Infineon Technologies IRF7707TRPBF
- Part No.:
- IRF7707TRPBF
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- 8-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
IRF7707TRPBF.pdf
- Description:
- MOSFET P-CH 20V 7A 8TSSOP
- Quantity:
- Payment:

- Shipping:

Inventory:8,517
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Product details
Overview
IRF7707TRPBF from Infineon Technologies (formerly International Rectifier) is a P-channel TSSOP-8 packaged HEXFET® Power MOSFET designed for low-voltage load switching and battery protection circuits. It delivers 22 mΩ RDS(on) at VGS = −4.5 V and ID = −7.0 A, supports −20 V VDS, operates across −55 °C to +150 °C, and features ultra-low profile (<1.2 mm) packaging ideal for space-constrained portable electronics.
For engineers reviewing the IRF7707TRPBF datasheet, IRF7707TRPBF pinout, IRF7707TRPBF application, or IRF7707TRPBF equivalent, key selection criteria include verified RDS(on) at −4.5 V gate drive, TSSOP-8 thermal resistance (83 °C/W), body diode forward voltage (−1.2 V @ −1.5 A), and pulsed drain current capability (−28 A).
Technical Context
This device implements a planar trench-gate P-channel MOSFET structure optimized for high efficiency in synchronous rectification and reverse polarity protection. Its gate threshold voltage (−0.45 V to −1.2 V) enables reliable turn-on with low-voltage logic-level control, while its 31 nC total gate charge and 10 nC Miller charge support moderate-speed switching in DC/DC converters and power OR-ing circuits.
The integrated body diode exhibits 142–213 ns reverse recovery time and 147–221 nC reverse recovery charge under defined conditions, enabling predictable performance in freewheeling paths. Thermal design is constrained by 83 °C/W junction-to-ambient resistance on standard PCB mounting, requiring careful layout for sustained 1.5 W dissipation at 25 °C ambient.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | −20 V - Maximum blocking voltage for battery-side load switches and reverse polarity protection |
| RDS(on) | 22 mΩ @ VGS = −4.5 V, ID = −7.0 A - Enables <150 mW conduction loss at 7 A continuous load |
| ID (continuous) | −7.0 A @ TA = 25 °C - Sustained current handling with adequate PCB copper area |
| Qg | 31 nC (typ) - Gate drive energy requirement for ~100 kHz PWM operation with standard drivers |
| RθJA | 83 °C/W - Junction-to-ambient thermal resistance on 1-inch² copper board, defining heatsinking needs |
| VSD | −1.2 V @ IS = −1.5 A - Forward voltage of integrated body diode for freewheeling path loss estimation |
| trr | 142 ns (typ) - Reverse recovery time affecting switching loss and EMI in inductive loads |
Pinout & Package
TSSOP-8 package: 3.0 × 3.0 mm footprint, 1.1 mm max height, lead-free, tape-and-reel compatible. Exposed drain pad on bottom for thermal enhancement (not electrically isolated).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4 | Source | Common source connection; internally bonded together for low-inductance, high-current return path |
| 5, 6, 7, 8 | Drain | Common drain connection; tied to exposed pad for thermal conduction and current carrying capacity |
| Gate | Control input | Single gate terminal (Pin 8 only); requires negative VGS for turn-on; sensitive to ESD |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low RDS(on) | 22 mΩ @ −4.5 V - Reduces conduction loss by >30% vs. comparable SO-8 P-MOSFETs at same voltage rating |
| TSSOP-8 footprint | 45% smaller than SO-8 - Enables high-density PCB layouts in smartphones, SSDs, and PCMCIA cards |
| Low-profile package | <1.2 mm height - Fits within mechanical envelopes of ultra-thin portable devices |
| Logic-level compatible | VGS(th) down to −0.45 V - Ensures robust turn-on with 3.3 V or 2.5 V microcontroller GPIO |
| Ruggedized construction | 150 °C max junction temperature - Supports operation in thermally demanding battery packs and industrial modules |
Applications
| Battery Protection Circuit | USB Power Switch |
|---|---|
Use Scenario: Bidirectional overvoltage/overcurrent protection in single-cell Li-ion battery packs. IC Role / Device Role / Timing Role: P-channel high-side switch controlling battery discharge path; activated during fault detection. Use Value: 22 mΩ RDS(on) limits voltage drop to <155 mV at 7 A, preserving battery runtime and thermal margin. | Use Scenario: Hot-swap power enable/disable for USB Type-C downstream ports. IC Role / Device Role / Timing Role: Load switch isolating VBUS from peripheral circuitry during insertion/removal. Use Value: Low 1.2 V body diode forward voltage minimizes dropout during reverse-current events, improving compliance with USB PD specifications. |
| Power OR-ing Controller | DC/DC Converter Synchronous Rectifier |
