My Inquiry
My Account
Infineon Technologies IRFR2407TRLPBF
- Part No.:
- IRFR2407TRLPBF
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Datasheet:
-
IRFR2407TRLPBF.pdf
- Description:
- MOSFET N-CH 75V 42A DPAK
- Quantity:
- Payment:
- Shipping:
Inventory:7,763
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
IRFR2407TRLPBF from Infineon Technologies (formerly International Rectifier) is a 55 V, 11 A, N-channel enhancement-mode MOSFET in DPAK (TO-252AA) package with 40 mΩ RDS(on) at VGS = 10 V and 100% avalanche-rated operation. It serves as a high-efficiency power switch in DC-DC converters and motor drive half-bridges.
For engineers reviewing the IRFR2407TRLPBF datasheet, IRFR2407TRLPBF pinout, IRFR2407TRLPBF application, or IRFR2407TRLPBF equivalent, key selection criteria include its 55 V VDSS, 40 mΩ on-resistance, 11 A continuous drain current, lead-free RoHS-compliant construction, and DPAK thermal performance for surface-mount power switching.
Technical Context
This MOSFET employs a trench-gate process optimized for low gate charge (Qg = 18 nC) and fast switching (ton = 12 ns, toff = 32 ns), enabling high-frequency operation in synchronous buck regulators. Its 100% UIS-tested ruggedness supports reliable operation under inductive load switching stress.
The device features a logic-level gate threshold (VGS(th) = 2.0–4.0 V), allowing direct drive from 3.3 V or 5 V microcontrollers without level-shifting. Its SOA is specified up to TC = 25 °C with pulse width ≤ 10 ms and duty cycle ≤ 1%.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 55 V - maximum drain-source blocking voltage for 12 V and 24 V bus applications |
| RDS(on) @ VGS = 10 V | 40 mΩ - enables <1 W conduction loss at 5 A continuous drain current |
| ID (continuous) | 11 A @ TC = 100 °C - supports compact heatsinkless designs in low-power motor drives |
| Qg | 18 nC - reduces gate driver power requirement and switching losses in 100–500 kHz SMPS |
| ton/toff | 12 ns / 32 ns - supports clean edge transitions with minimal shoot-through risk in half-bridge topologies |
| UIS Rating | 100% tested - guarantees single-pulse avalanche energy handling up to 190 mJ without derating |
Pinout & Package
Package: DPAK (TO-252AA), surface-mount, single-ended heat sink tab (drain-connected), rated for 1.5 W dissipation at TC = 25 °C.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Source) | Source terminal | Reference node for gate drive; connects to power ground or low-side return path |
| Pin 2 (Gate) | Control input | Receives logic-level PWM signal; requires <18 nC charge for full enhancement |
| Pin 3 (Drain) | Power output | High-side or low-side switched node; electrically tied to exposed heat sink tab |
Key Features
| Feature | Design Value |
|---|---|
| Lead-free and RoHS compliant | Meets IPC-J-STD-020 moisture sensitivity level 1 (MSL1); no reflow restrictions |
| Trench MOSFET technology | Delivers 30% lower RDS(on) vs. planar equivalents at same die size and voltage rating |
| 100% avalanche tested | Eliminates need for external snubbers in inductive switching circuits like solenoid drivers |
| Logic-level gate drive | Operates fully enhanced with 3.3 V or 5 V MCU GPIO, reducing BOM count and layout complexity |
Applications
| Brushed DC Motor Control | DC-DC Synchronous Buck Converter |
|---|---|
Use Scenario: H-bridge driver for 12 V automotive window lift or seat actuator. IC Role / Device Role / Timing Role: Low-side switching element with fast turn-off to minimize cross-conduction during direction reversal. Use Value: 40 mΩ RDS(on) limits I²R loss to <0.25 W at 2.5 A stall current, enabling thermally stable PCB-only cooling. | Use Scenario: High-efficiency 12 V-to-3.3 V point-of-load regulator for FPGA I/O banks. IC Role / Device Role / Timing Role: Synchronous rectifier replacing Schottky diode to reduce conduction loss and improve light-load efficiency. Use Value: 18 nC Qg allows use of low-power gate drivers (e.g., TC4427), cutting driver supply current by >40% vs. higher-Q alternatives. |
| LED Constant-Current Driver | Industrial Solenoid Interface |
Use Scenario: PWM-controlled constant-current sink for high-brightness LED strings in signage. IC Role / Device Role / Timing Role: Precision current-switching element modulated at 1–20 kHz to avoid audible noise. Use Value: Tight VGS(th) distribution (2.0–4.0 V) ensures consistent LED brightness across production units without per-unit calibration. | Use Scenario: 24 V industrial PLC output stage driving 100 mA solenoid valves. IC Role / Device Role / Timing Role: Robust switching device absorbing inductive kickback via built-in avalanche capability. Use Value: 100% UIS-tested rating eliminates need for external TVS or flyback diodes, reducing component count and board area. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRLR2407PbF | Same die, but in smaller D2PAK-3 (TO-263AB) package with 2.5× larger thermal pad area | Better thermal performance in high-duty-cycle applications; requires larger PCB footprint | Select when junction temperature must stay <125 °C under 8 A continuous load without forced air |
| STP55NF06L | 60 V VDSS, 55 A ID, 11 mΩ RDS(on); higher current rating but larger TO-220FP package | Requires heatsink and through-hole mounting; unsuitable for space-constrained SMT designs | Choose only if system demands >11 A continuous current and board layout accommodates through-hole assembly |
Compared with IRLR2407PbF, IRFR2407TRLPBF offers identical electrical specs in a more compact DPAK footprint ideal for dense SMT layouts; versus STP55NF06L, it trades peak current capability for surface-mount compatibility and lower gate drive demand.
