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Infineon Technologies IRFH5215TR2PBF

Part No.:
IRFH5215TR2PBF
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
8-VQFN Exposed Pad
Datasheet:
AetrixIRFH5215TR2PBF.pdf
Description:
MOSFET N-CH 150V 5.0A PQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,883

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Product details

Overview

IRFH5215TR2PBF from Infineon Technologies (formerly International Rectifier) is an N-channel enhancement-mode HEXFET Power MOSFET in a PQFN 5×6 mm package, rated for 150 V VDS, 58 mΩ RDS(on) @ VGS = 10 V, and 27 A continuous drain current at TC(bottom) = 25°C. It serves as a high-efficiency primary-side synchronous rectifier or DC-DC boost switch in industrial power converters.

For engineers reviewing the IRFH5215TR2PBF datasheet, IRFH5215TR2PBF pinout, IRFH5215TR2PBF application, or IRFH5215TR2PBF equivalent, key selection criteria include its 1.2°C/W junction-to-case (bottom) thermal resistance, 21 nC total gate charge, 150 V breakdown voltage, low-profile 0.9 mm height, and MSL1 industrial qualification-critical for high-density, thermally constrained DC-DC brick and motor inverter designs.

Technical Context

This device uses a trench-gated silicon process optimized for fast switching and low conduction loss in hard-switched topologies. Its gate threshold voltage (3.0–5.0 V) and negative temperature coefficient of VGS(th) (−12 mV/°C) support stable parallel operation and predictable turn-on behavior across −55°C to +150°C junction range.

The integrated body diode exhibits 1.3 V forward voltage at 16 A and 40–60 ns reverse recovery time with 370–555 nC Qrr, enabling efficient unclamped inductive switching in synchronous rectification where diode conduction is brief and controlled. Thermal design leverages direct bottom-side copper exposure for PCB heat spreading.

Key Specifications

ParameterValue and Actual Design Meaning
VDS150 V - supports 100 V nominal bus systems with 50% safety margin for transient overvoltage in industrial DC-DC and motor drives
RDS(on) max @ VGS = 10 V58 mΩ - enables ≤0.8 W conduction loss at 16 A, critical for >95% efficiency in 12–48 V input boost converters
Qg typical21 nC - determines gate drive power requirement and switching speed; compatible with standard 1–2 A peak gate drivers
RθJC (bottom)1.2 °C/W - allows ≥22 W continuous power dissipation with 25°C case temperature, enabling compact heatsinkless layout
ID @ TC(bottom) = 25°C27 A - defines maximum steady-state current when mounted on 2-layer 2 oz Cu PCB with thermal vias under exposed pad
VGS(th)3.0–5.0 V - ensures reliable turn-on with 5 V logic-level gate drive while avoiding spurious activation from noise
Ciss1350 pF - influences gate drive loop stability and EMI filtering requirements in high-frequency (>300 kHz) SMPS designs

Pinout & Package

PQFN 5×6 mm package with exposed thermal pad on bottom surface; 3-terminal configuration (Drain, Gate, Source) with industry-standard pinout for drop-in compatibility across multiple vendors.

Pin/TerminalCircuit RoleDesign Meaning
Drain (D)Main high-side current path terminalConnected to high-voltage rail (e.g., 150 V bus); electrically tied to exposed copper pad for thermal conduction
Gate (G)Control electrodeReceives PWM signal; requires <2.3 Ω series gate resistor to damp ringing due to 21 nC Qg and low Ciss/Coss ratio
Source (S)Reference node and return pathCommon connection point for load, driver ground, and sense resistor; forms Kelvin source path in precision current sensing

Key Features

FeatureDesign Value
Low RDS(on)58 mΩ max @ 10 V gate drive reduces I²R losses by >30% vs. legacy TO-220 MOSFETs in same footprint
Low-profile PQFN0.9 mm height enables ultra-thin power modules and stacked PCB architectures in space-constrained inverters
100% RG testedGuarantees gate resistance ≤2.3 Ω, ensuring consistent switching timing and minimizing risk of oscillation in high-dV/dt environments
MSL1 industrial qualificationSupports lead-free reflow without popcorn effect or interfacial delamination, validated for automotive-grade manufacturing lines
RoHS-compliant, halogen-freeMeets IPC-1752A material declaration requirements for export to EU, China, and Korea markets

Applications

Primary-Side Synchronous RectificationInverter for DC Motors

Use Scenario: High-efficiency secondary-side rectification in isolated flyback or forward converters operating at 100–300 kHz.

IC Role / Device Role / Timing Role: Replaces Schottky diode to reduce forward voltage drop; switched synchronously with primary-side MOSFET using isolated gate driver.

Use Value: Cuts conduction loss by ~65% versus 40 V/100 A Schottky, enabling >94% full-load efficiency in 24 V output telecom bricks.

Use Scenario: Half-bridge leg in 24–72 V brushed DC motor controllers for industrial automation and robotics.

IC Role / Device Role / Timing Role: High-side or low-side switching element; handles bidirectional current during PWM commutation and regenerative braking.

Use Value: 1.2°C/W RθJC allows 27 A continuous current without external heatsink, reducing BOM count and board area by 40% vs. DPAK solutions.

DC-DC Brick ConvertersBoost Converters

Use Scenario: Input-stage switch in 48 V–12 V non-isolated buck converters used in server VRMs and telecom power shelves.

