Infineon Technologies IRFH5007TRPBF
- Part No.:
- IRFH5007TRPBF
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- 8-PowerTDFN
- Datasheet:
-
IRFH5007TRPBF.pdf
- Description:
- MOSFET N-CH 75V 17A/100A 8PQFN
- Quantity:
- Payment:

- Shipping:

Inventory:9,666
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Product details
Overview
IRFH5007TRPBF from Infineon Technologies is a 75 V, 100 A N-channel enhancement-mode HEXFET Power MOSFET in PQFN 5×6 mm package, featuring 5.9 mΩ RDS(on) at VGS = 10 V, 65 nC total gate charge, and 0.8 °C/W junction-to-mounting-base thermal resistance. It is engineered for high-efficiency secondary-side synchronous rectification in DC-DC bricks and boost converters.
For engineers reviewing the IRFH5007TRPBF datasheet, IRFH5007TRPBF pinout, IRFH5007TRPBF application, or IRFH5007TRPBF equivalent, key selection criteria include conduction loss (RDS(on) ≤ 5.9 mΩ), thermal performance (RθJC-mb ≤ 0.8 °C/W), switching speed (td(off) = 30 ns), and industrial-grade reliability (MSL1, 100% RG tested).
Technical Context
This MOSFET employs a trench-gated silicon process optimized for low RDS(on) and fast switching in hard-switched topologies. Its gate threshold voltage (VGS(th) = 2.0–4.0 V) ensures robust turn-on margin under varying drive conditions, while the 1.2 Ω typical gate resistance supports controlled dV/dt without external gate resistors in many applications.
The device integrates a low-VSD (1.3 V max) body diode with 31–47 ns reverse recovery time and 170–255 nC Qrr, enabling efficient freewheeling in synchronous rectifier configurations. Its PQFN 5×6 mm package delivers <0.9 mm profile and direct thermal path to PCB mounting base for high-power-density designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 75 V - Supports 48 V input bus systems with 50 % safety margin against transients. |
| RDS(on) max @ VGS = 10 V | 5.9 mΩ - Enables ≤ 59 W conduction loss at 100 A continuous drain current. |
| Qg typical | 65 nC - Determines gate driver power requirement (~0.65 mW per MHz at 10 V swing). |
| ID @ Tmb = 25°C | 100 A - Rated for continuous operation with PCB heatsinking via mounting base. |
| RθJC-mb max | 0.8 °C/W - Allows ≤ 80 °C junction rise above mounting base at 100 W dissipation. |
| VGS(th) | 2.0–4.0 V - Ensures reliable turn-on with standard 3.3 V or 5 V logic-level gate drivers. |
| Ciss | 4290 pF - Impacts high-frequency gate drive loop stability and EMI filtering design. |
Pinout & Package
PQFN 5×6 mm Outline "B" package with exposed mounting base for thermal conduction. Surface-mount construction with industry-standard pinout compatible across multiple vendors.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Source (S) | Power return path and body diode cathode | Internally connected to exposed mounting base; must be soldered to large copper pour for thermal management. |
| Drain (D) | Main power output terminal | Connected to internal die backside; electrically tied to mounting base - requires isolation from PCB ground plane. |
| Gate (G) | Control input for channel modulation | High-impedance MOS gate requiring low-inductance routing; sensitive to ringing due to 1.2 Ω intrinsic RG. |
Key Features
| Feature | Design Value |
|---|---|
| Low RDS(on) (≤ 5.9 mΩ) | Reduces I²R losses in high-current DC-DC stages, improving efficiency by up to 1.2 % at 50 A load. |
| Low-profile PQFN (≤ 0.9 mm) | Enables compact power modules and stacked PCB architectures without mechanical interference. |
| 100 % RG tested | Guarantees consistent switching timing and reduces batch-to-batch variation in gate drive design. |
| MSL1 industrial qualification | Permits reflow assembly without moisture sensitivity concerns, eliminating bake requirements pre-soldering. |
| RoHS-compliant, halogen-free | Meets IPC-J-STD-020D and EU Directive 2011/65/EU for environmentally constrained end markets. |
Applications
| Secondary-Side Synchronous Rectification | DC-DC Brick Converters |
|---|---|
Use Scenario: High-efficiency 48 V to 12 V isolated DC-DC conversion in telecom power supplies. IC Role / Device Role / Timing Role: Low-side synchronous rectifier replacing Schottky diode in LLC or phase-shifted full-bridge topology. Use Value: Cuts conduction loss by >40 % vs. 40 V Schottky, enabling >95 % peak efficiency at 50 A output. | Use Scenario: Compact 300 W quarter-brick DC-DC module for industrial control systems. IC Role / Device Role / Timing Role: Primary-side high-side switch in forward converter with active clamp. Use Value: PQFN thermal path sustains 100 A pulsed current during transient loads without derating. |
| Boost Converter Switch | Inverter for Brushless DC Motors |
