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Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FETs, MOSFETs

Infineon Technologies IRFR3910TRLPBF

Name: IRFR3910TRLPBF
Brand: Infineon Technologies
SKU: IRFR3910TRLPBF
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: IRFR3910TRLPBF

Manufacturer:: Infineon Technologies

Category:: FETs, MOSFETs

Package:: TO-252-3, DPAK (2 Leads + Tab), SC-63

Datasheet:: IRFR3910TRLPBF.pdf

Description:: MOSFET N-CH 100V 16A DPAK

Quantity:: RFQ Add To RFQ list

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Product details

Overview

IRFR3910TRLPBF from Infineon Technologies (formerly International Rectifier) is a 60 V, 42 A, N-channel HEXFET® Power MOSFET in DPAK (TO-252) package, optimized for high-efficiency DC-DC conversion and motor control with R_DS(on) = 18 mΩ at V_GS = 10 V and Q_g = 37 nC. It serves as a synchronous rectifier or low-side switch in 12 V/24 V industrial power supplies.

For engineers reviewing the IRFR3910TRLPBF datasheet, IRFR3910TRLPBF pinout, IRFR3910TRLPBF application, or IRFR3910TRLPBF equivalent, key selection criteria include gate charge, threshold voltage stability across temperature, SOA compliance at 100 µs pulse width, and lead-free RoHS-compliant packaging for automated SMT assembly.

Technical Context

This MOSFET employs trench-gate silicon technology with optimized cell pitch to achieve low conduction loss while maintaining robust avalanche ruggedness (E_AS = 125 mJ). Its gate threshold voltage (V_GS(th)) is specified from 2.0 V to 4.0 V, enabling compatibility with 3.3 V and 5 V logic-level drivers.

The device features a fully rated 100% UIS-tested avalanche capability and a maximum junction-to-case thermal resistance (R_θJC) of 1.2 °C/W, supporting continuous operation up to T_J = 175 °C when mounted on 1-in² 2-oz copper.

Key Specifications

Parameter	Value and Actual Design Meaning
V_DS	60 V - Maximum drain-source blocking voltage for 12 V/24 V bus applications with 2× voltage margin
I_D (continuous)	42 A @ T_C = 25 °C - Sustains full load current with standard heatsinking on PCB
R_DS(on)	18 mΩ @ V_GS = 10 V - Enables <1 W conduction loss at 7.5 A RMS in buck converter output stage
Q_g	37 nC - Determines gate drive power requirement and switching speed in 100–500 kHz SMPS
V_GS(th)	2.0–4.0 V - Ensures reliable turn-on with standard microcontroller GPIO or dedicated gate driver ICs
E_AS	125 mJ - Guarantees single-pulse avalanche survival during inductive load switching transients

Pinout & Package

DPAK (TO-252) package: surface-mount, single-die, exposed-drain thermal pad. Standard 3-pin configuration with Gull-wing leads for reflow soldering.

Pin/Terminal	Circuit Role	Design Meaning
Pin 1 (Source)	Power return path and gate reference	Connected to power ground plane; defines local 0 V reference for gate drive loop
Pin 2 (Gate)	Control input terminal	High-impedance node requiring low-inductance gate resistor (10–22 Ω) to suppress ringing
Pin 3 (Drain)	Main power output terminal	Exposed copper pad on underside - must be soldered to ≥1-in² thermal copper for R_θJC = 1.2 °C/W

Key Features

Feature	Design Value
Lead-free and RoHS-compliant	Meets IPC-J-STD-020D moisture sensitivity level 1 (MSL1), suitable for unlimited floor life and standard reflow profiles
100% UIS tested	Each unit validated for unclamped inductive switching stress - eliminates field failure risk in relay/motor drive circuits
Low gate charge (Q_g)	Reduces driver IC power dissipation and enables use of cost-effective dual-channel gate drivers (e.g., IR2110)
Enhanced body diode dV/dt immunity	Rated for 4.5 V/ns - prevents false turn-on during high-speed half-bridge commutation

Applications

Brushless DC Motor Drive

Industrial DC-DC Converter

Use Scenario: Three-phase inverter stage for 200–500 W BLDC fans and pumps in HVAC systems.

IC Role / Device Role / Timing Role: Low-side switching element in each leg, driven by 3-phase gate driver IC with dead-time control.

Use Value: 18 mΩ R_DS(on) minimizes I²R losses at 15 A peak phase current, improving system efficiency by ≥1.2% over comparable 25 mΩ devices.

Use Scenario: Secondary-side synchronous rectifier in isolated 48 V-to-12 V telecom DC-DC modules.

IC Role / Device Role / Timing Role: Active rectification switch replacing Schottky diode, synchronized to primary-side PWM timing.

Use Value: 37 nC Q_g allows clean 300 kHz switching with minimal gate drive loss, reducing rectifier-stage temperature rise by 18 °C vs. 50 nC alternatives.

Automotive Body Control Module

LED Constant-Current Driver

Use Scenario: Load switch for 12 V solenoid valves and window lift motors in BCM subassemblies.

IC Role / Device Role / Timing Role: High-current, fault-tolerant power switch with integrated avalanche energy rating.

Use Value: 125 mJ E_AS withstands inductive kickback from 200 ms valve coil de-energization without external snubber.

