Infineon Technologies IRFR18N15DTRR
- Part No.:
- IRFR18N15DTRR
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Datasheet:
-
IRFR18N15DTRR.pdf
- Description:
- MOSFET N-CH 150V 18A DPAK
- Quantity:
- Payment:

- Shipping:

Inventory:4,717
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Product details
Overview
IRFR18N15DTRR from Infineon Technologies (formerly International Rectifier) is an N-channel enhancement-mode HEXFET® Power MOSFET in D-Pak (TO-252AA) package, rated for 150 V VDSS, 0.125 Ω RDS(on) at VGS = 10 V, and 18 A continuous drain current at TC = 25 °C. It is optimized for high-frequency DC-DC converters including active-clamp forward topologies in telecom 48 V input systems.
For engineers reviewing the IRFR18N15DTRR datasheet, IRFR18N15DTRR pinout, IRFR18N15DTRR application, or IRFR18N15DTRR equivalent, key selection criteria include its low Qgd (14–21 nC), fully characterized Coss,eff (95 pF), avalanche-rated operation (EAS = 200 mJ), body diode recovery performance (trr = 130–190 ns), and thermal resistance RθJC = 1.4 °C/W.
Technical Context
This MOSFET employs planar vertical DMOS technology with optimized gate charge distribution to minimize switching losses in hard-switched SMPS. Its low Qgd/Qg ratio and tightly specified Coss across VDS (88–1160 pF) support predictable snubberless design in active-clamp and resonant converters.
The device features fully characterized unclamped inductive switching behavior, with validated single-pulse avalanche energy up to 200 mJ and repetitive avalanche rating (IAR = 11 A, EAR = 11 mJ). Its body diode exhibits VSD = 1.3 V at IS = 11 A and controlled reverse recovery (Qrr = 660–980 nC, di/dt = 100 A/µs).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 150 V - Maximum blocking voltage before avalanche onset; supports 48 V telecom bus with ≥3× safety margin. |
| RDS(on) max | 0.125 Ω @ VGS = 10 V, ID = 11 A - Enables <1.5 W conduction loss at 11 A, critical for thermally constrained PCB-mount designs. |
| Qgd | 14–21 nC - Low Miller charge reduces gate drive power and improves immunity to dv/dt-induced turn-on in high-side configurations. |
| Coss,eff | 95 pF - Effective output capacitance over full VDS swing; used directly in ZVS transition time and resonant tank calculations. |
| EAS | 200 mJ - Single-pulse avalanche energy rating enables robustness against inductive switching transients without external clamping. |
| trr | 130–190 ns - Body diode reverse recovery time under defined IF = 11 A, di/dt = 100 A/µs; impacts commutation loss and EMI in synchronous rectification. |
| RθJC | 1.4 °C/W - Junction-to-case thermal resistance; allows direct heatsink mounting for high-power density layouts with verified thermal derating. |
Pinout & Package
D-Pak (TO-252AA) surface-mount package with exposed drain pad for thermal and electrical connection; 3-pin configuration with drain connected to tab (pins 2 and 4 electrically common).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Gate | Control terminal; requires ≤±30 V gate drive; low input capacitance (Ciss = 900 pF) eases driver selection. |
| 2 & 4 | Drain | Main high-side power terminal; internally tied to exposed copper pad; primary heat path to PCB copper pour or heatsink. |
| 3 | Source | Power return and gate reference node; connects to low-side switch or ground plane; defines local VGS reference. |
Key Features
| Feature | Design Value |
|---|---|
| Low Qgd/Qg ratio | ~50% (14/28 nC typical) - Reduces sensitivity to Miller-induced false turn-on during high dv/dt switching events. |
| Fully characterized Coss vs. VDS | Specified at 1.0 V, 25 V, and 120 V - Enables accurate soft-switching timing prediction without curve-fitting assumptions. |
| Validated avalanche capability | EAS = 200 mJ, IAR = 11 A - Eliminates need for external avalanche protection in well-bounded inductive loads. |
| Optimized body diode recovery | Qrr = 660–980 nC, trr = 130–190 ns - Supports synchronous rectification in forward converters with minimal commutation loss. |
Applications
| Telecom DC-DC Converters | Active-Clamp Forward Converters |
|---|---|
Use Scenario: 48 V input to 12 V/24 V isolated output in telecom shelf power supplies with strict efficiency and EMI targets. IC Role / Device Role / Timing Role: Primary-side high-side switch operating at 200–500 kHz; handles clamp reset and main power transfer. Use Value: Low Qgd and Coss,eff reduce switching loss by >15% versus comparable 150 V MOSFETs, improving full-load efficiency by 0.8–1.2%. |
Use Scenario: Clamp switch in active-clamp forward topology where precise VDS slew rate control minimizes ringing and EMI. IC Role / Device Role / Timing Role: Clamp FET conducting during magnetizing reset phase; must sustain high dv/dt without spurious turn-on. Use Value: Peak diode recovery dv/dt rating of 3.3 V/ns and low Qgd ensure stable clamp action even under fast transient load steps. |
| Industrial SMPS | Server VRMs |
Use Scenario: 36–75 V input industrial power modules requiring long-term reliability under wide temperature range (−40 °C to +125 °C). IC Role / Device Role / Timing Role: Main switching element in half-bridge or push-pull topologies; operates with 100% duty cycle capability at reduced current. Use Value: RDS(on) tempco of 0.17 V/°C ensures stable current sharing in paralleled configurations across −55 °C to +175 °C junction range. |
