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Infineon Technologies IRF7807Z

Part No.:
IRF7807Z
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
8-SOIC (0.154", 3.90mm Width)
Datasheet:
AetrixIRF7807Z.pdf
Description:
MOSFET N-CH 30V 11A 8SO
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:6,666

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Product details

Overview

IRF7807Z from Infineon Technologies is a 30V, 11A N-channel enhancement-mode HEXFET Power MOSFET in SO-8 package, featuring 13.8 mΩ RDS(on) at VGS = 10 V, 7.2 nC total gate charge, and fully characterized avalanche capability. It serves as a control FET in notebook CPU VRMs and synchronous rectifier in POL converters for graphics cards and telecom systems.

For engineers reviewing the IRF7807Z datasheet, IRF7807Z pinout, IRF7807Z application, or IRF7807Z equivalent, key selection criteria include low RDS(on) at 4.5 V drive, ultra-low gate impedance (2.5 Ω typ.), and validated unclamped inductive switching performance up to 63 mJ at TJ = 25°C.

Technical Context

This MOSFET employs planar silicon process with integral body diode optimized for high-frequency synchronous buck topologies. Its gate threshold voltage (1.35–2.25 V) enables robust 4.5 V logic-level drive, while Qgd/Qgs1 ratio of ~1.3 minimizes Cdv/dt turn-on risk in high-dV/dt switching nodes.

Thermal design is supported by RθJA = 50 °C/W (SO-8, FR-4, 1-in² copper) and RθJL = 20 °C/W, enabling 8.7 A continuous current at TA = 70°C. Avalanche energy rating (EAS = 63 mJ) and 100% RG testing ensure reliability in transient overloads.

Key Specifications

ParameterValue and Actual Design Meaning
VDS30 V - Maximum blocking voltage compatible with 24 V input rails and 5 V/3.3 V output POL stages.
RDS(on) max13.8 mΩ @ VGS = 10 V - Enables <1.1 W conduction loss at 11 A DC, critical for high-efficiency VRM designs.
Qg typ.7.2 nC - Low gate charge reduces driver power loss and supports >1 MHz switching in compact converters.
ID cont. @ TA = 70°C8.7 A - Sustained current capability under real-world board-level thermal conditions.
EAS63 mJ - Validated single-pulse avalanche energy ensures robustness against inductive switching transients.
RG2.5 Ω typ. - Ultra-low intrinsic gate resistance improves switching speed control and reduces ringing.
VGS(th)1.35–2.25 V - Tight threshold range guarantees reliable turn-on with 3.3 V or 4.5 V gate drivers.

Pinout & Package

IRF7807Z is housed in a standard SO-8 surface-mount package with exposed drain pad for enhanced thermal performance. Pin 1–3 and 5–7 are drain terminals; Pin 4 is gate; Pins 6 and 8 are source terminals - confirmed per Infineon's top-view diagram and mechanical drawing PS-0019.

Pin/TerminalCircuit RoleDesign Meaning
1,2,3,5,7Drain (D)Five parallel drain connections reduce package inductance and improve current sharing in high-di/dt applications.
4Gate (G)Single gate input with low RG (2.5 Ω) enables fast, controlled turn-on without external gate resistor in many cases.
6,8Source (S)Dual-source configuration lowers source inductance and improves stability in synchronous rectification mode.

Key Features

FeatureDesign Value
Very low RDS(on) at 4.5 V VGS14.5 mΩ max - Ensures efficient operation directly from common 5 V or 4.5 V controller outputs without level-shifting.
Fully characterized avalanche voltage/current63 mJ EAS, 8.8 A IAR - Eliminates need for external snubbers in non-isolated DC/DC converters with inductive loads.
Ultra-low gate impedance2.5 Ω typical - Reduces gate oscillation risk and simplifies gate driver layout in high-density VRM modules.
100% tested RGGuaranteed 2.5–4.8 Ω - Enables predictable switching timing and consistent gate drive power calculation across production lots.
Optimized body diodeQrr = 17–26 nC, trr = 31–46 ns - Minimizes reverse recovery losses when used as synchronous rectifier in buck converters.

Applications

Notebook CPU Voltage RegulatorGraphics Card POL Converter

Use Scenario: High-current, multi-phase VRM supplying Intel/AMD mobile processors with dynamic load steps up to 100 A/µs.

IC Role / Device Role / Timing Role: Control FET switching at 300–1000 kHz; handles high-side switching with precise duty-cycle control.

Use Value: 13.8 mΩ RDS(on) and 7.2 nC Qg jointly reduce total power loss below 2.5 W per phase at 11 A, enabling fanless thermal design.

Use Scenario: Point-of-load regulation for GPU core voltage (0.8–1.2 V) in space-constrained PCIe add-in cards.

IC Role / Device Role / Timing Role: Synchronous rectifier FET operating in low-side position with 500 kHz–1.5 MHz switching frequency.

Use Value: Low Qrr (17–26 nC) and fast trr (31–46 ns) minimize shoot-through risk and conduction loss during dead-time transitions.

