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Infineon Technologies IRF7809

Part No.:
IRF7809
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
8-SOIC (0.154", 3.90mm Width)
Datasheet:
AetrixIRF7809.pdf
Description:
MOSFET N-CH 30V 17.6A 8SO
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:5,157

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Product details

Overview

IRF7809 from International Rectifier is an N-channel HEXFET® Power MOSFET designed as a synchronous rectifier (Sync FET) in high-efficiency CPU core DC-DC converters. It features 30 V VDS, 7.5 mΩ RDS(on) at VGS = 4.5 V, 77.5 nC total gate charge, 3.5 W power dissipation at TA = 25°C, and SO-8 package with CopperStrap™ interconnect for low thermal resistance.

For engineers reviewing the IRF7809 datasheet, IRF7809 pinout, IRF7809 application in multiphase VRMs, or IRF7809 equivalent for high-current synchronous buck stages, this device delivers verified conduction and switching loss trade-offs critical for mobile processor power delivery under tight thermal constraints.

Technical Context

The IRF7809 operates as a low-side synchronous rectifier in multiphase buck converters, where its 7.5 mΩ on-resistance minimizes I²R losses during high-current conduction (up to 17.6 A continuous), and its 77.5 nC gate charge enables efficient drive with standard PWM controllers. Its Qsw of 23.9 nC and Qoss of 30 nC support fast switching transitions while limiting shoot-through risk and capacitive energy loss.

Thermally, the SO-8 package uses CopperStrap™ interconnect to achieve RθJL = 20°C/W and RθJA = 35°C/W (on 1-in² copper board), enabling sustained operation at TJ ≤ 150°C under 16.3 A load at TL = 90°C - a key requirement for compact VRM layouts near CPU die.

Key Specifications

ParameterValue and Actual Design Meaning
VDS30 V - supports input rails up to 24 V with 25% margin for transient spikes in notebook/desktop VRMs
RDS(on)7.5 mΩ @ VGS = 4.5 V - reduces conduction loss to <120 mW at 15 A, critical for >90% efficiency targets
QG77.5 nC - determines gate driver current demand; requires ≥2 A peak drive for <100 ns turn-on in 500 kHz+ converters
ID (cont)17.6 A @ TA = 25°C - enables single-device use in 20–25 A per-phase designs without paralleling
RθJL20°C/W - enables direct thermal coupling to PCB copper pour, reducing need for heatsinks in space-constrained modules
Qrr94 nC - quantifies body diode reverse recovery charge; impacts crossover loss when used as low-side switch

Pinout & Package

IRF7809 is housed in a standard SO-8 surface-mount package with exposed drain paddle (thermally enhanced). The package uses CopperStrap™ interconnect technology to reduce both electrical resistance and junction-to-lead thermal resistance.

Pin/TerminalCircuit RoleDesign Meaning
1, 2, 3, 4, 5, 7, 8Drain (D)Internally connected to exposed metal pad; carries main power current and serves as primary thermal path to PCB
6Gate (G)Controls channel conduction; requires clean, low-inductance gate drive trace to minimize ringing and EMI
Source (S)Source (S)Pins 1–5 and 7–8 are internally tied to source; provides return path for load current and reference for gate drive

Key Features

FeatureDesign Value
CopperStrap™ interconnectReduces RθJL to 20°C/W and lowers parasitic inductance vs. standard wire-bonded SO-8, improving thermal response and switching fidelity
Low QG/RDS(on) ratio77.5 nC / 7.5 mΩ = 10.3 nC/mΩ - balances drive strength and conduction loss better than legacy Sync FETs in 30 V class
Body diode Qrr94 nC - measured under 700 A/µs di/dt, enabling predictable dead-time optimization in synchronous buck topologies
100% RDS(on) testedEnsures guaranteed maximum on-resistance across production lots, eliminating binning for VRM current-sharing accuracy

Applications

Mobile CPU Core VRMServer DDR Memory Regulator

Use Scenario: High-density, multi-phase buck converter supplying 0.8–1.3 V @ up to 120 A to ARM or x86 mobile processors in ultrabooks and tablets.

IC Role / Device Role / Timing Role: Low-side synchronous rectifier operating at 300–1000 kHz, commutated by dedicated gate driver IC.

Use Value: Single IRF7809 per phase handles 17.6 A continuous, reducing component count and PCB area versus paralleled 12 V FETs.

Use Scenario: Point-of-load regulator delivering 1.2 V @ 30 A to DDR4/DDR5 memory subsystems in edge servers and AI accelerators.

IC Role / Device Role / Timing Role: Synchronous rectifier in interleaved 2-phase buck stage, synchronized to controller's PWM signal with adaptive dead-time control.

Use Value: 7.5 mΩ RDS(on) limits conduction loss to <400 mW per phase, supporting >92% full-load efficiency at 1.2 V output.

GPU Core Power StageIndustrial FPGA Core Supply

Use Scenario: Compact 4-phase VRM on GPU module powering discrete graphics chips with dynamic current demands up to 200 A peak.

IC Role / Device Role / Timing Role: Low-side FET in each phase, driven by integrated gate driver; body diode conducts during high-side off-time.

