Infineon Technologies IRFH5215TR2PBF
- Part No.:
- IRFH5215TR2PBF
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- 8-VQFN Exposed Pad
- Datasheet:
-
IRFH5215TR2PBF.pdf
- Description:
- MOSFET N-CH 150V 5.0A PQFN
- Quantity:
- Payment:

- Shipping:

Inventory:3,883
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IRFH5215TR2PBF from Infineon Technologies (formerly International Rectifier) is an N-channel enhancement-mode HEXFET Power MOSFET in a PQFN 5×6 mm package, rated for 150 V VDS, 58 mΩ RDS(on) @ VGS = 10 V, and 27 A continuous drain current at TC(bottom) = 25°C. It serves as a high-efficiency primary-side synchronous rectifier or DC-DC boost switch in industrial power converters.
For engineers reviewing the IRFH5215TR2PBF datasheet, IRFH5215TR2PBF pinout, IRFH5215TR2PBF application, or IRFH5215TR2PBF equivalent, key selection criteria include its 1.2°C/W junction-to-case (bottom) thermal resistance, 21 nC total gate charge, 150 V breakdown voltage, low-profile 0.9 mm height, and MSL1 industrial qualification-critical for high-density, thermally constrained DC-DC brick and motor inverter designs.
Technical Context
This device uses a trench-gated silicon process optimized for fast switching and low conduction loss in hard-switched topologies. Its gate threshold voltage (3.0–5.0 V) and negative temperature coefficient of VGS(th) (−12 mV/°C) support stable parallel operation and predictable turn-on behavior across −55°C to +150°C junction range.
The integrated body diode exhibits 1.3 V forward voltage at 16 A and 40–60 ns reverse recovery time with 370–555 nC Qrr, enabling efficient unclamped inductive switching in synchronous rectification where diode conduction is brief and controlled. Thermal design leverages direct bottom-side copper exposure for PCB heat spreading.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 150 V - supports 100 V nominal bus systems with 50% safety margin for transient overvoltage in industrial DC-DC and motor drives |
| RDS(on) max @ VGS = 10 V | 58 mΩ - enables ≤0.8 W conduction loss at 16 A, critical for >95% efficiency in 12–48 V input boost converters |
| Qg typical | 21 nC - determines gate drive power requirement and switching speed; compatible with standard 1–2 A peak gate drivers |
| RθJC (bottom) | 1.2 °C/W - allows ≥22 W continuous power dissipation with 25°C case temperature, enabling compact heatsinkless layout |
| ID @ TC(bottom) = 25°C | 27 A - defines maximum steady-state current when mounted on 2-layer 2 oz Cu PCB with thermal vias under exposed pad |
| VGS(th) | 3.0–5.0 V - ensures reliable turn-on with 5 V logic-level gate drive while avoiding spurious activation from noise |
| Ciss | 1350 pF - influences gate drive loop stability and EMI filtering requirements in high-frequency (>300 kHz) SMPS designs |
Pinout & Package
PQFN 5×6 mm package with exposed thermal pad on bottom surface; 3-terminal configuration (Drain, Gate, Source) with industry-standard pinout for drop-in compatibility across multiple vendors.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Drain (D) | Main high-side current path terminal | Connected to high-voltage rail (e.g., 150 V bus); electrically tied to exposed copper pad for thermal conduction |
| Gate (G) | Control electrode | Receives PWM signal; requires <2.3 Ω series gate resistor to damp ringing due to 21 nC Qg and low Ciss/Coss ratio |
| Source (S) | Reference node and return path | Common connection point for load, driver ground, and sense resistor; forms Kelvin source path in precision current sensing |
Key Features
| Feature | Design Value |
|---|---|
| Low RDS(on) | 58 mΩ max @ 10 V gate drive reduces I²R losses by >30% vs. legacy TO-220 MOSFETs in same footprint |
| Low-profile PQFN | 0.9 mm height enables ultra-thin power modules and stacked PCB architectures in space-constrained inverters |
| 100% RG tested | Guarantees gate resistance ≤2.3 Ω, ensuring consistent switching timing and minimizing risk of oscillation in high-dV/dt environments |
| MSL1 industrial qualification | Supports lead-free reflow without popcorn effect or interfacial delamination, validated for automotive-grade manufacturing lines |
| RoHS-compliant, halogen-free | Meets IPC-1752A material declaration requirements for export to EU, China, and Korea markets |
Applications
| Primary-Side Synchronous Rectification | Inverter for DC Motors |
|---|---|
Use Scenario: High-efficiency secondary-side rectification in isolated flyback or forward converters operating at 100–300 kHz. IC Role / Device Role / Timing Role: Replaces Schottky diode to reduce forward voltage drop; switched synchronously with primary-side MOSFET using isolated gate driver. Use Value: Cuts conduction loss by ~65% versus 40 V/100 A Schottky, enabling >94% full-load efficiency in 24 V output telecom bricks. | Use Scenario: Half-bridge leg in 24–72 V brushed DC motor controllers for industrial automation and robotics. IC Role / Device Role / Timing Role: High-side or low-side switching element; handles bidirectional current during PWM commutation and regenerative braking. Use Value: 1.2°C/W RθJC allows 27 A continuous current without external heatsink, reducing BOM count and board area by 40% vs. DPAK solutions. |
| DC-DC Brick Converters | Boost Converters |