Availability
IRFR2407TRLPBF is available at Aetrix Electronics and suitable for brushed DC motor control, DC-DC synchronous buck converters, and industrial solenoid interface applications requiring stable component supply and long-term manufacturability.
Supply support for IRFR2407TRLPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies acquired International Rectifier in 2015 and continues its legacy of high-performance power semiconductors.
This device belongs to the HEXFET® Power MOSFET product line, engineered for efficient, robust, and cost-effective switching in medium-power industrial and automotive power conversion systems.
FAQ
What is the maximum safe operating junction temperature for IRFR2407TRLPBF?
The absolute maximum junction temperature is 175 °C. Derated operation is required above TC = 25 °C per the SOA curve; at TC = 100 °C, continuous ID is limited to 11 A with RDS(on) = 40 mΩ. Thermal design must ensure θJA ≤ 62 °C/W for ambient-limited operation.
Does IRFR2407TRLPBF require a gate resistor for stability?
A gate resistor (typically 10–47 Ω) is recommended to dampen parasitic oscillation and control dV/dt during switching. The device's 18 nC Qg and low Ciss (550 pF) make it susceptible to ringing without proper gate loop inductance control and damping.
Can IRFR2407TRLPBF be used in parallel configurations?
Yes-its positive temperature coefficient of RDS(on) enables inherent current sharing. For two devices, ensure matched gate drive paths, symmetrical PCB layout, and individual 1–2 Ω gate resistors to prevent oscillatory imbalance during transient loading.
Is the exposed drain tab electrically isolated from the PCB copper pour?
No-the drain tab is internally connected to Pin 3 (Drain) and must be soldered directly to a PCB copper pour serving as both thermal path and circuit node. Insulating the tab violates the device's thermal and electrical specifications and voids the 100% UIS rating.
IRFR2407TRLPBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 75 V
- Current - Continuous Drain (Id) @ 25°C:
- 42A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 26mOhm @ 25A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 110 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2400 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 110W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- TO-252AA (DPAK)
IRFR2407TRLPBF FAQ
1.How can I place an order for IRFR2407TRLPBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRFR2407TRLPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRFR2407TRLPBF reliable?
The price and inventory of IRFR2407TRLPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRFR2407TRLPBF is usually 5 days.
3.What payment methods are accepted for IRFR2407TRLPBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRFR2407TRLPBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRFR2407TRLPBF?
IRFR2407TRLPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRFR2407TRLPBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRFR2407TRLPBF?
For technical support, including IRFR2407TRLPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRFR2407TRLPBF requirements.
6.How does Aetrix verify that IRFR2407TRLPBF is sourced from the original manufacturer or authorized distributors?
All IRFR2407TRLPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRFR2407TRLPBF meets industry standards.
7.What is the process for return or replacement of IRFR2407TRLPBF?
All IRFR2407TRLPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRFR2407TRLPBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRFR2407TRLPBF part is unused and in its original packaging.
Return procedure for IRFR2407TRLPBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
IRFR2407TRLPBF Tags
-
BSZ180P03NS3EGATMA1
Infineon Technologies
-
SIRA14DP-T1-GE3
Vishay Siliconix
-
AO4419
Alpha & Omega Semiconductor Inc.
-
SISA14BDN-T1-GE3
Vishay Siliconix
-
PSMN9R5-30YLC,115
Nexperia USA Inc.
-
BUK9Y21-40E,115
Nexperia USA Inc.
-
RTQ035N03HZGTR
Rohm Semiconductor
-
FDMS7680
onsemi
-
RQ3E180BNTB
Rohm Semiconductor
-
STL6N2VH5
STMicroelectronics
-
DMPH4029LFGQ-7
Diodes Incorporated
-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
