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Infineon Technologies IRF7807ZPBF

Part No.:
IRF7807ZPBF
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
8-SOIC (0.154", 3.90mm Width)
Datasheet:
AetrixIRF7807ZPBF.pdf
Description:
MOSFET N-CH 30V 11A 8SO
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:6,199

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Product details

Overview

IRF7807ZPBF from Infineon Technologies is a 30V, 11A N-channel enhancement-mode HEXFET Power MOSFET in SO-8 package, featuring 13.8 mΩ RDS(on) at VGS = 10 V, 7.2 nC total gate charge, and fully characterized avalanche capability. It serves as a control FET in notebook processor power stages and synchronous rectifier in POL converters for graphics cards and telecom systems.

For engineers reviewing the IRF7807ZPBF datasheet, IRF7807ZPBF pinout, IRF7807ZPBF application, or IRF7807ZPBF equivalent, key selection criteria include RDS(on) at 4.5 V, Qgd/Qgs1 ratio for Cdv/dt immunity, body diode reverse recovery (Qrr = 17–26 nC), and SO-8 thermal performance (RθJA = 50 °C/W).

Technical Context

This MOSFET employs planar silicon HEXFET architecture optimized for high-frequency DC/DC conversion. Its low 2.5 Ω gate resistance and 100% RG-tested construction ensure consistent switching timing (td(on) = 6.9 ns, tf = 3.1 ns) and robust unclamped inductive switching performance up to 63 mJ EAS.

The device integrates an integral reverse p–n junction body diode with VSD ≤ 1.0 V at IS = 8.8 A and trr = 31–46 ns, enabling synchronous rectification without external diodes. Its gate threshold voltage (1.35–2.25 V) and negative temperature coefficient (∆VGS(th)/∆TJ = −4.7 mV/°C) support stable current sharing in paralleled configurations.

Key Specifications

ParameterValue and Actual Design Meaning
VDS30 V - Maximum blocking voltage compatible with 24 V input rails and transient margin in POL converters.
RDS(on) max13.8 mΩ @ VGS = 10 V - Enables <1.3 W conduction loss at 11 A DC, critical for thermally constrained notebook VRMs.
Qg typ.7.2 nC - Low gate drive energy reduces controller loading and enables efficient 500 kHz–1 MHz operation.
Qgd2.7 nC - Low Miller charge minimizes Cdv/dt turn-on risk in high-dV/dt synchronous buck nodes.
RθJA50 °C/W - Defines maximum power dissipation (1.6 W at TA = 70 °C) in standard SO-8 PCB layouts.
Qrr17–26 nC - Quantifies body diode recovery loss transferred to high-side FET during dead-time commutation.
EAS63 mJ - Specifies single-pulse avalanche ruggedness for reliable operation under inductive fault conditions.

Pinout & Package

IRF7807ZPBF is housed in a standard SO-8 surface-mount package with exposed drain pad for enhanced thermal conduction. Pin 1–3 and 5–7 are parallel-connected drain terminals; Pin 4 is gate; Pins 6 and 8 are source terminals.

Pin/TerminalCircuit RoleDesign Meaning
1, 2, 3, 5, 7Drain (D)High-current output node tied to input rail; multiple pins reduce current density and parasitic inductance.
4Gate (G)Control input requiring <7.2 nC charge; low 2.5 Ω internal RG ensures predictable turn-on timing.
6, 8Source (S)Power return path; dual-source pins lower loop inductance and improve body diode conduction uniformity.

Key Features

FeatureDesign Value
Ultra-low RDS(on) at 4.5 V14.5 mΩ - Enables direct drive from 5 V controllers without level-shifting, reducing BOM count.
Fully characterized avalanche63 mJ EAS @ TJ = 25 °C - Guarantees safe operation during inductive load dump or startup faults.
100% RG-tested2.5–4.8 Ω gate resistance - Ensures tight distribution of switching speed and eliminates need for external gate resistors.
Low Qgd/Qgs1 ratio2.7 nC / 2.1 nC ≈ 1.29 - Reduces susceptibility to spurious turn-on from high dV/dt on synchronous node.

Applications

Notebook CPU Voltage RegulatorGraphics Card POL Converter

Use Scenario: High-efficiency, space-constrained 1–2 phase VRM supplying 0.8–1.5 V @ up to 45 A to mobile Intel/AMD processors.

IC Role / Device Role / Timing Role: High-side control FET switching at 300–600 kHz; handles peak currents >11 A with minimal conduction loss.

Use Value: 13.8 mΩ RDS(on) limits I²R loss to <0.5 W per phase, enabling fanless thermal design in ultrabooks.

Use Scenario: Point-of-load converter delivering 0.9–1.2 V @ 20–30 A to GPU cores in PCIe-based graphics cards.

IC Role / Device Role / Timing Role: Synchronous rectifier (low-side FET) operating with 500 kHz–1 MHz frequency and <100 ns dead time.

Use Value: Low Qrr (17–26 nC) and fast trr (31–46 ns) minimize cross-conduction loss and reduce heating in compact GPU VRMs.

