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Infineon Technologies IRF7606TR

Part No.:
IRF7606TR
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Datasheet:
AetrixIRF7606TR.pdf
Description:
MOSFET P-CH 30V 3.6A MICRO8
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:5,146

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Product details

Overview

IRF7606TR from Infineon Technologies (formerly International Rectifier) is a P-channel enhancement-mode HEXFET Power MOSFET in Micro8 package, rated for -30 V VDS, 0.09 Ω RDS(on) at VGS = -10 V, and -3.6 A continuous drain current at 25°C. It integrates a fast-recovery body diode (trr = 43 ns typical) and supports high-efficiency load switching in space-constrained DC-DC converters and battery protection circuits.

For engineers reviewing the IRF7606TR datasheet, IRF7606TR pinout, IRF7606TR application, or IRF7606TR equivalent, key selection criteria include its low-profile Micro8 footprint (<1.1 mm height), -30 V breakdown voltage, 0.09 Ω on-resistance, -2.4 A body diode conduction capability, and thermal resistance of 70 °C/W (junction-to-ambient).

Technical Context

This device operates as a single P-channel power switch with gate threshold voltage of -1.0 V (min), enabling logic-level drive from 3.3 V or 5 V controllers. Its fast switching performance is characterized by 13 ns turn-on delay, 20 ns rise time, and 39 ns fall time under specified test conditions (VDD = -10 V, RG = 6.0 Ω).

The integrated body diode exhibits VSD = -1.2 V at -2.4 A and reverse recovery charge Qrr = 50 nC (typ), supporting synchronous rectification and bidirectional current handling in buck converters and OR-ing applications.

Key Specifications

ParameterValue and Actual Design Meaning
VDS-30 V - Maximum blocking voltage for negative-rail high-side switching
RDS(on)0.09 Ω @ VGS = -10 V - Enables <100 mW conduction loss at 3.3 A load current
ID (25°C)-3.6 A - Continuous drain current rating for PCB-mounted operation without heatsink
trr43 ns typical - Supports >1 MHz switching in synchronous buck topologies
Qg20 nC typical - Low gate charge reduces driver power and enables efficient PWM control
RθJA70 °C/W - Thermal limit defines maximum power dissipation (1.8 W at 25°C ambient)
VGS(th)-1.0 V min - Ensures reliable turn-on with standard 3.3 V GPIO or logic-level drivers

Pinout & Package

IRF7606TR uses the Micro8 surface-mount package (JEDEC MO-229 variant), measuring 3.05 mm × 4.24 mm × <1.1 mm, with gull-wing leads and 0.65 mm pitch. Its compact footprint occupies ~50% less board area than standard SO-8.

Pin/TerminalCircuit RoleDesign Meaning
1, 2, 3, 4, 5, 6Drain (D)Common high-current output node; internally paralleled for low RDS(on) and thermal spreading
7Gate (G)Control input; requires negative VGS for turn-on; total gate charge 20 nC
8Source (S)Reference terminal for gate drive and load return path; connects to system ground or negative rail

Key Features

FeatureDesign Value
Ultra-low RDS(on)0.09 Ω at VGS = -10 V - Reduces I²R losses in portable power rails
Micro8 package3.05 mm × 4.24 mm footprint, <1.1 mm height - Fits PCMCIA, thin tablets, and wearable PCBs
Fifth-generation HEXFETImproved thermal resistance and current handling vs. prior generations - Extends safe operating area at elevated temperatures
Fast body diodetrr = 43 ns, Qrr = 50 nC - Minimizes switching loss during freewheeling in buck regulators

Applications

Battery Protection CircuitLoad Switch for USB OTG

Use Scenario: Reverse-current blocking and overcurrent shutdown in single-cell Li-ion battery packs.

IC Role / Device Role / Timing Role: P-channel high-side switch controlling battery discharge path; activated by protection IC's gate signal.

Use Value: 0.09 Ω RDS(on) limits voltage drop to <330 mV at 3.6 A, preserving runtime and reducing thermal stress.

Use Scenario: Controlled power enable for USB On-The-Go peripherals requiring 5 V VBUS sourcing.

IC Role / Device Role / Timing Role: Load switch isolating downstream circuitry; driven by microcontroller GPIO with logic-level compatibility.

Use Value: -1.0 V VGS(th) ensures full enhancement with 3.3 V control, eliminating need for level-shifting circuitry.

Synchronous Buck Converter High-Side SwitchHot-Swap Controller Back-End Switch

Use Scenario: High-efficiency 3.3 V or 5 V point-of-load regulation in embedded systems.