Use Scenario: 24 V input to 72 V battery charging stage in energy storage systems. IC Role / Device Role / Timing Role: Main switching element in non-isolated boost stage operating at 200 kHz. Use Value: 65 nC Qg enables efficient gate drive with 1 A peak driver, minimizing switching loss. | Use Scenario: 3-phase inverter driving 1 kW BLDC motor in HVAC fan modules. IC Role / Device Role / Timing Role: Half-bridge low-side switch handling 60 A RMS phase current. Use Value: Body diode trr = 31 ns and Qrr = 170 nC reduce shoot-through risk and commutation loss. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar power switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IPB052N06N3 G | RDS(on) = 5.2 mΩ @ 10 V; VDS = 60 V; PQFN 5×6 mm | Limited to ≤60 V bus systems; higher current density but lower voltage margin | Select when 48 V nominal input and minimal RDS(on) dominate over transient robustness. |
| SIZ200DT-T1-GE3 | RDS(on) = 6.2 mΩ @ 10 V; VDS = 75 V; same footprint; 100% RG tested | Identical voltage rating and thermal spec; slightly higher RDS(on) but tighter Qg distribution | Prefer for designs requiring tighter gate charge consistency across production lots. |
Compared with IPB052N06N3G and SIZ200DT-T1-GE3, IRFH5007TRPBF offers optimal balance of 75 V rating, 5.9 mΩ on-resistance, and proven MSL1 reliability-making it preferred for industrial DC-DC bricks where voltage margin and thermal continuity are critical.
Availability
IRFH5007TRPBF is available at Aetrix Electronics and suitable for secondary-side synchronous rectification, DC-DC brick converters, and boost converter applications requiring stable component supply, long-term lifecycle support, and RoHS-compliant manufacturing.
Supply support for IRFH5007TRPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with global manufacturing and quality certification to ISO/TS 16949 and IECQ QC 080000.
This part belongs to Infineon's StrongIRFET™ family, designed specifically for high-current, high-efficiency power conversion in industrial and telecom infrastructure where thermal performance and ruggedness are paramount.
FAQ
What is the maximum continuous drain current at 100°C mounting base temperature?
At Tmb = 100°C, the maximum continuous drain current is 40 A, derived from the linear derating curve starting at 100 A at 25°C with RθJC-mb = 0.8 °C/W and TJ(max) = 150°C. This reflects real thermal limits under sustained PCB-conducted cooling.
Does IRFH5007TRPBF require an external gate resistor for safe operation?
No external gate resistor is strictly required due to its 1.2 Ω typical intrinsic gate resistance, which provides inherent damping. However, a 2–5 Ω series resistor is recommended in high-dV/dt environments to suppress gate ringing and ensure clean turn-off in hard-switched topologies.
Is the mounting base electrically isolated from the drain terminal?
No-the exposed mounting base is electrically connected to the drain (D) terminal, as confirmed by the internal die construction and PQFN "B" outline documentation. PCB layout must isolate the mounting pad from all other conductive planes except the drain net.
Can IRFH5007TRPBF be used in avalanche-rated circuits?
Yes-it is characterized for unclamped inductive switching with EAS = 400 mJ at IAS = 6.6 A (TJ = 25°C). Avalanche capability is validated per JEDEC JESD24-11, but repeated operation requires careful thermal management and pulse-width limitation per Fig. 13 and 14.
IRFH5007TRPBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- 8-PowerTDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 75 V
- Current - Continuous Drain (Id) @ 25°C:
- 17A (Ta), 100A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 5.9mOhm @ 50A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 150µA
- Gate Charge (Qg) (Max) @ Vgs:
- 98 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 4290 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 3.6W (Ta), 156W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-PQFN (5x6)
IRFH5007TRPBF FAQ
1.How can I place an order for IRFH5007TRPBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRFH5007TRPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRFH5007TRPBF reliable?
The price and inventory of IRFH5007TRPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRFH5007TRPBF is usually 5 days.
3.What payment methods are accepted for IRFH5007TRPBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRFH5007TRPBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRFH5007TRPBF?
IRFH5007TRPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRFH5007TRPBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRFH5007TRPBF?
For technical support, including IRFH5007TRPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRFH5007TRPBF requirements.
6.How does Aetrix verify that IRFH5007TRPBF is sourced from the original manufacturer or authorized distributors?
All IRFH5007TRPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRFH5007TRPBF meets industry standards.
7.What is the process for return or replacement of IRFH5007TRPBF?
All IRFH5007TRPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRFH5007TRPBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRFH5007TRPBF part is unused and in its original packaging.
Return procedure for IRFH5007TRPBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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