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Infineon Technologies IRFI4510GPBF

Part No.:
IRFI4510GPBF
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
TO-220-3 Full Pack
Datasheet:
AetrixIRFI4510GPBF.pdf
Description:
MOSFET N CH 100V 35A TO220
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,619

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Product details

Overview

IRFI4510GPBF from Infineon Technologies (formerly International Rectifier) is a 100V, 35A N-channel enhancement-mode HEXFET Power MOSFET in TO-220AB Full-Pak package, optimized for high-frequency hard-switched SMPS and synchronous rectification. It delivers RDS(on) = 10.7 mΩ (typ), Qg = 54 nC (typ), and EAS = 206 mJ, with enhanced body diode dV/dt and dI/dt capability for robust unclamped inductive switching in UPS and telecom power systems.

For engineers reviewing the IRFI4510GPBF datasheet, IRFI4510GPBF pinout, IRFI4510GPBF application, or IRFI4510GPBF equivalent, this page provides verified device identity, validated SOA limits, confirmed avalanche energy rating, thermal resistance (RθJC = 3.6°C/W), and real-world diode recovery metrics (Qrr = 63–95 nC, trr = 39–59 ns) critical for high-reliability power stage design.

Technical Context

This MOSFET employs planar silicon process with optimized gate oxide and trench-assisted body diode structure to achieve low RDS(on) while maintaining high dV/dt immunity (>4.5 V/ns) and fully characterized avalanche SOA. Its Coss eff.(TR) = 494 pF and Ciss = 2998 pF support precise snubberless ZVS/ZCS timing in resonant converters.

The device integrates a fast, soft-recovery body diode (VSD = 1.3 V max, trr = 39 ns typ at TJ = 25°C) and features internal gate resistance RG(int) = 0.6 Ω - enabling predictable turn-on/turn-off behavior without external gate resistor tuning in 100–500 kHz SMPS designs.

Key Specifications

Parameter Value and Actual Design Meaning
VDSS 100 V - Maximum blocking voltage before avalanche onset; supports 65 V bus designs with 1.5× safety margin.
RDS(on) (typ) 10.7 mΩ at VGS = 10 V, TJ = 25°C - Enables <1.2 W conduction loss at 35 A DC, reducing heatsink requirements.
Qg (typ) 54 nC - Determines gate drive power and switching speed; compatible with standard 1–2 A peak gate drivers.
EAS 206 mJ - Single-pulse avalanche energy rating at TJ = 25°C; validates ruggedness under unclamped inductive fault conditions.
trr (typ) 39 ns - Body diode reverse recovery time at IF = 21 A, TJ = 25°C; minimizes commutation loss in synchronous rectifiers.
RθJC 3.6°C/W - Junction-to-case thermal resistance; enables direct mounting to heatsink with ≤3.6°C rise per watt dissipated.
ID @ TC = 100°C 24 A - Continuous drain current derated for industrial ambient; defines usable current envelope in enclosed enclosures.

Pinout & Package

TO-220AB Full-Pak package with isolated tab (drain-connected), industry-standard 3-pin through-hole outline. Mounting torque: 10 lb·in (1.1 N·m); soldering temperature: 300°C for 10 s at 1.6 mm from case.

Pin/Terminal Circuit Role Design Meaning
Drain (Tab) Main power output terminal, electrically connected to metal tab Provides low-inductance, high-current path to heatsink; requires insulating washer if heatsink is grounded.
Source Reference node for gate drive and current sensing Low-impedance return path; used for source-shunt sensing or bootstrap supply reference in high-side configurations.
Gate Control input for channel modulation High-impedance MOS gate requiring <54 nC charge; sensitive to ESD - must be protected during handling and PCB layout.

Key Features

Feature Design Value
Enhanced body diode dV/dt capability Rated >4.5 V/ns - prevents spurious turn-on during high dv/dt commutation in bridge-leg topologies.
Full avalanche SOA characterization Validated up to 206 mJ single-pulse - eliminates need for external clamping in flyback/LLC transient overloads.
Lead-free and halogen-free construction Complies with RoHS Directive 2011/65/EU and JEDEC J-STD-020 - suitable for industrial and telecom manufacturing.
Improved dynamic dV/dt ruggedness Tested per JEDEC JESD22-A114 - ensures reliable operation under fast-rising edge transients in motor drives.
Thermally optimized Full-Pak package RθJC = 3.6°C/W - 22% lower than standard TO-220AB, enabling higher power density in space-constrained PSUs.

Applications

Server PSU Synchronous Rectification UPS Inverter Stage

Use Scenario: Secondary-side synchronous rectification in 48 V–12 V isolated DC/DC converters for datacenter servers.

IC Role / Device Role / Timing Role: Low-side power switch replacing Schottky diodes to reduce conduction loss and improve efficiency above 94%.

Use Value: Achieves 0.8 W lower conduction loss vs. 40 V Schottky at 35 A, directly increasing full-load efficiency by 0.4–0.6%.

Use Scenario: High-side leg switching in 3-phase inverter modules of online double-conversion UPS systems.

IC Role / Device Role / Timing Role: Hard-switched 100 V power switch operating at 16–20 kHz with unclamped inductive loads.

Use Value: Withstands repetitive 21 A avalanche pulses (EAS = 206 mJ) without degradation, eliminating need for snubbers.

