Infineon Technologies IRF7807ZTRPBF
- Part No.:
- IRF7807ZTRPBF
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
IRF7807ZTRPBF.pdf
- Description:
- MOSFET N-CH 30V 11A 8SO
- Quantity:
- Payment:

- Shipping:

Inventory:3,071
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IRF7807ZTRPBF from Infineon Technologies is a 30V, 11A N-channel enhancement-mode HEXFET Power MOSFET in SO-8 package, optimized as a control FET in notebook CPU VRMs and synchronous rectifier in POL converters for graphics cards and telecom systems, featuring 13.8 mΩ RDS(on) at VGS = 10 V, 7.2 nC total gate charge, and 100% avalanche-tested robustness.
For engineers reviewing the IRF7807ZTRPBF datasheet, IRF7807ZTRPBF pinout, IRF7807ZTRPBF application, or IRF7807ZTRPBF equivalent, key selection criteria include low RDS(on) at 4.5 V drive, ultra-low gate impedance (2.5 Ω typ.), fully characterized unclamped inductive switching behavior, and SO-8 thermal performance with RθJA = 50 °C/W.
Technical Context
This MOSFET operates as a high-side control switch in synchronous buck converters, where fast turn-on/turn-off dynamics (td(on) = 6.9 ns, tf = 3.1 ns) and low Qgd/Qgs1 ratio minimize Cdv/dt induced shoot-through risk during high dV/dt node transitions. Its body diode exhibits 31–46 ns reverse recovery time and 17–26 nC Qrr, critical for synchronous rectification efficiency.
The device is fully specified across temperature: RDS(on) increases to 18.2 mΩ max at TJ = 125°C, VGS(th) drifts −4.7 mV/°C, and BVDSS has +0.023 V/°C tempco - enabling accurate loss modeling in thermally constrained VRM designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 30 V - Maximum blocking voltage in high-side switch position without breakdown under transient overvoltage conditions. |
| RDS(on) max @ 10 V | 13.8 mΩ - Conduction loss contributor; enables ≤1.5 W I²R loss at 11 A DC current in compact SO-8 footprint. |
| Qg typ. | 7.2 nC - Gate drive energy requirement; determines minimum gate driver peak current needed for <10 ns switching. |
| ID @ 25°C | 11 A - Continuous drain current rating at ambient; derates to 8.7 A at 70°C case temperature per SO-8 thermal limits. |
| EAS | 63 mJ - Single-pulse avalanche energy capability; supports reliable operation during inductive load transients without failure. |
| RθJA | 50 °C/W - Junction-to-ambient thermal resistance; defines maximum power dissipation before exceeding 150°C TJ at 25°C ambient. |
| VGS(th) | 1.35–2.25 V - Gate threshold range; ensures reliable turn-on with 3.3 V or 5 V logic-level gate drivers in control FET role. |
Pinout & Package
IRF7807ZTRPBF is housed in a standard SO-8 surface-mount package with exposed drain pad for enhanced thermal conduction. Pin 1 is gate (G), pins 2–4 and 6–8 are parallel-connected drains (D), and pins 5 and 7 are sources (S). The top view shows pin 1 at bottom-left corner.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Gate (G) | Control terminal; accepts PWM signal from controller IC; low input capacitance (Ciss = 770 pF) reduces driver loading. |
| 2,3,4,6,7,8 | Drain (D) | High-side switch node connection; multiple pins reduce parasitic inductance and improve current sharing in high-frequency switching. |
| 5,7 | Source (S) | Return path for channel current; dual-source pins lower source inductance, improving stability in synchronous rectifier mode. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low RDS(on) at 4.5 V | 14.5 mΩ max - Enables use with 4.5 V gate drive in modern low-voltage VRMs without sacrificing conduction efficiency. |
| Fully characterized avalanche | 100% tested EAS = 63 mJ - Guarantees ruggedness against inductive energy spikes during hard-switching events. |
| Low gate resistance | RG = 2.5 Ω typ. - Reduces gate oscillation risk and improves controllability of switching edges in high-dV/dt environments. |
| Lead-free and RoHS compliant | Meets IPC-J-STD-020 moisture sensitivity level 1 - Supports standard reflow profiles without preconditioning. |
| Optimized for synchronous rectification | Qrr = 17–26 nC, trr = 31–46 ns - Minimizes reverse recovery losses and cross-conduction risk when used as low-side FET. |
Applications
| Notebook CPU Voltage Regulator | Graphics Card POL Converter |
|---|---|
Use Scenario: High-current, high-efficiency step-down conversion delivering up to 45 A to mobile Intel/AMD processors. IC Role / Device Role: Control FET (high-side switch) in synchronous buck topology, driven by dedicated PWM controller. Use Value: 13.8 mΩ RDS(on) at 10 V and 7.2 nC Qg enable >92% efficiency at 1 MHz switching frequency under full load. | Use Scenario: Point-of-load regulation for GPU core voltage in discrete graphics cards requiring fast transient response. IC Role / Device Role: Synchronous rectifier (low-side FET), replacing Schottky diode to reduce forward drop and conduction loss. Use Value: Body diode Qrr = 26 nC max and VSD = 1.0 V enable 3–5% efficiency gain versus diode solution at 20 A output. |
| Telecom DC/DC Module | Industrial Embedded Power Supply |
