Infineon Technologies IRF7834PBF
- Part No.:
- IRF7834PBF
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
IRF7834PBF.pdf
- Description:
- MOSFET N-CH 30V 19A 8SO
- Quantity:
- Payment:

- Shipping:

Inventory:3,981
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Product details
Overview
IRF7834PBF from Infineon Technologies is a 30V, 4.5mΩ (at VGS = 10V) N-channel HEXFET Power MOSFET in SO-8 package, optimized as a synchronous rectifier FET in high-frequency DC-DC converters. It delivers ultra-low gate impedance (Qg = 29nC typ.), fully characterized avalanche capability (EAS = 100mJ), and low RDS(on) at 4.5V drive for notebook CPU VRMs and isolated telecom power supplies.
For engineers reviewing the IRF7834PBF datasheet, IRF7834PBF pinout, IRF7834PBF application, or IRF7834PBF equivalent, key selection criteria include its 4.5mΩ on-resistance at 10V, 29nC total gate charge, 30V VDS rating, SO-8 thermal performance (RθJA = 50°C/W), and body diode reverse recovery charge (Qrr = 13–20nC) for synchronous rectification efficiency validation.
Technical Context
This device operates as a low-side synchronous rectifier in non-isolated buck and isolated forward/flyback topologies, where fast switching (td(off) = 18ns, tf = 5.0ns) and low output charge (Qoss = 19nC) minimize turn-off losses and voltage overshoot during hard commutation. Its gate threshold voltage (VGS(th) = 1.35–2.25V) enables robust 4.5V logic-level drive compatibility with modern PWM controllers.
The SO-8 package supports dual-source layout with drain-connected pins (1–4) and source-connected pins (5–8), enabling parallel conduction paths and reduced PCB trace inductance. Avalanche-rated design (IAR = 16A, EAS = 100mJ) ensures reliability under unclamped inductive switching in high-di/dt environments like VRM phase nodes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 30V - Maximum blocking voltage compatible with 24V input systems and 12V/5V output rails. |
| RDS(on) max | 4.5mΩ @ VGS = 10V - Enables <1W conduction loss at 15A RMS in notebook CPU power stages. |
| Qg typ. | 29nC - Low gate drive energy reduces controller loading and minimizes switching transition time. |
| Qrr | 13–20nC - Critical for minimizing cross-conduction loss and EMI in synchronous rectifiers. |
| RθJA | 50°C/W - Allows 1.6W continuous dissipation at 70°C ambient without heatsink in SO-8 footprint. |
| EAS | 100mJ - Supports safe single-pulse avalanche operation during transient overvoltage events. |
Pinout & Package
IRF7834PBF uses an SO-8 surface-mount package with exposed drain pad for enhanced thermal conduction. Pins 1–4 are internally connected to the drain; pins 5–8 are internally connected to the source; pin 3 is the gate terminal.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1,2,4 | Drain | High-current output node tied to switching node; connects to PCB copper pour for thermal relief. |
| 3 | Gate | Control input requiring <29nC charge; sensitive to dv/dt coupling due to Qgd/Qgs1 ratio. |
| 5,6,7,8 | Source | Power return path; multiple pins reduce source inductance critical for synchronous rectifier stability. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low RDS(on) at 4.5V | Enables direct drive from 5V PWM controllers without level-shifting, reducing BOM count in compact VRMs. |
| Fully characterized avalanche | Guarantees 100mJ single-pulse energy handling-critical for surviving load dump or startup transients in telecom DC-DC modules. |
| Low Qgd/Qgs1 ratio | Minimizes Cdv/dt turn-on risk in high-dv/dt synchronous rectifier positions (e.g., secondary side of forward converter). |
| Optimized body diode | Qrr = 13–20nC and trr = 21–32ns enable efficient zero-voltage switching (ZVS) in resonant topologies. |
Applications
| Server VRM Phase Doubler | Notebook CPU Core Power |
|---|---|
Use Scenario: Dual-phase interleaved buck converter supplying 1.0–1.3V @ 60A to Xeon Scalable processors. IC Role / Device Role / Timing Role: Low-side synchronous rectifier replacing Schottky diodes to reduce conduction loss and improve efficiency above 90%. Use Value: 4.5mΩ RDS(on) cuts rectifier loss by >40% vs. 8mΩ alternatives, directly improving full-load thermal margin. | Use Scenario: Single-phase 1.2V/30A core supply in ultrabook platforms with strict height and thermal constraints. IC Role / Device Role / Timing Role: Synchronous FET operating at 500kHz–1MHz with 4.5V gate drive from integrated controller. Use Value: 29nC Qg enables clean 10ns-scale switching transitions, reducing gate drive loss and EMI generation. |
| Isolated Telecom DC-DC | Industrial PoE+ PSE Controller |