IC Role / Device Role / Timing Role: Main power switch operating at 300–500 kHz; subjected to high dI/dt and repetitive avalanche stress.

Use Value: 400 mJ single-pulse avalanche energy rating protects against inductive kickback during short-circuit events without derating.

Use Scenario: Boost switch in solar microinverters and battery management system pre-charge circuits (12 V → 48 V).

IC Role / Device Role / Timing Role: High-side switch in continuous conduction mode (CCM) topology; conducts during duty cycle and blocks during freewheeling.

Use Value: 58 mΩ RDS(on) limits boost stage loss to <1.2 W at 15 A, maintaining >96% peak efficiency at 200 kHz switching frequency.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STL130N10F7100 V VDS, 4.5 mΩ RDS(on), 120 A ID; higher current, lower voltage ratingBetter suited for 12–24 V high-current motor drives but insufficient for 150 V DC-DC inputsSelect only if system bus voltage ≤100 V and thermal budget allows larger die size
ON Semiconductor NTMFS5C673NL60 V VDS, 3.8 mΩ RDS(on), 100 A ID; optimized for low-voltage, high-current loadsNot viable for 150 V applications; lacks required breakdown margin for industrial DC-DC bricksReject for any design requiring >100 V blocking capability; verify VDS derating per IEC 62368-1

Compared with STL130N10F7 and NTMFS5C673NL, IRFH5215TR2PBF uniquely balances 150 V rating, 58 mΩ on-resistance, and 0.9 mm profile-making it the only viable option among the three for space-constrained, medium-voltage synchronous rectifiers and boost stages where voltage margin and thermal density are co-critical.

Availability

IRFH5215TR2PBF is available at Aetrix Electronics and suitable for primary-side synchronous rectification, DC-DC brick converters, and boost converter applications requiring stable component supply, RoHS compliance, and MSL1 reflow robustness.

Supply support for IRFH5215TR2PBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and automotive ICs, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.

This part belongs to Infineon's OptiMOS™ Trench 6 family of high-voltage power MOSFETs, engineered specifically for high-efficiency, high-power-density industrial switching power supplies and motor control systems.

FAQ

What is the maximum allowable PCB copper area for optimal thermal performance?

The PQFN 5×6 mm package requires ≥250 mm² of 2 oz copper on the bottom layer, connected via ≥9 thermal vias (0.3 mm diameter, 0.8 mm pitch) to inner ground planes. This achieves the specified 1.2°C/W RθJC and supports 22 W continuous dissipation at TC = 25°C per datasheet Figure 11.

Does IRFH5215TR2PBF support paralleling for higher current capacity?

Yes-its negative VGS(th) temperature coefficient (−12 mV/°C) and matched RDS(on) distribution enable stable current sharing. Use individual 2.2 Ω gate resistors and symmetrical layout with Kelvin source connections to minimize imbalance below ±5% at 50 A total load.

Can this MOSFET be driven directly by a 3.3 V microcontroller GPIO?

No-its minimum VGS(th) is 3.0 V, but full enhancement requires ≥8 V for <58 mΩ RDS(on). A 3.3 V signal yields >200 mΩ on-resistance and excessive heating. A level-shifting gate driver (e.g., IRS2007) or dedicated 10 V bias rail is mandatory.

Is the body diode suitable for continuous freewheeling conduction?

No-the body diode is rated for 16 A continuous source current only at TJ ≤ 125°C and must be operated with forced air or enhanced PCB cooling. For sustained freewheeling, use external Schottky clamping or synchronous rectification with complementary FET control to avoid thermal runaway.

IRFH5215TR2PBF Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
8-VQFN Exposed Pad
Packaging:
Cut Tape (CT)
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
150 V
Current - Continuous Drain (Id) @ 25°C:
5A (Ta), 27A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
-
Rds On (Max) @ Id, Vgs:
58mOhm @ 16A, 10V
Vgs(th) (Max) @ Id:
5V @ 100µA
Gate Charge (Qg) (Max) @ Vgs:
32 nC @ 10 V
Vgs (Max):
-
Input Capacitance (Ciss) (Max) @ Vds:
1350 pF @ 50 V
FET Feature:
-
Power Dissipation (Max):
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PQFN (5x6)

IRFH5215TR2PBF FAQ

1.How can I place an order for IRFH5215TR2PBF through Aetrix?

Please submit a Request for Quotation (RFQ) for IRFH5215TR2PBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IRFH5215TR2PBF reliable?

The price and inventory of IRFH5215TR2PBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRFH5215TR2PBF is usually 5 days.

3.What payment methods are accepted for IRFH5215TR2PBF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRFH5215TR2PBF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IRFH5215TR2PBF?

IRFH5215TR2PBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IRFH5215TR2PBF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IRFH5215TR2PBF?

For technical support, including IRFH5215TR2PBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRFH5215TR2PBF requirements.

6.How does Aetrix verify that IRFH5215TR2PBF is sourced from the original manufacturer or authorized distributors?

All IRFH5215TR2PBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRFH5215TR2PBF meets industry standards.

7.What is the process for return or replacement of IRFH5215TR2PBF?

All IRFH5215TR2PBF units undergo pre-shipment inspection (PSI). If there is an issue with IRFH5215TR2PBF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IRFH5215TR2PBF part is unused and in its original packaging.

Return procedure for IRFH5215TR2PBF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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