Use Scenario: Redundant power supply selection in telecom line cards and embedded controllers. IC Role / Device Role / Timing Role: Back-to-back P-MOSFET pair implementing ideal diode function with fast turn-off. Use Value: 142 ns reverse recovery time ensures clean commutation between supplies without shoot-through risk. | Use Scenario: Secondary-side synchronous rectification in isolated flyback or forward converters. IC Role / Device Role / Timing Role: Low-side rectifier replacing Schottky diode to reduce conduction loss. Use Value: 31 nC total gate charge allows efficient driving from standard gate driver ICs at 300–500 kHz switching frequencies. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar P-channel load switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Si7157DP-T1-GE3 | RDS(on) = 25 mΩ @ −4.5 V; Qg = 29 nC; TSSOP-8 | Higher RDS(on) increases conduction loss by ~14% at 7 A | Preferred where lower gate charge is prioritized over minimal on-resistance |
| DMG2307L-7 | RDS(on) = 32 mΩ @ −4.5 V; SO-8 package; RθJA = 62 °C/W | Larger SO-8 footprint and higher thermal resistance limit power density | Suitable when board space is less constrained but higher thermal mass is acceptable |
Compared with Si7157DP-T1-GE3 and DMG2307L-7, IRF7707TRPBF offers the lowest RDS(on) in TSSOP-8, enabling highest efficiency in compact battery-powered systems where both size and thermal performance are critical.
Availability
IRF7707TRPBF is available at Aetrix Electronics and suitable for battery management systems, USB power delivery modules, redundant power OR-ing circuits, and portable DC/DC converter designs requiring stable component supply and long-term manufacturability.
Supply support for IRF7707TRPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader specializing in power management, automotive, and industrial control solutions, with deep expertise in silicon-based power devices and system-level integration.
The IRF7707TRPBF belongs to Infineon's legacy HEXFET® P-channel MOSFET product line, engineered specifically for high-efficiency, space-constrained load switching in consumer and portable electronics.
FAQ
What is the maximum continuous drain current at 70°C ambient?
The IRF7707TRPBF supports −5.7 A continuous drain current at TA = 70 °C with VGS = −4.5 V, based on its 1.0 W maximum power dissipation rating and 83 °C/W thermal resistance. This assumes standard mounting on 1 inch² copper PCB; derating is required for smaller copper areas or forced-air cooling absence.
Does this MOSFET require a gate driver for microcontroller interfacing?
No external gate driver is required for basic on/off control with 3.3 V or 2.5 V GPIO, as its gate threshold voltage ranges from −0.45 V to −1.2 V and it turns fully on at −4.5 V. However, a dedicated driver improves switching speed and reduces gate ringing in high-frequency or high-current applications.
Is the exposed drain pad electrically connected to the drain terminals?
Yes - the exposed pad on the underside of the TSSOP-8 package is internally connected to pins 5–8 (drain) and must be soldered to a PCB copper pour for optimal thermal performance and current handling. It is not isolated and must be treated as part of the drain node in layout.
Can IRF7707TRPBF be used in linear regulation mode?
It is not recommended for sustained linear operation due to limited safe operating area (SOA) at high VDS/ID combinations. The device is optimized for switching applications; linear use risks thermal runaway above ~1 W dissipation without active heatsinking and precise bias control.
IRF7707TRPBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- 8-TSSOP (0.173", 4.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- P-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 20 V
- Current - Continuous Drain (Id) @ 25°C:
- 7A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 2.5V, 4.5V
- Rds On (Max) @ Id, Vgs:
- 22mOhm @ 7A, 4.5V
- Vgs(th) (Max) @ Id:
- 1.2V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 47 nC @ 4.5 V
- Vgs (Max):
- ±12V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2361 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 1.5W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-TSSOP
IRF7707TRPBF FAQ
1.How can I place an order for IRF7707TRPBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRF7707TRPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRF7707TRPBF reliable?
The price and inventory of IRF7707TRPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRF7707TRPBF is usually 5 days.
3.What payment methods are accepted for IRF7707TRPBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRF7707TRPBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRF7707TRPBF?
IRF7707TRPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRF7707TRPBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRF7707TRPBF?
For technical support, including IRF7707TRPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRF7707TRPBF requirements.
6.How does Aetrix verify that IRF7707TRPBF is sourced from the original manufacturer or authorized distributors?
All IRF7707TRPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRF7707TRPBF meets industry standards.
7.What is the process for return or replacement of IRF7707TRPBF?
All IRF7707TRPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRF7707TRPBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRF7707TRPBF part is unused and in its original packaging.
Return procedure for IRF7707TRPBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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