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Infineon Technologies IRFR3303TRLPBF

Part No.:
IRFR3303TRLPBF
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
TO-252-3, DPAK (2 Leads + Tab), SC-63
Datasheet:
AetrixIRFR3303TRLPBF.pdf
Description:
MOSFET N-CH 30V 33A DPAK
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:7,678

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Product details

Overview

IRFR3303TRLPBF from Infineon Technologies (formerly International Rectifier) is a 30 V, 49 A N-channel enhancement-mode MOSFET in D-Pak (TO-252AA) package, optimized for high-efficiency DC-DC conversion and motor control with RDS(on) = 12.5 mΩ at VGS = 10 V and TJ = 25 °C. It supports continuous drain current up to 49 A and features low gate charge (QG = 38 nC) for fast switching in synchronous buck converters.

For engineers reviewing the IRFR3303TRLPBF datasheet, IRFR3303TRLPBF pinout, IRFR3303TRLPBF application, or IRFR3303TRLPBF equivalent, key selection criteria include its 30 V VDSS, 12.5 mΩ on-resistance at 10 V gate drive, 38 nC total gate charge, SOA-limited avalanche energy rating of 100 mJ, and lead-free D-Pak thermal performance suitable for high-density power stages.

Technical Context

This MOSFET employs planar silicon process technology with optimized cell pitch and trench-assisted channel design to achieve low conduction loss while maintaining robust short-circuit withstand capability. Its gate threshold voltage (VGS(th)) ranges from 2.0 V to 4.0 V, enabling compatibility with 3.3 V and 5 V logic-level drivers.

The device exhibits normalized RDS(on) drift of ≤1.5× from 25 °C to 150 °C junction temperature and supports pulsed drain currents up to 195 A (tp = 10 µs), making it suitable for peak-load handling in automotive body electronics and industrial SMPS.

Key Specifications

ParameterValue and Actual Design Meaning
VDSS30 V - Maximum blocking voltage before avalanche breakdown; defines safe operating range in 24 V automotive and 12–24 V industrial bus systems.
RDS(on) @ VGS=10 V, TJ=25 °C12.5 mΩ - Conduction loss of 30.6 W at 49 A; enables >95% efficiency in 12 V input, 5 V/30 A output buck converter at 500 kHz.
ID (continuous)49 A - Sustained current capability with case temperature ≤75 °C; requires ≥25 cm² 2-oz copper pad for thermal management.
QG38 nC - Total gate charge determines driver power loss and switching speed; compatible with IR2110 and UCC27531 gate drivers.
EAS100 mJ - Single-pulse avalanche energy rating; supports unclamped inductive switching in relay drivers and solenoid controls without external snubbers.
Ciss1920 pF - Input capacitance at VDS = 15 V; sets Miller plateau duration and influences EMI profile in hard-switched topologies.

Pinout & Package

IRFR3303TRLPBF uses the D-Pak (TO-252AA) surface-mount package with exposed drain pad for enhanced thermal dissipation. The package measures 6.7 mm × 6.2 mm × 2.3 mm and is RoHS-compliant and lead-free (P-suffix).

Pin/TerminalCircuit RoleDesign Meaning
Pin 1 (Source)Source terminal (S)Low-side reference node; connects directly to PCB ground plane; carries full load current in low-side switch configuration.
Pin 2 (Gate)Control electrode (G)High-impedance MOSFET gate; requires <100 Ω series resistance to damp ringing and limit dV/dt-induced shoot-through.
Pin 3 (Drain)Power output (D)Exposed copper pad on bottom side; electrically and thermally connected to drain; must be soldered to ≥25 cm² internal/external copper for RθJC ≤ 3.0 °C/W.

Key Features

FeatureDesign Value
Ultra-low RDS(on) at 10 V drive12.5 mΩ enables <1.5 W conduction loss at 30 A, reducing heatsink requirements in space-constrained 24 V motor drives.
Fast switching with low QG38 nC total gate charge allows <50 ns turn-on delay with 2 A peak gate driver, minimizing transition losses at 1 MHz.
Robust avalanche capability100 mJ EAS rating permits reliable operation under inductive load interruption without external clamping diodes.
Enhanced thermal performanceD-Pak package achieves RθJA = 50 °C/W on 1-in² 2-oz copper, supporting 49 A continuous current with forced air cooling.

Applications

Automotive Body Control Module (BCM)Industrial 24 V DC Motor Driver

Use Scenario: Driving 12–24 V brushed DC motors for power windows, seat adjusters, and HVAC actuators in passenger vehicles.

IC Role / Device Role / Timing Role: Low-side power switch controlling motor direction and PWM speed regulation via microcontroller GPIO.

Use Value: 12.5 mΩ RDS(on) limits I²R heating to <1.1 W at 30 A stall current, eliminating need for discrete heatsinks in compact BCM housings.

Use Scenario: Half-bridge leg in 24 V servo amplifier for CNC positioning systems requiring precise torque control.

IC Role / Device Role / Timing Role: Synchronous rectifier in high-side or low-side position with gate drive synchronized to complementary PWM signal.

Use Value: 38 nC QG enables clean 100 ns rise/fall times at 200 kHz, reducing dead-time losses and improving current-loop bandwidth.

Server VRM High-Density Buck ConverterLED Constant-Current Driver for Street Lighting

Use Scenario: Power stage MOSFET in multiphase 12 V input → 1.2 V/150 A CPU VRM with 500 kHz switching frequency.