Telecom DC/DC ModuleIndustrial Embedded Power Supply

Use Scenario: 24 V input to 3.3/5/12 V isolated or non-isolated converters in network switches and baseband units.

IC Role / Device Role / Timing Role: Primary-side switch in active-clamp forward or synchronous buck topologies; rated for continuous 8.7 A at 70 °C ambient.

Use Value: RθJA = 50 °C/W and 100% avalanche testing ensure reliability across extended temperature range (−55 to +150 °C).

Use Scenario: Compact 24 V to 5 V/3.3 V power stage in programmable logic controllers and industrial HMIs.

IC Role / Device Role / Timing Role: Secondary-side synchronous rectifier in 300–500 kHz flyback or buck converters; operates with 4.5 V gate drive.

Use Value: 14.5 mΩ RDS(on) @ VGS = 4.5 V maintains efficiency >92% even with low-voltage gate drivers.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IRF7807TRPBFTape-and-reel packaging only; identical electrical specs and SO-8 footprint.No difference in circuit function or layout; intended for automated SMT assembly.Select when volume production requires reel delivery and pick-and-place compatibility.
Si7807DP-T1-GE3Higher RDS(on) (16 mΩ @ 10 V), lower Qg (5.8 nC), same SO-8 package.Better light-load efficiency due to lower gate charge, but higher conduction loss above 6 A.Prefer for telecom POLs where switching loss dominates; avoid in high-current notebook VRMs.

Compared with IRF7807ZPBF, IRF7807TRPBF offers identical performance in tape format for SMT lines, while Si7807DP-T1-GE3 trades higher conduction loss for reduced gate drive loss-making it suitable for medium-current, high-frequency telecom supplies but less optimal for high-current notebook VRMs.

Availability

IRF7807ZPBF is available at Aetrix Electronics and suitable for notebook CPU voltage regulators, graphics card POL converters, and telecom DC/DC modules requiring stable component supply and guaranteed long-term availability.

Supply support for IRF7807ZPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, automotive, and industrial control ICs and discrete devices.

The IRF HEXFET Power MOSFET product line targets high-efficiency, high-frequency DC/DC conversion in computing, telecom, and industrial power supplies-with emphasis on low RDS(on), controlled gate charge, and rugged avalanche performance.

FAQ

What is the maximum continuous drain current at 70°C ambient?

The IRF7807ZPBF supports 8.7 A continuous drain current at TA = 70 °C with proper PCB copper area (1 in² 2 oz Cu). This rating assumes SO-8 mounting on standard FR-4 with no forced airflow and accounts for RθJA = 50 °C/W and thermal derating beyond 25 °C ambient.

Does this MOSFET require a gate resistor for stability?

No external gate resistor is required for basic stability-the device has a tested internal RG of 2.5–4.8 Ω. However, a small series resistor (2–10 Ω) may be added to damp ringing in high-di/dt applications or to fine-tune switching speed for EMI optimization in sensitive telecom designs.

Can IRF7807ZPBF be used as a synchronous rectifier with 5 V gate drive?

Yes-it delivers 14.5 mΩ RDS(on) at VGS = 4.5 V, making it fully compatible with 5 V logic-level gate drivers. Its low Qgd/Qgs1 ratio also mitigates Cdv/dt turn-on risk when placed on high-dV/dt nodes typical of synchronous buck outputs.

How does its body diode performance compare to Schottky alternatives?

The integrated body diode has VSD ≤ 1.0 V and trr = 31–46 ns-higher forward drop and slower recovery than discrete Schottkys, but eliminates component count and layout complexity. For <1 MHz operation with moderate current (<15 A), it provides acceptable efficiency; above that, external Schottky clamping may be preferred.

IRF7807ZPBF Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HEXFET®
Package/Case:
8-SOIC (0.154", 3.90mm Width)
Packaging:
Tube
Product Status:
Discontinued at Digi-Key
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
30 V
Current - Continuous Drain (Id) @ 25°C:
11A (Ta)
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Rds On (Max) @ Id, Vgs:
13.8mOhm @ 11A, 10V
Vgs(th) (Max) @ Id:
2.25V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
11 nC @ 4.5 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
770 pF @ 15 V
FET Feature:
-
Power Dissipation (Max):
2.5W (Ta)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-SO

IRF7807ZPBF FAQ

1.How can I place an order for IRF7807ZPBF through Aetrix?

Please submit a Request for Quotation (RFQ) for IRF7807ZPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IRF7807ZPBF reliable?

The price and inventory of IRF7807ZPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRF7807ZPBF is usually 5 days.

3.What payment methods are accepted for IRF7807ZPBF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRF7807ZPBF transactions.

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IRF7807ZPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IRF7807ZPBF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IRF7807ZPBF?

For technical support, including IRF7807ZPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRF7807ZPBF requirements.

6.How does Aetrix verify that IRF7807ZPBF is sourced from the original manufacturer or authorized distributors?

All IRF7807ZPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRF7807ZPBF meets industry standards.

7.What is the process for return or replacement of IRF7807ZPBF?

All IRF7807ZPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRF7807ZPBF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IRF7807ZPBF part is unused and in its original packaging.

Return procedure for IRF7807ZPBF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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