IC Role / Device Role / Timing Role: Synchronous rectifier replacement for low-side diode; commutated with precise timing relative to low-side FET.

Use Value: 43 ns trr and 50 nC Qrr reduce dead-time losses and EMI generation during body-diode conduction.

Use Scenario: Inrush current limiting and fault isolation in industrial backplane power modules.

IC Role / Device Role / Timing Role: Current-controlled high-side switch managed by hot-swap controller IC (e.g., LTC4215).

Use Value: 70 °C/W RθJA and 1.8 W PD allow robust operation under sustained 2 A loads without external heatsinking.

Equivalent & Alternatives

The following parts are listed as comparable options for similar P-channel MOSFET switching applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Si7851DP-T1-GE3RDS(on) = 0.075 Ω @ VGS = -4.5 V; Micro8 package; lower threshold (-0.5 V typ)Better suited for 3.3 V-only gate drive; slightly higher costSelect when driving from 3.3 V microcontrollers without negative bias generation
DMG3415L-7RDS(on) = 0.055 Ω @ VGS = -4.5 V; SOT-23-6 package; smaller footprint but lower current rating (-2.0 A)Limited to sub-2 A loads; not suitable for 3.6 A continuous operationChoose only for ultra-space-constrained designs where current demand is ≤2 A

Compared with Si7851DP-T1-GE3 and DMG3415L-7, IRF7606TR offers the best balance of 3.6 A current capability, -30 V rating, and Micro8 mechanical compatibility-making it optimal for mid-power portable load switching where both current headroom and board area are critical.

Availability

IRF7606TR is available at Aetrix Electronics and suitable for battery protection circuits, USB OTG load switches, synchronous buck converter high-side switches, and hot-swap controller back-end switches requiring stable component supply and long-term manufacturability.

Supply support for IRF7606TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive, and industrial control solutions.

IRF7606TR belongs to Infineon's legacy HEXFET Power MOSFET product line, designed specifically for high-efficiency, space-constrained DC power switching in consumer and portable electronics.

FAQ

Is IRF7606TR suitable for 3.3 V logic-level gate drive?

Yes. With a gate threshold voltage (VGS(th)) minimum of -1.0 V and guaranteed enhancement at VGS = -3.0 V, IRF7606TR fully turns on using standard 3.3 V microcontroller outputs referenced to its source. RDS(on) rises to 0.15 Ω at VGS = -4.5 V, still supporting efficient operation at moderate currents.

What is the maximum allowable junction temperature during pulsed operation?

The absolute maximum junction temperature is +150°C. Under pulsed conditions (≤300 µs width, ≤2% duty cycle), peak power dissipation may exceed the 1.8 W DC rating, provided transient thermal impedance limits junction temperature to ≤150°C - verified via Fig. 10 in the datasheet.

Does IRF7606TR have avalanche rating?

No. The datasheet does not specify rated unclamped inductive switching (UIS) or avalanche energy capability. Designers must implement external clamping (e.g., TVS diodes or RC snubbers) when switching inductive loads to prevent voltage overshoot beyond -30 V VDS.

Can IRF7606TR be used in parallel with identical units?

Yes, but with caution. Its negative temperature coefficient of RDS(on) promotes current sharing at elevated temperatures. However, layout symmetry, matched gate drive paths, and individual gate resistors are required to ensure balanced dynamic current distribution and avoid thermal runaway.

IRF7606TR Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HEXFET®
Package/Case:
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
FET Type:
P-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
30 V
Current - Continuous Drain (Id) @ 25°C:
3.6A (Ta)
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Rds On (Max) @ Id, Vgs:
90mOhm @ 2.4A, 10V
Vgs(th) (Max) @ Id:
1V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
30 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
520 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
1.8W (Ta)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
Micro8™

IRF7606TR FAQ

1.How can I place an order for IRF7606TR through Aetrix?

Please submit a Request for Quotation (RFQ) for IRF7606TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IRF7606TR reliable?

The price and inventory of IRF7606TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRF7606TR is usually 5 days.

3.What payment methods are accepted for IRF7606TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRF7606TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IRF7606TR?

IRF7606TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IRF7606TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IRF7606TR?

For technical support, including IRF7606TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRF7606TR requirements.

6.How does Aetrix verify that IRF7606TR is sourced from the original manufacturer or authorized distributors?

All IRF7606TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRF7606TR meets industry standards.

7.What is the process for return or replacement of IRF7606TR?

All IRF7606TR units undergo pre-shipment inspection (PSI). If there is an issue with IRF7606TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IRF7606TR part is unused and in its original packaging.

Return procedure for IRF7606TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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