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Infineon Technologies IRFH5302DTR2PBF

Part No.:
IRFH5302DTR2PBF
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
8-PowerVDFN
Datasheet:
AetrixIRFH5302DTR2PBF.pdf
Description:
MOSFET N-CH 30V 29A 8VQFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:9,429

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Product details

Overview

IRFH5302DTR2PBF from Infineon Technologies (formerly International Rectifier) is a 30 V, 100 A N-channel PQFN 5×6 mm power MOSFET optimized as a synchronous rectifier in high-frequency buck converters. It features 2.5 mΩ RDS(on) at VGS = 10 V, 0.65 V intrinsic Schottky-like body diode forward voltage at 5.0 A, and 19 ns typical reverse recovery time (trr). Its low thermal resistance (RθJC(Bottom) = 1.2 °C/W) enables high-power-density DC-DC stages in server VRMs and GPU power delivery.

For engineers reviewing the IRFH5302DTR2PBF datasheet, IRFH5302DTR2PBF pinout, IRFH5302DTR2PBF application, or IRFH5302DTR2PBF equivalent, key selection criteria include verified RDS(on) ≤2.5 mΩ at 10 V, trr ≤29 ns, Qgd = 7.9 nC, VSD ≤0.65 V at 5 A, and PQFN 5×6 mm package compatibility with industrial-grade thermal cycling and MSL1 handling.

Technical Context

This HEXFET device uses trench-gate silicon process to achieve low conduction loss and fast switching in synchronous buck topologies. Its gate charge profile (Qg = 55 nC, Qgd = 7.9 nC) supports efficient 500 kHz–1 MHz operation with minimal Miller-induced shoot-through risk. The integrated body diode exhibits soft reverse recovery (Qrr = 28–42 nC), reducing EMI in high-dV/dt environments.

Thermal design leverages direct bottom-side copper thermal pad contact to PCB, delivering 1.2 °C/W junction-to-case (bottom) resistance. The 0.9 mm profile and industry-standard pinout allow drop-in replacement in existing 5×6 mm layouts without requalification of solder paste stencil or pick-and-place programs.

Key Specifications

ParameterValue and Actual Design Meaning
VDS30 V - Supports 12 V input rails with 2.5× safety margin for transient overvoltage
RDS(on) max @ 10 V2.5 mΩ - Enables ≤25 W conduction loss at 100 A continuous current
trr typ.19 ns - Minimizes dead-time losses and reduces EMI in synchronous rectification
VSD max @ 5 A0.65 V - Low forward drop improves light-load efficiency vs. discrete Schottky diodes
RθJC(Bottom)1.2 °C/W - Allows >80 W power dissipation with 100 °C case temperature rise
Qgd7.9 nC - Limits Miller plateau duration, enabling stable 1 MHz gate drive with 10 Ω resistor
PackagePQFN 5×6 mm - Standard footprint compatible with IPC-7351B land pattern and automated optical inspection

Pinout & Package

PQFN 5×6 mm package with exposed thermal pad on bottom surface; 3-pin configuration (Drain, Source, Gate) arranged in standard industry layout for synchronous FET placement.

Pin/TerminalCircuit RoleDesign Meaning
Drain (D)Main current path from input rail to switch nodeConnected to large copper pour for heat spreading and low-inductance high-current routing
Source (S)Reference node for gate drive and current sensingInternally tied to thermal pad; must be connected to ground plane for thermal and electrical integrity
Gate (G)Control terminal for channel modulationHigh-impedance input requiring <10 Ω series resistance to damp ringing during fast edge transitions

Key Features

FeatureDesign Value
Low RDS(on)2.5 mΩ max at 10 V ensures <25 W conduction loss at full rated current
Schottky-like body diodeVSD ≤0.65 V at 5 A reduces reverse conduction loss versus standard MOSFETs
Fast reverse recoverytrr = 19 ns minimizes cross-conduction overlap in synchronous buck controllers
Low-profile thermal package0.9 mm height enables compact multi-phase VRM stacks with tight board spacing
100% Rg testedGuarantees gate resistance ≤1.9 Ω for predictable turn-on timing and reduced gate driver stress

Applications

Server Voltage Regulator ModulesGPU Power Delivery Systems

Use Scenario: High-current, multi-phase buck converters supplying CPU/GPU cores at ≤1 V with >500 A peak load.

IC Role / Device Role / Timing Role: Synchronous rectifier in low-side position, switching at 500 kHz–1 MHz with precise dead-time control.

Use Value: 2.5 mΩ RDS(on) and 19 ns trr reduce total power loss by ≥12% compared to prior-generation 3.5 mΩ devices.

Use Scenario: Compact, high-density power stages on graphics card PCBs where vertical space is constrained.

IC Role / Device Role / Timing Role: Low-side FET in 3-phase interleaved buck converter with forced-air cooling.

Use Value: 0.9 mm PQFN profile allows stacking of three phases in <8 mm height, meeting PCIe slot height limits.

Telecom Base Station DC-DC ConvertersIndustrial PLC Power Supplies

Use Scenario: 48 V input to 3.3/5/12 V intermediate bus conversion in outdoor telecom cabinets.

IC Role / Device Role / Timing Role: Primary synchronous rectifier in primary-side isolated buck-derived topology.

