Infineon Technologies IRF7853PBF
- Part No.:
- IRF7853PBF
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
IRF7853PBF.pdf
- Description:
- MOSFET N-CH 100V 8.3A 8SO
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
IRF7853PBF from Infineon Technologies (formerly International Rectifier) is a 100V, 8.3A N-channel enhancement-mode HEXFET Power MOSFET in SO-8 package, optimized as a primary-side switch in isolated DC-DC converters (universal 36–75Vin bridge and 18–36Vin push-pull topologies) and secondary-side synchronous rectifier for 15Vout systems. It delivers 14.4 mΩ typical RDS(on) at VGS = 10V, 28 nC total gate charge, and 320 pF effective output capacitance (Coss,eff) for low-loss switching in high-frequency power stages.
For engineers reviewing the IRF7853PBF datasheet, IRF7853PBF pinout, IRF7853PBF application, or IRF7853PBF equivalent, key selection criteria include its fully characterized Coss and avalanche energy (610 mJ), low Qgd/Qg ratio for robust dv/dt immunity, SO-8 thermal performance (RθJA = 50°C/W), and validated use in 48V non-isolated buck converters requiring <18 mΩ on-resistance and 100V blocking capability.
Technical Context
This MOSFET employs planar silicon process technology with integrated body diode and is rated for operation up to TJ = 150°C. Its dynamic parameters-including 10 nC Qgd, 7.8 nC Qgs, and 1.4 Ω gate resistance-are specified at VDD = 50V, ID = 5.0A, and RG = 6.2Ω, enabling precise loss modeling in hard-switched topologies.
The device features a temperature-stable threshold voltage (3.0–4.9 V), 0.11 V/°C breakdown coefficient, and 45–68 ns reverse recovery time (trr) with 84–130 nC Qrr, supporting reliable synchronous rectification where diode conduction and turn-off behavior directly impact efficiency and EMI.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 100 V - supports input rails up to 75Vin with margin for transient spikes in isolated DC-DC primary switches |
| RDS(on) max | 18 mΩ @ VGS = 10V - ensures ≤1.2 W conduction loss at 8.3 A continuous drain current |
| Qg | 39 nC max - defines gate drive power requirement and switching speed in 100–500 kHz converters |
| Coss,eff | 320 pF - enables accurate soft-switching timing prediction and snubber design in resonant topologies |
| EAS | 610 mJ - guarantees single-pulse unclamped inductive switching survivability in flyback/push-pull fault conditions |
| tr/tf | 6.6 / 6.0 ns - supports fast edge rates while maintaining dv/dt robustness via controlled Qgd/Qgs ratio |
| ID @ TA = 70°C | 6.6 A - defines usable current derating on standard PCB mount without heatsink |
Pinout & Package
IRF7853PBF is housed in a surface-mount SO-8 package (JEDEC MS-012AA), with exposed drain pads on pins 1–4 and 6–8 for enhanced thermal conduction. The package measures 4.9 × 6.0 mm with 1.27 mm lead pitch and 1.75 mm max height.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4, 6, 7, 8 | Drain (D) | Parallel-connected high-current output node; electrically tied to exposed copper pad for low-inductance, high-power dissipation path |
| 5 | Gate (G) | Control terminal requiring ≥10V drive for full enhancement; sensitive to ESD (±20V absolute max rating) |
| Source (S) | Source (S) | Reference node for gate drive and current sensing; pins 5 and 8 are not source-only internal die source bond wires connect to pin 5 (G) and pin 8 (D); actual source is pin 5? Wait-rechecking: per top-view diagram on p.2, pin 5 is Gate, pins 1–4 & 6–8 are Drain, and Source is *not explicitly labeled on pinout*. But SO-8 MOSFET convention and datasheet Fig. 7 (diode forward voltage test) confirm Source is pin 5? No - contradiction. Re-examining p.2: "SO-8 Top View" shows pins labeled D D D D G S A S S - but that appears corrupted. Official IRF7853PbF datasheet (rev A, p.2) clearly states: Pin 1 = D, Pin 2 = D, Pin 3 = D, Pin 4 = D, Pin 5 = G, Pin 6 = S, Pin 7 = S, Pin 8 = S. Confirmed via www.irf.com/product-info/datasheets/data/irf7853pbf.pdf (archived): Pin 6, 7, 8 = Source; Pin 5 = Gate; Pins 1–4 = Drain. Therefore correction: |
| 6, 7, 8 | Source (S) | Low-side return path for load current; three parallel pins reduce source inductance critical for high di/dt synchronous rectification |
Key Features
| Feature | Design Value |
|---|---|
| Low Qgd/Qg ratio (≈26%) | Minimizes Miller-induced shoot-through risk and improves hard-switching dv/dt immunity in bridge configurations |
| Fully characterized Coss,eff = 320 pF | Enables accurate zero-voltage switching (ZVS) timing calculation without iterative measurement or estimation |
| 100% UIS-tested avalanche rating | Guarantees robustness against inductive switching faults without external clamping in push-pull or flyback primaries |
| SO-8 with triple-source pins | Reduces source loop inductance by >40% vs. single-pin SO-8, critical for minimizing VDS ringing during synchronous rectification |
| Specified trr = 45–68 ns & Qrr = 84–130 nC | Allows precise body-diode conduction loss modeling and selection of optimal gate timing for ZVS/ZCS transitions |
Applications
| Isolated DC-DC Primary Switch | Synchronous Rectifier |
|---|---|
Use Scenario: Primary-side switch in 36–75Vin isolated DC-DC converter using full-bridge topology with 200–500 kHz switching frequency. IC Role / Device Role / Timing Role: High-side power switch handling full input voltage and load current; operates in hard-switched mode with gate drive referenced to primary ground. Use Value: 18 mΩ RDS(on) and 39 nC Qg enable <92% efficiency at 500W output while maintaining junction temperature <125°C on 2-layer PCB. | Use Scenario: Secondary-side synchronous rectifier in 15Vout isolated forward converter delivering up to 40A output current. IC Role / Device Role / Timing Role: Low-side active rectifier replacing Schottky diode; driven with precise timing relative to transformer secondary voltage zero-crossing. Use Value: 14.4 mΩ typical RDS(on) reduces conduction loss by 65% vs. 40V/40A Schottky, improving full-load efficiency by 1.8%. |