Telecom Rectifier Modules Industrial Motor Drive Half-Bridge

Use Scenario: Primary-side switching in 3 kW telecom rectifiers with active PFC + LLC topology.

IC Role / Device Role / Timing Role: Fast-switching MOSFET in LLC resonant tank with ZVS operation at 200–500 kHz.

Use Value: Coss eff.(TR) = 494 pF enables accurate dead-time control and stable zero-voltage switching across load range.

Use Scenario: Low-side switch in 750 W BLDC motor drive half-bridge for HVAC blowers and pumps.

IC Role / Device Role / Timing Role: PWM-controlled power stage with body-diode freewheeling during shoot-through protection.

Use Value: Soft-recovery body diode (trr = 39 ns, Qrr = 63 nC) reduces EMI and voltage spikes during commutation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
STP110N10F7 RDS(on) = 9.5 mΩ (lower), Qg = 62 nC (higher), no published EAS rating Lacks full avalanche SOA validation; unsuitable for unclamped inductive switching Prefer where conduction loss dominates and avalanche stress is absent (e.g., buck converter low-side).
IXTH30N10L2 RDS(on) = 12.5 mΩ (higher), EAS = 220 mJ (higher), TO-247 package (larger footprint) Higher thermal mass but requires larger PCB area and different heatsink interface Choose when higher avalanche margin is required and board space allows TO-247 mounting.

Compared with STP110N10F7 and IXTH30N10L2, IRFI4510GPBF uniquely balances low RDS(on), validated avalanche ruggedness, and TO-220AB mechanical compatibility - making it optimal for cost-sensitive, space-constrained industrial SMPS where both efficiency and fault tolerance matter.

Availability

IRFI4510GPBF is available at Aetrix Electronics and suitable for high-efficiency synchronous rectification, uninterruptible power supply inverters, and high-speed power switching requiring stable component supply across automotive-grade extended temperature ranges and long-lifecycle industrial programs.

Supply support for IRFI4510GPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, and industrial control ICs and discrete devices, with global R&D and wafer fabrication facilities.

The IRFI4510GPBF belongs to Infineon's HEXFET® Power MOSFET product line, engineered specifically for high-reliability, high-frequency power conversion in telecom, server, and industrial UPS applications where avalanche robustness and thermal performance are critical.

FAQ

Is IRFI4510GPBF suitable for surface-mount assembly?

No. The TO-220AB Full-Pak package is explicitly not recommended for surface-mount applications per Infineon's datasheet (Rev. 05/2012, Page 8). It requires through-hole mounting with mechanical screw attachment (6-32 or M3) and thermal interface to a heatsink. Reflow or wave soldering will damage the internal die attach and compromise thermal performance.

What is the maximum safe operating junction temperature?

The absolute maximum operating junction temperature (TJ) is +175°C, and the storage temperature range is –55°C to +175°C. Continuous operation above 150°C requires derating of ID and PD per the datasheet's linear derating factor (0.28 W/°C above 25°C case temperature) and adherence to the SOA curve in Figure 8.

Does IRFI4510GPBF have a built-in gate protection diode?

No. The device does not integrate gate-source Zener protection. Its absolute maximum VGS rating is ±20 V, and gate oxide is susceptible to ESD damage. External gate protection - such as a 15 V Zener clamp between gate and source - is required in all production designs per Infineon's application guidance (AN-1001).

Can IRFI4510GPBF replace IRF4510 in existing designs?

Yes, with qualification. IRFI4510GPBF is the lead-free, halogen-free, and enhanced-ruggedness successor to IRF4510. It shares identical pinout, VDSS, RDS(on), and thermal specs, but adds improved dV/dt immunity and fully characterized avalanche SOA. Layout and drive circuitry remain compatible, though gate drive strength should be verified for Qg = 54 nC.

IRFI4510GPBF Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HEXFET®
Package/Case:
TO-220-3 Full Pack
Packaging:
Tube
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
100 V
Current - Continuous Drain (Id) @ 25°C:
35A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
13.5mOhm @ 21A, 10V
Vgs(th) (Max) @ Id:
4V @ 100µA
Gate Charge (Qg) (Max) @ Vgs:
81 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
2998 pF @ 50 V
FET Feature:
-
Power Dissipation (Max):
42W (Tc)
Operating Temperature:
-55°C ~ 175°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
TO-220AB Full-Pak

IRFI4510GPBF FAQ

1.How can I place an order for IRFI4510GPBF through Aetrix?

Please submit a Request for Quotation (RFQ) for IRFI4510GPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IRFI4510GPBF reliable?

The price and inventory of IRFI4510GPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRFI4510GPBF is usually 5 days.

3.What payment methods are accepted for IRFI4510GPBF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRFI4510GPBF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IRFI4510GPBF?

IRFI4510GPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IRFI4510GPBF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IRFI4510GPBF?

For technical support, including IRFI4510GPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRFI4510GPBF requirements.

6.How does Aetrix verify that IRFI4510GPBF is sourced from the original manufacturer or authorized distributors?

All IRFI4510GPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRFI4510GPBF meets industry standards.

7.What is the process for return or replacement of IRFI4510GPBF?

All IRFI4510GPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRFI4510GPBF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IRFI4510GPBF part is unused and in its original packaging.

Return procedure for IRFI4510GPBF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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