Use Value: MSL1 rating and -55°C to +150°C operating range ensure reliability under extended thermal cycling and humidity exposure.

Use Scenario: DIN-rail mounted programmable logic controller power modules requiring long-term field stability.

IC Role / Device Role / Timing Role: Output-stage FET in non-isolated buck regulator powering FPGA I/O banks and microcontroller peripherals.

Use Value: 1.2 °C/W RθJC enables full 100 A rating with passive heatsinking only, eliminating fan dependency.

Equivalent & Alternatives

The following parts are listed as comparable options for similar power MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IRFH5202TRPBFRDS(on) = 3.1 mΩ max (higher conduction loss); same PQFN 5×6 packageLower current density suitable for 60–80 A designs with relaxed thermal budgetSelect when cost sensitivity outweighs 15% higher I²R loss at full load
SiR626DP-T1-GE3RDS(on) = 2.3 mΩ max; Qgd = 8.5 nC; slightly higher Coss (720 pF)Optimized for 600 kHz operation; less ideal for >800 kHz due to higher output capacitancePrefer for fixed-frequency 600 kHz VRMs where lower RDS(on) justifies marginal Qgd increase

Compared with IRFH5302DTR2PBF, IRFH5202TRPBF trades 24% higher RDS(on) for lower gate charge (45 nC), while SiR626DP-T1-GE3 offers marginally lower on-resistance but requires gate drive tuning for optimal 1 MHz switching due to higher Coss.

Availability

IRFH5302DTR2PBF is available at Aetrix Electronics and suitable for server VRMs, GPU power delivery systems, and telecom DC-DC converters requiring stable component supply with guaranteed long-term availability and traceable lot control.

Supply support for IRFH5302DTR2PBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader specializing in power management, automotive, and industrial control solutions, with core expertise in silicon and wide-bandgap power devices.

The IRFH5302DTR2PBF belongs to Infineon's TrenchFET® HEXFET® family, engineered specifically for high-efficiency, high-frequency synchronous rectification in data center and computing power supplies.

FAQ

What is the maximum continuous drain current at 100°C case temperature?

The IRFH5302DTR2PBF supports 100 A continuous drain current at TC(Bottom) = 25°C, derating linearly to 40 A at TC(Bottom) = 100°C per the absolute maximum ratings table. This assumes proper PCB copper area (≥200 cm² 2 oz Cu) and no airflow, based on RθJC = 1.2 °C/W and TJ(max) = 150°C.

Is this MOSFET suitable for 48 V input buck converters?

No - the 30 V VDS rating makes IRFH5302DTR2PBF unsuitable for direct 48 V operation. It is designed for 12 V input or lower systems (e.g., 12 V → 1 V VRMs). For 48 V inputs, a 60 V or 80 V rated MOSFET with comparable RDS(on) and package size is required.

Does the body diode require external snubbing in synchronous operation?

No external snubber is needed when used as a synchronous rectifier with properly timed gate drive. The 19 ns trr and soft recovery characteristics (Qrr = 28–42 nC) prevent voltage overshoot exceeding 30 V in typical 500 kHz–1 MHz buck layouts with <10 nH loop inductance.

What is the recommended gate resistor value for 1 MHz switching?

A 5.6 Ω to 10 Ω gate resistor is recommended for 1 MHz operation. This balances switching speed (td(on)/td(off) ≈ 16/20 ns) against gate driver stress and EMI, given the device's Qg = 55 nC and Rg = 1.9 Ω internal resistance. Lower values increase dV/dt and risk shoot-through; higher values degrade efficiency.

IRFH5302DTR2PBF Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
8-PowerVDFN
Packaging:
Cut Tape (CT)
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
30 V
Current - Continuous Drain (Id) @ 25°C:
29A (Ta), 100A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
-
Rds On (Max) @ Id, Vgs:
2.5mOhm @ 50A, 10V
Vgs(th) (Max) @ Id:
2.35V @ 100µA
Gate Charge (Qg) (Max) @ Vgs:
55 nC @ 10 V
Vgs (Max):
-
Input Capacitance (Ciss) (Max) @ Vds:
3635 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PQFN (5x6) Single Die

IRFH5302DTR2PBF FAQ

1.How can I place an order for IRFH5302DTR2PBF through Aetrix?

Please submit a Request for Quotation (RFQ) for IRFH5302DTR2PBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IRFH5302DTR2PBF reliable?

The price and inventory of IRFH5302DTR2PBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRFH5302DTR2PBF is usually 5 days.

3.What payment methods are accepted for IRFH5302DTR2PBF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRFH5302DTR2PBF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IRFH5302DTR2PBF?

IRFH5302DTR2PBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IRFH5302DTR2PBF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IRFH5302DTR2PBF?

For technical support, including IRFH5302DTR2PBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRFH5302DTR2PBF requirements.

6.How does Aetrix verify that IRFH5302DTR2PBF is sourced from the original manufacturer or authorized distributors?

All IRFH5302DTR2PBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRFH5302DTR2PBF meets industry standards.

7.What is the process for return or replacement of IRFH5302DTR2PBF?

All IRFH5302DTR2PBF units undergo pre-shipment inspection (PSI). If there is an issue with IRFH5302DTR2PBF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IRFH5302DTR2PBF part is unused and in its original packaging.

Return procedure for IRFH5302DTR2PBF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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