Infineon Technologies IRFH7882TRPBF

Overview

IRFH7882TRPBF from Infineon Technologies (formerly International Rectifier) is an 80 V, 180 A N-channel PQFN 5×6 mm FastIRFET™ Power MOSFET optimized for high-efficiency secondary-side synchronous rectification and primary-side switching in telecom DC-DC supplies. It delivers R_DS(on) = 2.5 mΩ (typ) at V_GS = 10 V, Q_g = 49 nC (typ), and R_θJC(Bottom) = 0.64 °C/W - enabling high-current, low-loss operation in compact 48–60 V power stages.

For engineers reviewing the IRFH7882TRPBF datasheet, IRFH7882TRPBF pinout, IRFH7882TRPBF application, or IRFH7882TRPBF equivalent, key selection criteria include its low-profile PQFN package, industry-standard pinout for multi-vendor board compatibility, validated gate resistance (R_g = 0.9 Ω), and thermal performance under high-duty-cycle conduction in telecom and motor drive systems.

Technical Context

This device employs a trench-gated, superjunction-enhanced HEXFET® structure with optimized charge distribution to achieve simultaneous low R_DS(on) and low Q_g. Its gate threshold voltage (V_GS(th) = 2.0–3.6 V) supports robust 10 V gate drive while maintaining immunity to spurious turn-on in high-dv/dt environments.

The PQFN 5×6 mm package features dual-sided thermal interface: bottom-side copper-exposed die pad (R_θJC(Bottom) = 0.64 °C/W) for PCB heat spreading and top-side thermal path (R_θJC(Top) = 15 °C/W) for optional heatsink coupling - supporting >114 A continuous current at T_C = 100°C.

Key Specifications

Pinout & Package

PQFN 5×6 mm package with exposed thermal pad (bottom-side), 1.05 mm profile, MSL1 rating, and industry-standard 3-pin layout (Drain, Source, Gate) compatible with IPC-7351B footprint.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-current 80 V power switching applications.

Compared with TK80E08N1L and CSD18540Q5B, IRFH7882TRPBF offers the lowest R_DS(on) (2.5 mΩ typ), delivering superior conduction efficiency in high-current, moderate-frequency telecom and motor applications - making it optimal when thermal headroom is constrained.

Availability

IRFH7882TRPBF is available at Aetrix Electronics and suitable for telecom DC-DC power supplies, BLDC motor drives, hot-swap controllers, and active OR-ing circuits requiring stable component supply and long-term industrial lifecycle support.

Supply support for IRFH7882TRPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive, and industrial control ICs and discrete devices.

This part belongs to Infineon's FastIRFET™ family - engineered specifically for high-efficiency, high-current power conversion in telecom infrastructure, server PSUs, and motor control, emphasizing low R_DS(on), fast switching, and robust thermal packaging.

FAQ

What is the maximum continuous drain current at 100°C case temperature?

The IRFH7882TRPBF supports 114 A continuous drain current at T_C = 100°C with V_GS = 10 V, as specified in the Absolute Maximum Ratings table. This rating assumes proper PCB thermal design with ≥100 cm² of 2-oz copper connected to the exposed drain pad.

Does this MOSFET require a gate resistor for stability?

Yes - although R_g is internally characterized at 0.9 Ω (tested per unit), a discrete 2–5 Ω series gate resistor is recommended to dampen ringing and control dV/dt during hard switching, especially in paralleled configurations or high-inductance layouts.

Is the IRFH7882TRPBF suitable for avalanche-rated operation?

Yes - it is rated for 704 mJ single-pulse avalanche energy (E_AS) with I_AR = 38 A, validated per JEDEC JESD24-1. This supports unclamped inductive switching in motor drive fault conditions, provided pulse width and starting junction temperature comply with Fig 14 limits.

What is the moisture sensitivity level and reflow profile compliance?

The device is MSL1 (per JEDEC J-STD-020D), meaning it has unlimited floor life and may be reflowed using standard lead-free profiles without baking. Peak reflow temperature must not exceed 260°C, and thermal shock testing confirms reliability under IPC/JEDEC G-102 guidelines.