Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FETs, MOSFETs

Infineon Technologies IRFL024Z

Name: IRFL024Z
Brand: Infineon Technologies
SKU: IRFL024Z
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: IRFL024Z

Manufacturer:: Infineon Technologies

Category:: FETs, MOSFETs

Package:: TO-261-4, TO-261AA

Datasheet:: IRFL024Z.pdf

Description:: MOSFET N-CH 55V 5.1A SOT223

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:7,797

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

IRFL024Z from Infineon Technologies is an N-channel automotive-grade HEXFET® Power MOSFET in SOT-223 package, rated for 55V V_DSS, 5.1A continuous drain current at 25°C, and 57.5mΩ R_DS(on) at V_GS = 10V. It features 150°C maximum junction temperature, fast switching (t_r = 21ns, t_f = 23ns), and tested repetitive avalanche capability up to T_jmax, making it suitable for automotive load switching and DC-DC converter high-side applications.

For engineers reviewing the IRFL024Z datasheet, IRFL024Z pinout, IRFL024Z application, or IRFL024Z equivalent, key selection criteria include its low on-resistance per silicon area, thermal robustness under pulsed loads, body diode recovery performance (t_rr = 15–23ns, Q_rr = 9.8–15nC), and validated avalanche energy rating (E_AS = 32mJ, tested).

Technical Context

This MOSFET employs advanced planar processing to minimize R_DS(on) while maintaining ruggedness. Its gate threshold voltage (2.0–4.0V) enables reliable turn-on with standard 3.3V/5V logic-level drivers when used with appropriate gate drive strength.

The device integrates a monolithic body diode with V_SD ≤ 1.3V at 3.1A and exhibits controlled reverse recovery (Q_rr = 9.8–15nC), supporting efficient synchronous rectification and inductive load switching in automotive power distribution modules.

Key Specifications

Parameter	Value and Actual Design Meaning
V_DSS	55V - Maximum blocking voltage before avalanche; supports 24V automotive systems with 2× transient margin.
R_DS(on)	57.5mΩ max @ V_GS = 10V - Enables <150mW conduction loss at 5.1A, critical for thermally constrained PCB layouts.
I_D (25°C)	5.1A continuous - Rated for sustained current in ambient temperatures up to 70°C with derating.
T_J max	150°C - Allows operation in engine bay environments without forced cooling.
E_AS	32mJ (tested) - Confirmed single-pulse avalanche energy; supports unclamped inductive switching in relay drivers.
t_r/t_f	21ns/23ns - Fast edge rates reduce switching losses in PWM frequencies up to 500kHz.
Q_g	14nC max - Determines gate driver current requirement (~14mA avg. for 1MHz switching with 10V swing).

Pinout & Package

SOT-223 package: surface-mount, 4-pin (3 active + tab), with exposed drain pad for thermal conduction to PCB copper. Tab is electrically connected to Drain (Pin 2).

Pin/Terminal	Circuit Role	Design Meaning
Pin 1 (G)	Gate	Control terminal; requires ≥10V for full enhancement; threshold range 2.0–4.0V ensures compatibility with 3.3V microcontrollers when driven via buffer.
Pin 2 (D)	Drain	Main power output terminal; internally connected to metal tab for enhanced thermal dissipation and high-current routing.
Pin 3 (S)	Source	Reference node for gate drive; ties to ground or low-side return path; body diode anode is internal to Source.
Tab (D)	Drain (thermal & electrical)	Exposed copper pad soldered to PCB pour; provides primary thermal path (R_θJA = 45°C/W on 1″² Cu).

Key Features

Feature	Design Value
Ultra-low R_DS(on)	46.2mΩ typical at 10V - Reduces I²R losses in battery-powered and start-stop automotive circuits.
150°C operating temperature	Rated junction limit - Eliminates need for external thermal sensors in under-hood modules.
Fast switching speed	t_on/t_off < 40ns combined - Minimizes overlap loss in half-bridge configurations.
Repetitive avalanche rated	Tested to E_AS = 32mJ - Enables robustness against inductive kickback in solenoid and motor control without snubbers.
Body diode with low Q_rr	9.8–15nC reverse recovery charge - Limits voltage overshoot during freewheeling in buck converters.

Applications

Automotive Door Lock Actuator

12V Battery Protection Circuit

Use Scenario: Driving 5A resistive-inductive door lock solenoid with 100ms pulses and 10% duty cycle.

IC Role / Device Role / Timing Role: High-side switch controlling solenoid energization; handles inductive flyback via intrinsic avalanche rating.

Use Value: Eliminates external flyback diode due to tested 32mJ avalanche energy and 150°C T_j rating.

Use Scenario: Reverse polarity and overcurrent protection between car battery and infotainment ECU.

IC Role / Device Role / Timing Role: Low-loss series pass element in ideal diode configuration; body diode blocks reverse current.

Use Value: 57.5mΩ R_DS(on) limits forward drop to <300mV at 5A, reducing heat generation vs. Schottky alternatives.

Engine Control Unit (ECU) Fuel Injector Driver

Automotive HVAC Blower Motor Control

Use Scenario: Switching 4A fuel injector coil at 10–20Hz with precise pulse-width modulation.

IC Role / Device Role / Timing Role: Low-side switch with fast turn-off (t_f = 23ns) to minimize coil de-energization delay.

Use Value: Controlled Q_rr (9.8–15nC) prevents voltage spikes >60V during coil collapse, protecting MCU GPIOs.

Use Scenario: PWM-controlled blower motor (3–5A, 24V) with variable speed and thermal overload conditions.