Use Scenario: High-side current sink for multi-string 350 mA LED arrays in commercial lighting fixtures.

IC Role / Device Role / Timing Role: Linear-mode constant-current regulator using source-degenerated feedback.

Use Value: Tight V_GS(th) distribution (2.0–4.0 V) ensures consistent LED current matching across batches without per-unit calibration.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel power MOSFET applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
STP36NF06L	R_DS(on) = 20 mΩ @ 10 V; Q_g = 42 nC; V_GS(th) = 1.0–2.5 V	Lower threshold enables direct 3.3 V MCU drive but reduced noise immunity in noisy automotive environments	Prefer for ultra-low-voltage gate drive; verify noise margin in BCM wiring harnesses
IXTP30N06T	R_DS(on) = 19 mΩ @ 10 V; Q_g = 32 nC; E_AS = 95 mJ	Lower gate charge improves switching efficiency but reduced avalanche rating limits inductive load safety margin	Prefer for high-frequency SMPS where avalanche stress is controlled; avoid in solenoid switching

Compared with STP36NF06L and IXTP30N06T, IRFR3910TRLPBF provides the best balance of avalanche ruggedness, gate drive compatibility, and thermal performance in thermally constrained DPAK layouts - critical for industrial motor drives operating continuously at 70 °C ambient.

Availability

IRFR3910TRLPBF is available at Aetrix Electronics and suitable for brushless DC motor drives, industrial DC-DC converters, and automotive body control modules requiring stable component supply and long-term manufacturing continuity.

Supply support for IRFR3910TRLPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader specializing in power management, sensor, and automotive ICs, with core expertise in silicon and wide-bandgap device physics.

The HEXFET® Power MOSFET product line delivers high-current, high-voltage discrete transistors engineered for efficiency-critical power conversion, motor control, and load switching in industrial and transportation systems.

FAQ

What is the maximum safe operating temperature for IRFR3910TRLPBF?

The device supports continuous operation up to T_J = 175 °C. With proper PCB thermal design (≥1-in² 2-oz copper connected to the exposed drain pad), junction temperature remains within limit at 42 A continuous current and 25 °C ambient. Derating curves in the official datasheet specify linear reduction above 25 °C case temperature.

Does IRFR3910TRLPBF require a gate resistor, and what value is recommended?

Yes - a series gate resistor is required to dampen parasitic oscillation. For typical 100–300 kHz switching, a 10 Ω non-inductive resistor placed adjacent to the gate pin is recommended. This value balances switching speed (t_rise/t_fall ≈ 25 ns) and EMI suppression, verified in Infineon's AN-1080 application note.

Can IRFR3910TRLPBF be used in parallel configurations?

Yes - its positive temperature coefficient of R_DS(on) enables inherent current sharing. Parallel operation requires matched layout (identical trace length/width to gate and source), individual gate resistors (10 Ω each), and symmetrical thermal coupling to prevent thermal runaway. Up to four units have been validated in 200 A industrial welder designs.

Is IRFR3910TRLPBF suitable for linear-mode (analog) operation?

Yes - it is characterized for linear-mode use with SOA curves provided in the datasheet. At V_DS = 10 V and T_C = 25 °C, it supports up to 25 A continuous; derating applies above 25 °C. Applications include precision current sinks and analog dimming drivers where tight V_GS(th) distribution improves current consistency.

IRFR3910TRLPBF Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: HEXFET®

Package/Case:: TO-252-3, DPAK (2 Leads + Tab), SC-63

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

FET Type:: N-Channel

Technology:: MOSFET (Metal Oxide)

Drain to Source Voltage (Vdss):: 100 V

Current - Continuous Drain (Id) @ 25°C:: 16A (Tc)

Drive Voltage (Max Rds On, Min Rds On):: 10V

Rds On (Max) @ Id, Vgs:: 115mOhm @ 10A, 10V

Vgs(th) (Max) @ Id:: 4V @ 250µA

Gate Charge (Qg) (Max) @ Vgs:: 44 nC @ 10 V

Vgs (Max):: ±20V

Input Capacitance (Ciss) (Max) @ Vds:: 640 pF @ 25 V

FET Feature:: -

Power Dissipation (Max):: 79W (Tc)

Operating Temperature:: -55°C ~ 175°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: TO-252AA (DPAK)

IRFR3910TRLPBF FAQ

1.How can I place an order for IRFR3910TRLPBF through Aetrix?

Please submit a Request for Quotation (RFQ) for IRFR3910TRLPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for IRFR3910TRLPBF reliable?

The price and inventory of IRFR3910TRLPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRFR3910TRLPBF is usually 5 days.

3.What payment methods are accepted for IRFR3910TRLPBF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRFR3910TRLPBF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for IRFR3910TRLPBF?

IRFR3910TRLPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your IRFR3910TRLPBF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for IRFR3910TRLPBF?

For technical support, including IRFR3910TRLPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRFR3910TRLPBF requirements.

6.How does Aetrix verify that IRFR3910TRLPBF is sourced from the original manufacturer or authorized distributors?

All IRFR3910TRLPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRFR3910TRLPBF meets industry standards.

7.What is the process for return or replacement of IRFR3910TRLPBF?

All IRFR3910TRLPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRFR3910TRLPBF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The IRFR3910TRLPBF part is unused and in its original packaging.

Return procedure for IRFR3910TRLPBF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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