Use Scenario: Compact 12 V input to 1.2 V/30 A output converter in network line card power subsystems. IC Role / Device Role: Primary switching element in multiphase buck stage, operating at 500 kHz–1 MHz. Use Value: SO-8 thermal design with RθJA = 50 °C/W allows stable operation at 70°C ambient without heatsink in dense PCB layouts. | Use Scenario: Reliable, long-lifetime power stage in fanless industrial controllers requiring extended temperature operation. IC Role / Device Role: High-reliability control FET in isolated or non-isolated DC/DC converter with strict MTBF requirements. Use Value: 100% avalanche-tested construction and −55°C to +150°C TSTG/TJ rating ensure field durability under voltage surge and thermal cycling stress. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRF7807PBF | Same die, non-lead-free variant; identical RDS(on), Qg, and SO-8 footprint. | No RoHS compliance; unsuitable for lead-free assembly processes. | Select only if legacy Pb-based soldering is mandated and environmental certification is not required. |
| Si7842DP-T1-GE3 | 30 V, 12.5 A, RDS(on) = 12.5 mΩ @ 10 V, Qg = 8.5 nC, SO-8 package. | Slightly higher gate charge; different Qgd/Qgs1 ratio affects Cdv/dt immunity. | Valid alternative if margin exists in gate drive strength and shoot-through risk is mitigated via layout or gate resistor tuning. |
Compared with IRF7807ZTRPBF, IRF7807PBF offers identical electrical performance but lacks RoHS compliance, while Si7842DP-T1-GE3 trades marginally lower RDS(on) for higher Qg and altered switching behavior - requiring validation of gate drive capability and shoot-through immunity in target topology.
Availability
IRF7807ZTRPBF is available at Aetrix Electronics and suitable for notebook CPU VRMs, graphics card POL converters, and telecom DC/DC modules requiring stable component supply, consistent parametric performance, and long-term manufacturing continuity.
Supply support for IRF7807ZTRPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive, and industrial control ICs and discrete devices, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.
The IRF HEXFET® Power MOSFET product line targets high-efficiency, high-frequency DC/DC conversion in computing, telecom, and consumer power systems, emphasizing low RDS(on), fast switching, and rugged avalanche performance.
FAQ
What is the maximum continuous drain current for IRF7807ZTRPBF at 70°C case temperature?
The maximum continuous drain current is 8.7 A at TA = 70°C with VGS = 10 V, as specified in the Absolute Maximum Ratings table. This derating reflects SO-8 package thermal limitations and ensures junction temperature remains below 150°C under steady-state conduction.
Can IRF7807ZTRPBF be driven directly by a 3.3 V microcontroller GPIO?
No - its VGS(th) range is 1.35–2.25 V, but RDS(on) rises sharply below 4.5 V. At 3.3 V, RDS(on) exceeds 25 mΩ, causing excessive conduction loss. A dedicated gate driver or level-shifting circuit is required for reliable saturation.
Does IRF7807ZTRPBF include an integrated Schottky diode?
No - it contains only the intrinsic body diode formed by the MOSFET's p-n junction. This diode has VSD = 1.0 V max and trr = 31–46 ns. No external or integrated Schottky is present; synchronous rectification relies on controlled channel conduction, not diode replacement.
How is avalanche ruggedness validated for this part?
Each unit undergoes 100% production testing for unclamped inductive switching (UIS) per JEDEC JESD22-A109. Tested at IAS = 8.8 A with L = 0.1 mH, VDD = 15 V, yielding EAS ≥ 63 mJ - confirming ability to absorb inductive energy without parametric shift or failure.
IRF7807ZTRPBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 11A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 13.8mOhm @ 11A, 10V
- Vgs(th) (Max) @ Id:
- 2.25V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 11 nC @ 4.5 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 770 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 2.5W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SO
IRF7807ZTRPBF FAQ
1.How can I place an order for IRF7807ZTRPBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRF7807ZTRPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRF7807ZTRPBF reliable?
The price and inventory of IRF7807ZTRPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRF7807ZTRPBF is usually 5 days.
3.What payment methods are accepted for IRF7807ZTRPBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRF7807ZTRPBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRF7807ZTRPBF?
IRF7807ZTRPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRF7807ZTRPBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRF7807ZTRPBF?
For technical support, including IRF7807ZTRPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRF7807ZTRPBF requirements.
6.How does Aetrix verify that IRF7807ZTRPBF is sourced from the original manufacturer or authorized distributors?
All IRF7807ZTRPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRF7807ZTRPBF meets industry standards.
7.What is the process for return or replacement of IRF7807ZTRPBF?
All IRF7807ZTRPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRF7807ZTRPBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRF7807ZTRPBF part is unused and in its original packaging.
Return procedure for IRF7807ZTRPBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IRF7807ZTRPBF Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