Use Scenario: Forward converter secondary-side rectification in 48V-to-12V telecom power module. IC Role / Device Role / Timing Role: High-reliability synchronous rectifier subjected to repetitive unclamped inductive stress during line transients. Use Value: 100mJ EAS rating ensures survival of 150V/10µs surges without derating or external clamping. | Use Scenario: Secondary-side synchronous rectifier in IEEE 802.3at PoE+ PD interface with 57V max input. IC Role / Device Role / Timing Role: Low-RDS(on) switch conducting up to 1.2A continuous current while maintaining <100mW loss. Use Value: SO-8 thermal resistance (50°C/W) allows operation at 70°C ambient without forced airflow in sealed enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous rectifier MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Si7852DP-T1-GE3 | RDS(on) = 4.0mΩ @ 10V; Qg = 32nC; SO-8 with enhanced thermal pad | Slightly lower conduction loss but higher gate charge increases drive loss at >1MHz | Preferred for 12V-output telecom converters where conduction dominates; less optimal for 1V VRMs with aggressive switching. |
| IPB040N03L3 | RDS(on) = 3.3mΩ @ 10V; TO-263 package; Qg = 38nC | Lower RDS(on) but larger footprint and higher thermal resistance (RθJA = 60°C/W) | Better for industrial 24V-input supplies with space allowance; unsuitable for thin-profile notebook designs. |
Compared with Si7852DP-T1-GE3 and IPB040N03L3, IRF7834PBF offers the best balance of low gate charge (29nC), proven SO-8 thermal performance (50°C/W), and avalanche ruggedness (100mJ) for high-frequency, space-constrained synchronous rectifier roles in computing and telecom power.
Availability
IRF7834PBF is available at Aetrix Electronics and suitable for notebook CPU VRMs, server power delivery subsystems, and isolated telecom DC-DC converters requiring stable component supply and long-term lifecycle support.
Supply support for IRF7834PBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs and discrete devices.
The IRF7834PBF belongs to the HEXFET® Power MOSFET product line, engineered specifically for high-efficiency synchronous rectification and low-voltage, high-current switching in computing and communications power supplies.
FAQ
What is the maximum continuous drain current at 70°C ambient?
The IRF7834PBF supports 16A continuous drain current at TA = 70°C with proper PCB copper area (≥1in² 2oz Cu). This rating assumes SO-8 mounting on standard FR-4 with no heatsink and accounts for RθJA = 50°C/W and junction temperature limit of 150°C. Derating begins linearly above 70°C at 2.5W/°C.
Does IRF7834PBF require a gate resistor for reliable operation?
Yes-a 2–10Ω gate resistor is recommended to dampen ringing caused by PCB trace inductance and MOSFET input capacitance (Ciss = 3710pF). Without it, excessive dv/dt at the drain can couple into the gate via Qgd, risking unintended turn-on. The resistor also controls dV/dt slew rate to meet EMI limits in Class B power supplies.
How does the body diode's reverse recovery affect synchronous rectifier performance?
The body diode's Qrr (13–20nC) and trr (21–32ns) directly impact shoot-through loss and EMI. During dead-time, stored charge must be removed before the high-side FET turns on; excess Qrr increases peak current spike and dissipates energy in both FETs. IRF7834PBF's low Qrr minimizes this loss, especially critical in 500kHz+ VRMs.
Can IRF7834PBF be used in linear regulator applications?
No-it is not designed for linear operation. Its RDS(on) is optimized for switching, and Safe Operating Area (SOA) curves show limited DC capability beyond 1A at VDS > 10V. Continuous linear use risks thermal runaway due to positive RDS(on) temperature coefficient and insufficient SOA margin below 10V.
IRF7834PBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tube
- Product Status:
- Discontinued at Digi-Key
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 19A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 4.5mOhm @ 19A, 10V
- Vgs(th) (Max) @ Id:
- 2.25V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 44 nC @ 4.5 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 3710 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 2.5W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SO
IRF7834PBF FAQ
1.How can I place an order for IRF7834PBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRF7834PBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRF7834PBF reliable?
The price and inventory of IRF7834PBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRF7834PBF is usually 5 days.
3.What payment methods are accepted for IRF7834PBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRF7834PBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRF7834PBF?
IRF7834PBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRF7834PBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRF7834PBF?
For technical support, including IRF7834PBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRF7834PBF requirements.
6.How does Aetrix verify that IRF7834PBF is sourced from the original manufacturer or authorized distributors?
All IRF7834PBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRF7834PBF meets industry standards.
7.What is the process for return or replacement of IRF7834PBF?
All IRF7834PBF units undergo pre-shipment inspection (PSI). If there is an issue with IRF7834PBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRF7834PBF part is unused and in its original packaging.
Return procedure for IRF7834PBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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