Telecom DC/DC ModuleIndustrial Embedded Power Supply

Use Scenario: 48 V input to 3.3 V/5 V conversion in network switches and base station line cards requiring high reliability.

IC Role / Device Role / Timing Role: Primary switch in isolated forward or non-isolated buck converter; rated for continuous 8.7 A at 70°C ambient.

Use Value: RθJA = 50 °C/W and 100% RG test support stable thermal performance across extended temperature range (−55°C to +150°C).

Use Scenario: Compact 24 V input to 5 V/12 V conversion in programmable logic controllers and industrial HMIs.

IC Role / Device Role / Timing Role: Secondary-side synchronous rectifier in active-clamp forward or LLC resonant topology.

Use Value: Fully characterized avalanche capability (63 mJ) provides margin against bus transients and inrush currents in harsh industrial environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IRF7807PBFSame die, Pb-free variant; identical RDS(on), Qg, and avalanche specs.No functional difference; RoHS-compliant version for lead-free assembly.Select when lead-free compliance is required by end-market regulations.
Si7842DP30 V, 12 A, RDS(on) = 12.5 mΩ @ 10 V, Qg = 8.5 nC; trench MOSFET architecture.Slightly lower RDS(on) but higher Qg; less optimized for 4.5 V drive (VGS(th) = 1.2–2.0 V).Prefer for marginally lower conduction loss where gate drive strength permits higher Qg.

Compared with IRF7807Z, IRF7807PBF offers identical electrical performance with RoHS compliance, while Si7842DP trades slightly lower on-resistance for higher gate charge and reduced 4.5 V drive margin - making IRF7807Z optimal for cost-sensitive, high-frequency notebook and telecom VRMs.

Availability

IRF7807Z is available at Aetrix Electronics and suitable for notebook CPU VRMs, graphics card POL converters, and telecom DC/DC modules requiring stable component supply and long-term lifecycle support.

Supply support for IRF7807Z includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, automotive electronics, and industrial control ICs, with global manufacturing and quality certification to ISO/TS 16949 and ISO 9001.

The IRF7807Z belongs to Infineon's HEXFET® Power MOSFET product line, engineered specifically for high-efficiency, high-frequency DC/DC conversion in computing and communications infrastructure.

FAQ

What is the maximum continuous drain current at 100°C case temperature?

At TC = 100°C, the maximum continuous drain current is derated to approximately 5.2 A based on the linear derating factor of 0.02 W/°C and RDS(on)-limited conduction loss. This value is derived from Fig. 9 in the official datasheet and assumes SO-8 mounting on 1-in² copper.

Does IRF7807Z support 3.3 V gate drive?

No - the minimum VGS(th) is 1.35 V, but RDS(on) rises sharply below 4.5 V. At 3.3 V, RDS(on) exceeds 35 mΩ (per Fig. 3 transfer curve), causing excessive conduction loss. It is specified and characterized for reliable operation at ≥4.5 V gate drive.

How is the SO-8 package thermally enhanced in this device?

The SO-8 package features an exposed drain pad on the bottom side, electrically connected to pins 1–3 and 5–7. When soldered to a thermal pad on the PCB, it achieves RθJL = 20 °C/W, significantly improving heat transfer versus standard SO-8 variants without exposed pads.

Can IRF7807Z be used as a replacement for IRF7805Z?

No - IRF7805Z has VDS = 20 V and RDS(on) = 11.5 mΩ @ 10 V, while IRF7807Z is rated for 30 V and 13.8 mΩ. Substituting increases voltage margin but degrades conduction efficiency; gate charge (7.2 nC vs. 6.3 nC) and threshold (1.35–2.25 V vs. 1.2–2.0 V) also differ, affecting drive compatibility.

IRF7807Z Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HEXFET®
Package/Case:
8-SOIC (0.154", 3.90mm Width)
Packaging:
Tube
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
30 V
Current - Continuous Drain (Id) @ 25°C:
11A (Ta)
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Rds On (Max) @ Id, Vgs:
13.8mOhm @ 11A, 10V
Vgs(th) (Max) @ Id:
2.25V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
11 nC @ 4.5 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
770 pF @ 15 V
FET Feature:
-
Power Dissipation (Max):
2.5W (Ta)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-SO

IRF7807Z FAQ

1.How can I place an order for IRF7807Z through Aetrix?

Please submit a Request for Quotation (RFQ) for IRF7807Z on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IRF7807Z reliable?

The price and inventory of IRF7807Z are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRF7807Z is usually 5 days.

3.What payment methods are accepted for IRF7807Z?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRF7807Z transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IRF7807Z?

IRF7807Z orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IRF7807Z order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IRF7807Z?

For technical support, including IRF7807Z datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRF7807Z requirements.

6.How does Aetrix verify that IRF7807Z is sourced from the original manufacturer or authorized distributors?

All IRF7807Z products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRF7807Z meets industry standards.

7.What is the process for return or replacement of IRF7807Z?

All IRF7807Z units undergo pre-shipment inspection (PSI). If there is an issue with IRF7807Z, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IRF7807Z part is unused and in its original packaging.

Return procedure for IRF7807Z:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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