRPBF requirements.
6.How does Aetrix verify that IRF7526D1TRPBF is sourced from the original manufacturer or authorized distributors?
All IRF7526D1TRPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRF7526D1TRPBF meets industry standards.
7.What is the process for return or replacement of IRF7526D1TRPBF?
All IRF7526D1TRPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRF7526D1TRPBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRF7526D1TRPBF part is unused and in its original packaging.
Return procedure for IRF7526D1TRPBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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