Use Scenario: Input-stage switch in 48 V–12 V non-isolated buck converters used in server VRMs and telecom power shelves. IC Role / Device Role / Timing Role: Main power switch operating at 300–500 kHz; subjected to high dI/dt and repetitive avalanche stress. Use Value: 400 mJ single-pulse avalanche energy rating protects against inductive kickback during short-circuit events without derating. | Use Scenario: Boost switch in solar microinverters and battery management system pre-charge circuits (12 V → 48 V). IC Role / Device Role / Timing Role: High-side switch in continuous conduction mode (CCM) topology; conducts during duty cycle and blocks during freewheeling. Use Value: 58 mΩ RDS(on) limits boost stage loss to <1.2 W at 15 A, maintaining >96% peak efficiency at 200 kHz switching frequency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STL130N10F7 | 100 V VDS, 4.5 mΩ RDS(on), 120 A ID; higher current, lower voltage rating | Better suited for 12–24 V high-current motor drives but insufficient for 150 V DC-DC inputs | Select only if system bus voltage ≤100 V and thermal budget allows larger die size |
| ON Semiconductor NTMFS5C673NL | 60 V VDS, 3.8 mΩ RDS(on), 100 A ID; optimized for low-voltage, high-current loads | Not viable for 150 V applications; lacks required breakdown margin for industrial DC-DC bricks | Reject for any design requiring >100 V blocking capability; verify VDS derating per IEC 62368-1 |
Compared with STL130N10F7 and NTMFS5C673NL, IRFH5215TR2PBF uniquely balances 150 V rating, 58 mΩ on-resistance, and 0.9 mm profile-making it the only viable option among the three for space-constrained, medium-voltage synchronous rectifiers and boost stages where voltage margin and thermal density are co-critical.
Availability
IRFH5215TR2PBF is available at Aetrix Electronics and suitable for primary-side synchronous rectification, DC-DC brick converters, and boost converter applications requiring stable component supply, RoHS compliance, and MSL1 reflow robustness.
Supply support for IRFH5215TR2PBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and automotive ICs, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.
This part belongs to Infineon's OptiMOS™ Trench 6 family of high-voltage power MOSFETs, engineered specifically for high-efficiency, high-power-density industrial switching power supplies and motor control systems.
FAQ
What is the maximum allowable PCB copper area for optimal thermal performance?
The PQFN 5×6 mm package requires ≥250 mm² of 2 oz copper on the bottom layer, connected via ≥9 thermal vias (0.3 mm diameter, 0.8 mm pitch) to inner ground planes. This achieves the specified 1.2°C/W RθJC and supports 22 W continuous dissipation at TC = 25°C per datasheet Figure 11.
Does IRFH5215TR2PBF support paralleling for higher current capacity?
Yes-its negative VGS(th) temperature coefficient (−12 mV/°C) and matched RDS(on) distribution enable stable current sharing. Use individual 2.2 Ω gate resistors and symmetrical layout with Kelvin source connections to minimize imbalance below ±5% at 50 A total load.
Can this MOSFET be driven directly by a 3.3 V microcontroller GPIO?
No-its minimum VGS(th) is 3.0 V, but full enhancement requires ≥8 V for <58 mΩ RDS(on). A 3.3 V signal yields >200 mΩ on-resistance and excessive heating. A level-shifting gate driver (e.g., IRS2007) or dedicated 10 V bias rail is mandatory.
Is the body diode suitable for continuous freewheeling conduction?
No-the body diode is rated for 16 A continuous source current only at TJ ≤ 125°C and must be operated with forced air or enhanced PCB cooling. For sustained freewheeling, use external Schottky clamping or synchronous rectification with complementary FET control to avoid thermal runaway.
IRFH5215TR2PBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 8-VQFN Exposed Pad
- Packaging:
- Cut Tape (CT)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 150 V
- Current - Continuous Drain (Id) @ 25°C:
- 5A (Ta), 27A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- -
- Rds On (Max) @ Id, Vgs:
- 58mOhm @ 16A, 10V
- Vgs(th) (Max) @ Id:
- 5V @ 100µA
- Gate Charge (Qg) (Max) @ Vgs:
- 32 nC @ 10 V
- Vgs (Max):
- -
- Input Capacitance (Ciss) (Max) @ Vds:
- 1350 pF @ 50 V
- FET Feature:
- -
- Power Dissipation (Max):
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PQFN (5x6)
IRFH5215TR2PBF FAQ
1.How can I place an order for IRFH5215TR2PBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRFH5215TR2PBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRFH5215TR2PBF reliable?
The price and inventory of IRFH5215TR2PBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRFH5215TR2PBF is usually 5 days.
3.What payment methods are accepted for IRFH5215TR2PBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRFH5215TR2PBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRFH5215TR2PBF?
IRFH5215TR2PBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRFH5215TR2PBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRFH5215TR2PBF?
For technical support, including IRFH5215TR2PBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRFH5215TR2PBF requirements.
6.How does Aetrix verify that IRFH5215TR2PBF is sourced from the original manufacturer or authorized distributors?
All IRFH5215TR2PBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRFH5215TR2PBF meets industry standards.
7.What is the process for return or replacement of IRFH5215TR2PBF?
All IRFH5215TR2PBF units undergo pre-shipment inspection (PSI). If there is an issue with IRFH5215TR2PBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRFH5215TR2PBF part is unused and in its original packaging.
Return procedure for IRFH5215TR2PBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IRFH5215TR2PBF Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