Use Scenario: High-current point-of-load (POL) converters supplying CPU/GPU rails with tight voltage regulation and fast transient response. IC Role / Device Role / Timing Role: Synchronous rectifier in secondary-side buck stage; conducts high peak currents (>30 A pulsed) with low forward drop. Use Value: Body diode VSD = 1.3 V at 11 A and low Qrr reduce dead-time conduction loss and improve light-load efficiency by ~2.5%. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-frequency 150 V power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP16NF15 | RDS(on) = 0.14 Ω (higher), Qgd = 22 nC (higher), no published Coss,eff spec | Limited avalanche rating (EAS = 120 mJ); less suitable for unclamped inductive switching | Acceptable for fixed-frequency flyback or LLC where avalanche stress is absent and thermal margin exists. |
| IXTP18N15X4 | RDS(on) = 0.115 Ω (lower), Qgd = 12 nC (lower), but TO-220 package (higher RθJA) | Through-hole mounting only; unsuitable for high-density SMT designs; higher board assembly cost | Preferred when thermal mass and heatsink interface dominate over footprint constraints and assembly automation. |
Compared with STP16NF15 and IXTP18N15X4, IRFR18N15DTRR delivers superior switching efficiency in SMT-based telecom SMPS due to its balanced Qgd/Coss,eff profile and validated avalanche margin-without sacrificing manufacturability or thermal performance on standard FR4 PCBs.
Availability
IRFR18N15DTRR is available at Aetrix Electronics and suitable for telecom DC-DC converters, active-clamp forward power supplies, and industrial SMPS requiring stable component supply, consistent parametric performance, and long-lifecycle availability.
Supply support for IRFR18N15DTRR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader specializing in power management, sensor, and automotive ICs, with deep heritage in power MOSFET innovation dating to the HEXFET® architecture.
IRFR18N15DTRR belongs to the legacy International Rectifier HEXFET® Power MOSFET product line, engineered specifically for high-efficiency, high-frequency switched-mode power supplies in telecom, server, and industrial infrastructure.
FAQ
What is the maximum continuous drain current at 100°C case temperature?
The IRFR18N15DTRR supports 13 A continuous drain current at TC = 100 °C with VGS = 10 V, per Absolute Maximum Ratings table. This derating reflects thermal limits of the D-Pak package and must be verified against actual PCB copper area and airflow in the target layout.
Does this MOSFET require a gate resistor for safe operation?
A gate resistor (typically 6.8 Ω, as used in characterization) is required to dampen ringing and control switching speed. The device's Qg = 28–43 nC and low Ciss make it sensitive to parasitic oscillation without proper gate network design and PCB layout.
Can IRFR18N15DTRR be used in synchronous rectification?
Yes-the integrated body diode has characterized trr = 130–190 ns and Qrr = 660–980 nC at IF = 11 A, di/dt = 100 A/µs, enabling use as a synchronous rectifier in forward or LLC converters where gate timing aligns with zero-voltage switching transitions.
Is the drain pad (pins 2 and 4) electrically isolated from the source?
No-pins 2 and 4 are both drain terminals and are internally connected to the exposed copper pad. The drain is not isolated from the pad; the source (pin 3) is the only isolated terminal. PCB layout must avoid shorting the drain pad to source or gate traces.
IRFR18N15DTRR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 150 V
- Current - Continuous Drain (Id) @ 25°C:
- 18A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 125mOhm @ 11A, 10V
- Vgs(th) (Max) @ Id:
- 5.5V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 43 nC @ 10 V
- Vgs (Max):
- ±30V
- Input Capacitance (Ciss) (Max) @ Vds:
- 900 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 110W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- TO-252AA (DPAK)
IRFR18N15DTRR FAQ
1.How can I place an order for IRFR18N15DTRR through Aetrix?
Please submit a Request for Quotation (RFQ) for IRFR18N15DTRR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRFR18N15DTRR reliable?
The price and inventory of IRFR18N15DTRR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRFR18N15DTRR is usually 5 days.
3.What payment methods are accepted for IRFR18N15DTRR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRFR18N15DTRR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRFR18N15DTRR?
IRFR18N15DTRR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRFR18N15DTRR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRFR18N15DTRR?
For technical support, including IRFR18N15DTRR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRFR18N15DTRR requirements.
6.How does Aetrix verify that IRFR18N15DTRR is sourced from the original manufacturer or authorized distributors?
All IRFR18N15DTRR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRFR18N15DTRR meets industry standards.
7.What is the process for return or replacement of IRFR18N15DTRR?
All IRFR18N15DTRR units undergo pre-shipment inspection (PSI). If there is an issue with IRFR18N15DTRR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRFR18N15DTRR part is unused and in its original packaging.
Return procedure for IRFR18N15DTRR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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