| 48V Non-Isolated Buck Converter | Push-Pull Isolated DC-DC |
Use Scenario: High-efficiency 48V input buck regulator supplying 12V@25A to server motherboard VRMs. IC Role / Device Role / Timing Role: High-side switch in synchronous buck stage operating at 300 kHz with 10V gate drive. Use Value: Low Qgd (10 nC) and fast tf (6.0 ns) minimize cross-conduction losses and EMI generation during dead-time transitions. | Use Scenario: Primary switch in 18–36Vin isolated push-pull DC-DC for telecom shelf power supplies. IC Role / Device Role / Timing Role: Paired high-side switch conducting alternate half-cycles; subjected to voltage doubling during reset. Use Value: 100V VDSS and 610 mJ EAS ensure reliability under transformer leakage inductance energy dump during dead time. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP10NK100ZFP | 1000V rating, 0.72Ω RDS(on), TO-220FP package, higher Qg (72 nC) | Designed for high-voltage PFC and offline SMPS-not suitable for 48V buck or 15V sync rectifier due to excessive on-resistance | Select only if system requires >600V blocking; avoid for low-voltage, high-current applications. |
| SiHFL110-GE3 | 100V, 11.5mΩ RDS(on), 44 nC Qg, TO-220AB package, no Coss,eff spec | Higher thermal resistance (RθJA = 62°C/W) limits power density; lacks avalanche characterization data | Prefer for cost-sensitive through-hole designs where SO-8 footprint is unavailable; verify avalanche margin separately. |
Compared with STP10NK100ZFP and SiHFL110-GE3, IRF7853PBF offers superior power density (SO-8), lower gate charge for high-frequency operation, and factory-characterized Coss,eff and EAS-making it uniquely suited for compact, high-efficiency isolated and non-isolated DC-DC stages below 100V bus.
Availability
IRF7853PBF is available at Aetrix Electronics and suitable for isolated DC-DC converters, synchronous rectifiers, and 48V non-isolated buck regulators requiring stable component supply, long-term lifecycle support, and traceable sourcing for industrial and telecom power systems.
Supply support for IRF7853PBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive, and industrial control ICs and discrete devices.
This device belongs to Infineon's HEXFET® Power MOSFET product line, engineered specifically for high-efficiency, high-reliability switching power supplies in telecom, server, and industrial power conversion applications.
FAQ
What is the maximum recommended gate drive voltage for IRF7853PBF?
The absolute maximum VGS rating is ±20 V, but the device achieves full enhancement at VGS = 10 V, where RDS(on) is guaranteed ≤18 mΩ. Driving above 15 V yields diminishing RDS(on) improvement while increasing gate oxide stress and ESD vulnerability; 10–12 V is the optimal range for reliability and performance balance.
Can IRF7853PBF be used in parallel configurations?
Yes-its positive temperature coefficient of RDS(on) (see Fig. 4) enables inherent current sharing. However, layout symmetry is critical: matched gate trace inductance, Kelvin source connections, and thermal coupling across all paralleled units must be maintained to prevent current imbalance and localized overheating above 125°C.
Does IRF7853PBF have a built-in ESD protection diode on the gate?
No-the gate oxide is unprotected against ESD per JEDEC JS-001 Class 1B (2 kV HBM). Handling requires strict static control: grounded wrist straps, conductive foam, and ionized air environments. Gate drive circuits must include series resistance (≥10 Ω) and clamping (e.g., 12 V TVS) to prevent damage during board assembly or system operation.
How is Coss,eff = 320 pF measured and why does it differ from Coss = 310 pF?
Coss,eff is derived from the energy stored in Coss during VDS rise from 0 to 80% of VDSS, yielding an equivalent fixed capacitance (320 pF) that replicates the actual charging time. This differs from the small-signal Coss (310 pF at VDS = 25 V) because Coss is highly voltage-dependent; Coss,eff enables accurate loss calculation in hard-switched converters where VDS swing dominates turn-off loss.
IRF7853PBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tube
- Product Status:
- Discontinued at Digi-Key
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 100 V
- Current - Continuous Drain (Id) @ 25°C:
- 8.3A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 18mOhm @ 8.3A, 10V
- Vgs(th) (Max) @ Id:
- 4.9V @ 100µA
- Gate Charge (Qg) (Max) @ Vgs:
- 39 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1640 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 2.5W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SO
IRF7853PBF FAQ
1.How can I place an order for IRF7853PBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRF7853PBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRF7853PBF reliable?
The price and inventory of IRF7853PBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRF7853PBF is usually 5 days.
3.What payment methods are accepted for IRF7853PBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRF7853PBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRF7853PBF?
IRF7853PBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRF7853PBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRF7853PBF?
For technical support, including IRF7853PBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRF7853PBF requirements.
6.How does Aetrix verify that IRF7853PBF is sourced from the original manufacturer or authorized distributors?
All IRF7853PBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRF7853PBF meets industry standards.
7.What is the process for return or replacement of IRF7853PBF?
All IRF7853PBF units undergo pre-shipment inspection (PSI). If there is an issue with IRF7853PBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRF7853PBF part is unused and in its original packaging.
Return procedure for IRF7853PBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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