Infineon Technologies IRF8113GPBF
- Part No.:
- IRF8113GPBF
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
IRF8113GPBF.pdf
- Description:
- MOSFET N-CH 30V 17.2A 8SO
- Quantity:
- Payment:

- Shipping:

Inventory:8,984
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Product details
Overview
IRF8113GPBF from International Rectifier is a N-channel power MOSFET for compact surface-mount switching and power-management circuits supplied in the 8-SOIC (0.154", 3.90mm Width) package. The device is intended for discrete power switching where board designers need a defined MOSFET package, gate-control interface, drain-source current path, and thermal path.
For engineers reviewing the IRF8113GPBF datasheet, IRF8113GPBF pinout, IRF8113GPBF application, or IRF8113GPBF equivalent, this device is commonly used in automotive load switching, motor control, relay and solenoid switching, DC-DC converter stages, battery power paths, and legacy power-board replacement. Selection should focus on channel polarity, drain-source voltage, continuous and pulsed current, RDS(on), gate charge, body-diode behavior, package thermal resistance, and footprint compatibility.
Technical Context
In circuit use, IRF8113GPBF serves as the main discrete switching element between the supply, load, or converter node and the power return or power rail.
The gate driver should be selected from the required gate voltage, total gate charge, switching speed, and EMI target. RDS(on), pulsed current, avalanche capability, and body-diode recovery define practical load and converter limits.
The SOIC package determines the board footprint, heat-spreading path, and current terminal arrangement. For replacement work, the package and pinout should be confirmed before assuming interchangeability with another IRF or AUIRF suffix.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Device Type | N-channel power MOSFET for compact surface-mount switching and power-management circuits. |
| Package | 8-SOIC (0.154", 3.90mm Width); SOIC surface-mount package for board-level power or signal switching with standard SMT assembly. |
| Channel / Polarity | N-channel power MOSFET; polarity and body-diode orientation must match the original power stage. |
| Gate-Drive Class | Gate-drive voltage should be selected from the RDS(on) test condition and switching-loss target. |
| On-Resistance Review | RDS(on), package temperature rise, and PCB copper area define conduction loss under continuous load current. |
| Switching Parameter Review | Gate charge, input capacitance, output capacitance, and reverse-recovery behavior affect driver selection and switching frequency. |
| Avalanche / Inductive Load Review | Single-pulse avalanche rating, repetitive stress, and body-diode use should be checked for inductive or motor-load circuits. |
| Thermal Design | SOIC thermal path should be evaluated with the actual copper area, airflow, heatsink, and duty cycle. |
Pinout & Package
The IRF8113GPBF pinout should be checked together with the 8-SOIC (0.154", 3.90mm Width) outline, because terminal arrangement and thermal connection affect layout, replacement approval, and assembly method.
For PCB design, keep the high-current power path short, route the gate or control line away from noisy switching nodes, and size copper or heatsinking for the real load current and duty cycle. SOIC surface-mount package for board-level power or signal switching with standard SMT assembly.
| Pin / Function | PCB Design and Circuit Role |
|---|---|
| Gate Pin(s) | Control input for the internal MOSFET channel or channels; drive voltage must satisfy the selected RDS(on) operating point. |
| Drain Pin(s) | Switching node or load-side connection; copper spreading and current sharing are important in compact surface-mount packages. |
| Source Pin(s) | Return or sense-side power connection; keep source inductance low for clean switching. |
| Exposed Pad / Power Pad | SOIC surface-mount package for board-level power or signal switching with standard SMT assembly. |
Key Features
- IRF8113GPBF is a N-channel power MOSFET for power switching, load control, and converter-stage use.
- SOIC package affects footprint compatibility, thermal impedance, and assembly method.
- Low RDS(on), gate charge, and package thermal resistance are the main parameters for efficiency and temperature rise.
- Body-diode behavior and avalanche capability support inductive-load and synchronous-switching design checks.
- Can be driven from an external gate driver, controller, or logic stage when gate-drive voltage and timing are validated.
- Suitable for BOM continuation and replacement projects when footprint, pinout, and electrical ratings match the original board.