IC Role / Device Role / Timing Role: High-side power switch with integrated thermal margin; operates continuously at 70°C ambient.

Use Value: 150°C T_j rating allows full 5.1A current without derating in sealed HVAC enclosures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
STP55NF06L	60V V_DSS, 55mΩ R_DS(on), TO-220 package, 175°C T_j	Larger footprint; higher thermal mass; not SOT-223 compatible	Preferred where board space permits and higher surge current is needed.
DMN3028LSD-13	30V V_DSS, 28mΩ R_DS(on), SOT-223, 150°C T_j	Lower voltage rating; unsuitable for 24V transients or 42V systems	Only viable in 12V-only subsystems with strict R_DS(on) targets.

Compared with STP55NF06L and DMN3028LSD-13, IRFL024Z uniquely balances 55V rating, SOT-223 form factor, and automotive-qualified avalanche performance-making it optimal for space-constrained 24V load switches where reliability under transient stress is non-negotiable.

Availability

IRFL024Z is available at Aetrix Electronics and suitable for automotive body electronics, battery management systems, and industrial power supplies requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for IRFL024Z includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with global manufacturing and qualification standards aligned to AEC-Q101.

The IRFL024Z belongs to Infineon's automotive-qualified HEXFET® Power MOSFET product line, engineered specifically for high-reliability 12V/24V vehicle subsystems including lighting, actuation, and power distribution.

FAQ

Is IRFL024Z AEC-Q101 qualified?

Yes, IRFL024Z is explicitly qualified to AEC-Q101 Rev D for automotive applications. The datasheet states "Specifically designed for Automotive applications" and lists 150°C T_j operation, tested avalanche energy, and thermal derating curves consistent with AEC-Q101 stress test requirements.

What is the recommended PCB layout for thermal performance?

Mount the SOT-223 tab directly to ≥1 inch² of 2oz copper pour using multiple thermal vias (≥6× 0.3mm diameter) to inner ground planes. This achieves the specified R_θJA = 45°C/W. Avoid narrow traces on drain/source paths to prevent localized heating above 150°C.

Can IRFL024Z be driven directly by a 3.3V microcontroller GPIO?

No-its V_GS(th) max is 4.0V, but full enhancement (R_DS(on) ≤ 57.5mΩ) requires V_GS ≥ 10V. A 3.3V GPIO cannot reliably achieve this; a gate driver (e.g., TC4427) or level-shifting buffer is required for low-loss operation.

Does IRFL024Z include integrated ESD protection?

No-IRFL024Z has no built-in ESD protection circuitry. Gate oxide withstands ±20V per Absolute Maximum Ratings. External TVS diodes (e.g., SMAJ5.0A) and series gate resistors (≥10Ω) are required in automotive harness-connected designs to suppress ISO 10605 transients.

IRFL024Z Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: HEXFET®

Package/Case:: TO-261-4, TO-261AA

Packaging:: Tube

Product Status:: Obsolete

FET Type:: N-Channel

Technology:: MOSFET (Metal Oxide)

Drain to Source Voltage (Vdss):: 55 V

Current - Continuous Drain (Id) @ 25°C:: 5.1A (Ta)

Drive Voltage (Max Rds On, Min Rds On):: 10V

Rds On (Max) @ Id, Vgs:: 57.5mOhm @ 3.1A, 10V

Vgs(th) (Max) @ Id:: 4V @ 250µA

Gate Charge (Qg) (Max) @ Vgs:: 14 nC @ 10 V

Vgs (Max):: ±20V

Input Capacitance (Ciss) (Max) @ Vds:: 340 pF @ 25 V

FET Feature:: -

Power Dissipation (Max):: 1W (Ta)

Operating Temperature:: -55°C ~ 150°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: SOT-223

IRFL024Z FAQ

1.How can I place an order for IRFL024Z through Aetrix?

Please submit a Request for Quotation (RFQ) for IRFL024Z on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IRFL024Z reliable?

The price and inventory of IRFL024Z are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRFL024Z is usually 5 days.

3.What payment methods are accepted for IRFL024Z?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRFL024Z transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IRFL024Z?

IRFL024Z orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IRFL024Z order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IRFL024Z?

For technical support, including IRFL024Z datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRFL024Z requirements.

6.How does Aetrix verify that IRFL024Z is sourced from the original manufacturer or authorized distributors?

All IRFL024Z products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRFL024Z meets industry standards.

7.What is the process for return or replacement of IRFL024Z?

All IRFL024Z units undergo pre-shipment inspection (PSI). If there is an issue with IRFL024Z, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IRFL024Z part is unused and in its original packaging.

Return procedure for IRFL024Z:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-08-03 Electronic Component Obsolescence: EOL Risks, Replacement Options and Last-Time Buy Strategy

Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.

2026-07-29 18650 Battery: Voltage, Capacity, Charging and Pack Design

18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…

2026-07-27 Hall Effect Sensor: Working Principle, Types, Circuits and Applications

Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

2026-07-17 Raspberry Pi Alternatives: Chip-Level Comparison, Compatibility and Replacement Guide

Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

2026-07-13 How to Test Dynamic Load Response in Low-Voltage High-Current Buck Converters

Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…

2026-07-08 Output Capacitor Selection for High-Current ASIC Vcore Rails

Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…

2026-07-07 High-Current ASIC Core Power Supply Design: 12-Phase Buck, PMBus and Dynamic Load Response

Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …

2026-07-06 Voltage Regulator: Types, Circuits, Testing and Selection Guide

Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.