Use Value: CopperStrap™ thermal path maintains TJ < 130°C even at 16.3 A per phase with 90°C board temperature, avoiding thermal throttling.

Use Scenario: Ruggedized 3-phase core supply for Xilinx Versal or Intel Agilex FPGAs in industrial PLCs and test equipment requiring long-term reliability.

IC Role / Device Role / Timing Role: Synchronous rectifier in isolated or non-isolated buck stage, operating continuously at ambient up to 85°C.

Use Value: –55°C to 150°C TJ rating and 100% RDS(on) testing ensure stable performance across extended temperature cycles and lifetime field operation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous rectifier applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IRF783230 V VDS, 4.5 mΩ RDS(on), 110 nC QG - lower on-resistance but higher gate chargeBetter for ultra-low-loss, lower-frequency VRMs (<500 kHz); less suitable for high-frequency, gate-drive-limited designsChoose when conduction loss dominates and gate driver can support >2.5 A peak current
SiR872DP30 V VDS, 5.2 mΩ RDS(on), 62 nC QG - tighter QG/RDS(on) ratio and trench MOSFET architectureSuperior EMI profile and lower Qoss (18 nC) - preferred for noise-sensitive medical or automotive ADAS suppliesChoose when system-level EMI compliance and fast turn-off are prioritized over cost

Compared with IRF7832 and SiR872DP, the IRF7809 offers the best balance of gate drive compatibility (77.5 nC), thermal robustness (RθJL = 20°C/W), and proven VRM qualification history - making it the default choice for cost-sensitive, high-volume notebook and embedded computing platforms.

Availability

IRF7809 is available at Aetrix Electronics and suitable for mobile CPU VRMs, server memory regulators, GPU power stages, and industrial FPGA core supplies requiring stable component supply and long-lifecycle support.

Supply support for IRF7809 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

International Rectifier (now part of Infineon Technologies since 2015) was a pioneer in power MOSFET design, specializing in high-efficiency switching devices for computing and industrial power conversion.

The IRF7809 belongs to the HEXFET® chipset family developed specifically for CPU/GPU core voltage regulation, emphasizing low RDS(on), controlled QG, and thermally optimized packaging for multiphase DC-DC applications.

FAQ

Is IRF7809 rated for 100% RDS(on) testing?

Yes. Per the official datasheet (PD-93812), every IRF7809 unit undergoes 100% RDS(on) screening at VGS = 4.5 V and ID = 15 A. This ensures guaranteed maximum on-resistance across all production lots, critical for current-sharing accuracy in multi-phase VRMs without binning.

What is the maximum recommended gate drive voltage for IRF7809?

The absolute maximum gate-source voltage is ±12 V. For reliable operation, gate drive should be limited to 4.5–10 V. Driving above 10 V yields diminishing RDS(on) improvement (<0.5 mΩ reduction from 4.5 V to 10 V) while increasing gate oxide stress and ESD vulnerability in high-noise VRM environments.

Can IRF7809 be used as a high-side switch in a buck converter?

No. IRF7809 is optimized as a low-side synchronous rectifier. Its gate threshold voltage (1.0 V typ) and lack of integrated level-shifting circuitry make it unsuitable for high-side operation without external bootstrap or isolated gate drive - unlike dedicated high-side controllers or floating-gate MOSFET drivers.

Does IRF7809 require a Schottky parallel diode for reverse recovery mitigation?

No. While the datasheet notes Qrr reduction when paired with a 10BQ040 Schottky (Qrr(s) = 87 nC), the IRF7809's body diode is fully characterized and usable in standard synchronous buck topologies. Parallel Schottky diodes are optional and only beneficial in ultra-high-di/dt (>1 kA/µs) or zero-voltage-switching designs.

IRF7809 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HEXFET®
Package/Case:
8-SOIC (0.154", 3.90mm Width)
Packaging:
Tube
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
30 V
Current - Continuous Drain (Id) @ 25°C:
17.6A (Ta)
Drive Voltage (Max Rds On, Min Rds On):
4.5V
Rds On (Max) @ Id, Vgs:
7.5mOhm @ 15A, 4.5V
Vgs(th) (Max) @ Id:
1V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
86 nC @ 5 V
Vgs (Max):
±12V
Input Capacitance (Ciss) (Max) @ Vds:
7300 pF @ 16 V
FET Feature:
-
Power Dissipation (Max):
3.5W (Ta)
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-SO

IRF7809 FAQ

1.How can I place an order for IRF7809 through Aetrix?

Please submit a Request for Quotation (RFQ) for IRF7809 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IRF7809 reliable?

The price and inventory of IRF7809 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRF7809 is usually 5 days.

3.What payment methods are accepted for IRF7809?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRF7809 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IRF7809?

IRF7809 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IRF7809 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IRF7809?

For technical support, including IRF7809 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRF7809 requirements.

6.How does Aetrix verify that IRF7809 is sourced from the original manufacturer or authorized distributors?

All IRF7809 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRF7809 meets industry standards.

7.What is the process for return or replacement of IRF7809?

All IRF7809 units undergo pre-shipment inspection (PSI). If there is an issue with IRF7809, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IRF7809 part is unused and in its original packaging.

Return procedure for IRF7809:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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