Applications
| Low-Side and Power Load Switching | Motor and Solenoid Control |
|---|---|
|
Use Scenario: Motor, lamp, relay, solenoid, battery-load, and general DC power switching outputs. Device Role: IRF8113GPBF operates as an N-channel MOSFET switch controlled through the gate terminal. Use Value: Supports efficient load control when RDS(on), current rating, and package temperature rise are correctly matched. |
Use Scenario: Brushed DC motors, small pumps, solenoid valves, relays, and inductive industrial loads. Device Role: IRF8113GPBF switches load current while the body diode, avalanche rating, and thermal path are considered in the design. Use Value: Provides a discrete MOSFET option for systems requiring customized gate drive and protection strategy. |
| Power Supplies & Converter Stages | Repair, Maintenance & BOM Continuity |
|
Use Scenario: Primary or secondary switching, OR-ing, hot-swap, synchronous rectification, and battery-connected power rails. Device Role: IRF8113GPBF provides the discrete switching element in the power path. Use Value: Allows designers to optimize conduction loss, switching speed, and thermal margin around the selected package. |
Use Scenario: Existing boards using International Rectifier MOSFET footprints and legacy orderable part numbers. Device Role: IRF8113GPBF gives a specific replacement reference for checking pinout, package, and performance against the installed device. Use Value: Helps sustain older power assemblies without redesigning the full gate-drive or thermal structure. |
Equivalent & Alternatives
When evaluating IRF8113GPBF equivalent devices, engineers should compare only specific orderable part numbers and verify package footprint, pinout, voltage rating, current rating, thermal resistance, switching behavior, qualification status, and suffix or packing requirements before substitution.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AUIRF9952QTR | AUIRF9952QTR is a related International Rectifier MOSFET orderable device; package, polarity, RDS(on), current rating, and suffix may differ. | Used in similar power-switching or converter applications only when the board footprint and rating class are compatible. | Compare AUIRF9952QTR against IRF8113GPBF for VDSS, ID, RDS(on), Qg, body-diode behavior, thermal resistance, pinout, and package. |
| IRF7805TRPBF | IRF7805TRPBF is a related International Rectifier MOSFET orderable device; package, polarity, RDS(on), current rating, and suffix may differ. | Used in similar power-switching or converter applications only when the board footprint and rating class are compatible. | Compare IRF7805TRPBF against IRF8113GPBF for VDSS, ID, RDS(on), Qg, body-diode behavior, thermal resistance, pinout, and package. |
| IRF7470TRPBF | IRF7470TRPBF is a related International Rectifier MOSFET orderable device; package, polarity, RDS(on), current rating, and suffix may differ. | Used in similar power-switching or converter applications only when the board footprint and rating class are compatible. | Compare IRF7470TRPBF against IRF8113GPBF for VDSS, ID, RDS(on), Qg, body-diode behavior, thermal resistance, pinout, and package. |
Compared with related alternatives, IRF8113GPBF should remain the preferred sourcing reference when the existing BOM, PCB footprint, and qualification documentation require the exact International Rectifier orderable device.
Quality
IRF8113GPBF should be sourced as original International Rectifier / Infineon inventory through traceable and controlled supply channels. Quality verification may include package inspection, top-mark validation, label and lot review, solderability inspection, moisture-sensitivity handling review, and electrical screening according to the target production requirement.
Because IRF8113GPBF is used in power switching circuits, final validation should include the actual PCB footprint, thermal path, electrical stress, operating temperature, switching frequency, and fault-condition behavior. Traceable sourcing helps reduce counterfeit risk and supports repeatable performance in production, repair, and maintenance programs.
Availability
IRF8113GPBF available at Aetrix Electronics and suitable for power switching, power-conversion, motor-control, load-driver, repair, and BOM-continuity applications requiring stable component supply and controlled replacement planning.
Supply support may include scheduled delivery planning, volume procurement support, BOM continuity assistance, traceable sourcing management, and long-term availability support for OEM manufacturers, repair programs, and electronics production teams.
For production or repair deployment, confirming package type, orderable suffix, lifecycle status, environmental requirement, electrical rating, thermal condition, and sourcing continuity helps reduce procurement risk and improve manufacturing stability.
Manufacturer
International Rectifier was a semiconductor manufacturer known for power MOSFETs, IGBTs, gate drivers, power-management ICs, intelligent power switches, photovoltaic relays, and power modules. International Rectifier products became part of Infineon Technologies' power semiconductor portfolio after the acquisition of International Rectifier.
The IRF8113GPBF ordering line should be reviewed with the relevant International Rectifier legacy product family and current Infineon supply-chain references where available. This is especially important for legacy MOSFETs, IGBT devices, power modules, and automotive AUIR power devices.
FAQ
What is IRF8113GPBF used for?
IRF8113GPBF is used in MOSFET switching circuits such as load control, motor drive auxiliaries, DC-DC converter stages, battery power paths, and legacy power boards where its package and ratings match the design.
Where can I find the IRF8113GPBF datasheet download?
The IRF8113GPBF datasheet download is typically available from International Rectifier / Infineon documentation sources or authorized distributor documentation libraries. Use it to confirm ratings, package information, pinout, thermal data, and test conditions.
What should be considered in IRF8113GPBF pinout design?
IRF8113GPBF pinout design should confirm the package drawing, terminal functions, thermal path, high-current routing, gate or control routing, and whether the orderable suffix changes package or packing details.
Can IRF8113GPBF be used as a direct replacement?
IRF8113GPBF can be used as a direct replacement only when the package footprint, pinout, electrical ratings, thermal behavior, and qualification status match the original design.
What are common IRF8113GPBF equivalent solutions?
Common IRF8113GPBF equivalent directions include AUIRF9952QTR, IRF7805TRPBF, IRF7470TRPBF. Final selection must confirm package, footprint, voltage rating, current rating, thermal performance, and switching behavior.
IRF8113GPBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 17.2A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 5.6mOhm @ 17.2A, 10V
- Vgs(th) (Max) @ Id:
- 2.2V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 36 nC @ 4.5 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2910 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 2.5W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SO
IRF8113GPBF FAQ
1.How can I place an order for IRF8113GPBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRF8113GPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRF8113GPBF reliable?
The price and inventory of IRF8113GPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRF8113GPBF is usually 5 days.
3.What payment methods are accepted for IRF8113GPBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRF8113GPBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRF8113GPBF?
IRF8113GPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRF8113GPBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRF8113GPBF?
For technical support, including IRF8113GPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRF8113GPBF requirements.
6.How does Aetrix verify that IRF8113GPBF is sourced from the original manufacturer or authorized distributors?
All IRF8113GPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRF8113GPBF meets industry standards.
7.What is the process for return or replacement of IRF8113GPBF?
All IRF8113GPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRF8113GPBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRF8113GPBF part is unused and in its original packaging.
Return procedure for IRF8113GPBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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