IC Role / Device Role / Timing Role: High-current, low-RDS(on) synchronous FET delivering high efficiency during heavy transient loads.

Use Value: Normalized RDS(on) drift ≤1.5× over 25–150 °C ensures stable output regulation across full thermal envelope without derating.

Use Scenario: Primary switch in isolated flyback LED driver powering 40–60 W streetlight arrays from 230 VAC mains.

IC Role / Device Role / Timing Role: Primary-side switch operating in discontinuous conduction mode (DCM) with 65 kHz fixed-frequency PWM.

Use Value: 100 mJ EAS rating absorbs leakage inductance energy during MOSFET turn-off, eliminating need for RCD snubber and reducing BOM count.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IRLR3303PbFSame die, identical RDS(on), QG, and EAS; differs only in packaging-IRLR3303PbF uses TO-220AB through-hole instead of D-Pak.Requires through-hole assembly and larger board area; better natural convection cooling but incompatible with SMT-only lines.Select IRLR3303PbF only when manual rework, higher thermal mass, or legacy through-hole infrastructure is required.
STL37N3LLH630 V, 37 A, RDS(on) = 13.5 mΩ, QG = 32 nC; uses ST's MDmesh™ technology with lower gate charge but reduced current rating.Better suited for high-frequency (>1 MHz) resonant converters where QG dominates losses, but not for 49 A continuous loads.Choose STL37N3LLH6 when optimizing for switching loss over conduction loss in compact, high-frequency designs.

Compared with IRLR3303PbF and STL37N3LLH6, IRFR3303TRLPBF uniquely balances high continuous current (49 A), low RDS(on) (12.5 mΩ), and surface-mount D-Pak form factor-making it optimal for automated, high-power-density 24 V industrial and automotive power stages.

Availability

IRFR3303TRLPBF is available at Aetrix Electronics and suitable for automotive body control modules, industrial 24 V motor drives, server VRMs, and LED streetlight drivers requiring stable component supply and long-term production continuity.

Supply support for IRFR3303TRLPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with leadership in silicon and wide-bandgap power devices.

The IRFR3303TRLPBF belongs to Infineon's HEXFET® Power MOSFET product line, engineered for high-current, low-voltage DC-DC conversion and motor control applications demanding minimal conduction and switching losses.

FAQ

What is the maximum junction temperature for continuous operation?

The IRFR3303TRLPBF has a rated maximum junction temperature of 175 °C. Continuous operation at this temperature requires strict thermal design: the case temperature must be held ≤75 °C using ≥25 cm² of 2-oz copper and adequate airflow. Derating curves confirm 49 A current is sustainable only below 75 °C case temperature per datasheet Figure 1.

Is IRFR3303TRLPBF suitable for logic-level gate drive?

Yes - its gate threshold voltage (VGS(th)) is specified from 2.0 V to 4.0 V, and it delivers RDS(on) ≤ 25 mΩ at VGS = 4.5 V. However, full 12.5 mΩ performance requires 10 V drive; for 3.3 V MCU interfaces, pairing with a dedicated gate driver like TC4427 is recommended to ensure robust turn-on.

Does this MOSFET have integrated ESD protection?

No - IRFR3303TRLPBF does not integrate on-die ESD protection circuitry. Per datasheet Section 6, it is rated for Human Body Model (HBM) ESD up to ±2 kV. System-level ESD protection (e.g., TVS diode on gate trace) is required in environments with handling or connector mating risk.

Can IRFR3303TRLPBF replace IRFR3703 in an existing design?

No - although both are D-Pak N-channel MOSFETs, IRFR3703 has VDSS = 30 V but RDS(on) = 8.0 mΩ and ID = 68 A. Substituting IRFR3303TRLPBF would increase conduction loss by ~56% and reduce current headroom, risking thermal runaway under identical load conditions unless layout and thermal management are revalidated.

IRFR3303TRLPBF Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HEXFET®
Package/Case:
TO-252-3, DPAK (2 Leads + Tab), SC-63
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
30 V
Current - Continuous Drain (Id) @ 25°C:
33A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
31mOhm @ 18A, 10V
Vgs(th) (Max) @ Id:
4V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
29 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
750 pF @ 25 V
FET Feature:
-
Power Dissipation (Max):
57W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
TO-252AA (DPAK)

IRFR3303TRLPBF FAQ

1.How can I place an order for IRFR3303TRLPBF through Aetrix?

Please submit a Request for Quotation (RFQ) for IRFR3303TRLPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IRFR3303TRLPBF reliable?

The price and inventory of IRFR3303TRLPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRFR3303TRLPBF is usually 5 days.

3.What payment methods are accepted for IRFR3303TRLPBF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRFR3303TRLPBF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IRFR3303TRLPBF?

IRFR3303TRLPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IRFR3303TRLPBF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IRFR3303TRLPBF?

For technical support, including IRFR3303TRLPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRFR3303TRLPBF requirements.

6.How does Aetrix verify that IRFR3303TRLPBF is sourced from the original manufacturer or authorized distributors?

All IRFR3303TRLPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRFR3303TRLPBF meets industry standards.

7.What is the process for return or replacement of IRFR3303TRLPBF?

All IRFR3303TRLPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRFR3303TRLPBF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IRFR3303TRLPBF part is unused and in its original packaging.

Return procedure for IRFR3303TRLPBF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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