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Infineon Technologies IRFR3910TRR
- Part No.:
- IRFR3910TRR
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Datasheet:
-
IRFR3910TRR.pdf
- Description:
- MOSFET N-CH 100V 16A DPAK
- Quantity:
- Payment:
- Shipping:
Inventory:7,772
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Product details
Overview
IRFR3910TRR from Infineon Technologies (formerly International Rectifier) is a 100V, 16A N-channel enhancement-mode power MOSFET in D-Pak (TO-252AA) surface-mount package, featuring 0.115Ω RDS(on) at VGS = 10V, fully avalanche-rated, and optimized for high-efficiency DC-DC converters and motor control switches.
For engineers reviewing the IRFR3910TRR datasheet, IRFR3910TRR pinout, IRFR3910TRR application, or IRFR3910TRR equivalent, key selection criteria include its 1.9°C/W junction-to-case thermal resistance, 44nC total gate charge, 130–190ns reverse recovery time, and suitability for unclamped inductive switching with 150mJ single-pulse avalanche energy rating.
Technical Context
This HEXFET® device uses fifth-generation silicon process technology to minimize conduction loss while maintaining fast switching (tr = 27ns, tf = 25ns) and robust ruggedness. Its internal source/drain inductances (LS = 7.5nH, LD = 4.5nH) are characterized for accurate high-speed layout modeling.
The body diode exhibits VSD = 1.3V at IS = 9.0A and TJ = 25°C, with Qrr = 650–970nC and trr = 130–190ns under di/dt = 100A/µs - critical for synchronous rectification and flyback snubberless designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 100V - supports 48V bus systems with ≥2× safety margin against transients |
| RDS(on) | 0.115Ω @ VGS = 10V - enables ≤1.8W conduction loss at 12A continuous drain current |
| ID (TC = 25°C) | 16A - rated for PCB-mount thermal performance without heatsink in low-duty applications |
| EAS | 150mJ - withstands unclamped inductive energy in relay/motor drive fault conditions |
| Qg | 44nC - determines gate driver current requirement (~2.2A peak for 20ns rise time) |
| Ciss | 640pF - impacts high-frequency switching losses and EMI filter design |
| trr | 130–190ns - defines minimum dead-time setting in half-bridge topologies |
Pinout & Package
IRFR3910TRR is housed in a TO-252AA (D-Pak) surface-mount package with exposed drain pad for thermal conduction. The package features gull-wing leads compatible with vapor-phase and infrared reflow soldering per AN-994 footprint guidelines.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Gate) | Control terminal | High-impedance input requiring <44nC charge to switch; sensitive to ESD (±20V absolute max) |
| 2 (Drain) | Power output node | Internally connected to exposed copper pad - must be thermally anchored to PCB copper pour |
| 3 (Source) | Reference node / return path | Common connection point for gate drive reference and load return; carries full load current |
| 4 (Drain) | Secondary drain connection | Redundant drain terminal for lower inductance and improved thermal spreading across PCB |
Key Features
| Feature | Design Value |
|---|---|
| Fully avalanche-rated | 150mJ single-pulse and 7.9mJ repetitive avalanche energy - eliminates need for external clamping in inductive loads |
| Ultra-low RDS(on) | 0.115Ω at 10V drive - reduces conduction loss by >30% vs. prior-gen D-Pak MOSFETs at same voltage class |
| Fast switching | tr/tf = 27ns/25ns - enables >500kHz operation in hard-switched SMPS with controlled dv/dt |
| Optimized body diode | Qrr = 650–970nC - minimizes reverse recovery loss in synchronous buck and LLC resonant converters |
| Thermally enhanced D-Pak | RθJC = 1.9°C/W - allows 79W power dissipation with modest heatsinking on 1"² FR-4 PCB |
Applications
| Brushless DC Motor Driver | Industrial DC-DC Converter |
|---|---|
Use Scenario: Half-bridge phase-leg switch in 24–48V BLDC drives for HVAC blowers and power tools. IC Role / Device Role / Timing Role: High-side and low-side N-channel switching element; handles 12A RMS phase current with PWM up to 20kHz. Use Value: Low RDS(on) and fast turn-off reduce conduction + switching losses, enabling >96% efficiency at full load. | Use Scenario: Primary-side switch in isolated 48V-to-12V flyback converter for industrial PLC I/O modules. IC Role / Device Role / Timing Role: Main power switch operating at 100kHz with 50% duty cycle; subjected to 100V reflected transients. Use Value: 150mJ avalanche rating absorbs leakage inductance spikes without snubber, simplifying magnetics design. |
| Automotive LED Headlamp Driver | UPS Inverter Output Stage |
Use Scenario: High-current PWM dimming switch controlling 10A LED strings in adaptive driving beam systems. IC Role / Device Role / Timing Role: Low-side constant-current switch modulated at 1–2kHz; operates at TC up to 105°C. Use Value: Ruggedized construction and -55°C to +175°C TJ range ensure reliability under automotive under-hood thermal cycling. | Use Scenario: H-bridge output stage in 1kVA online UPS delivering pure sine-wave AC output. IC Role / Device Role / Timing Role: Bidirectional switching element in full-bridge topology; conducts 16A peak during overload events. Use Value: 60A pulsed drain current rating and 1.9°C/W RθJC support short-term surge handling without thermal shutdown. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP16NF10 | RDS(on) = 0.12Ω, Qg = 42nC, TO-220 package | Through-hole mounting only; higher RθJA (62°C/W) limits power density | Select when board space allows through-hole assembly and thermal management uses heatsink rather than PCB copper |
| IXTP16N10P | RDS(on) = 0.10Ω, Qg = 48nC, TO-220FP package | Shorter lead form factor but no exposed drain pad; RθJC = 2.5°C/W | Prefer when vertical mounting or isolation requirements preclude D-Pak's bottom-side thermal interface |
Compared with STP16NF10 and IXTP16N10P, IRFR3910TRR delivers superior thermal performance via its D-Pak drain pad and lower RθJC, making it optimal for compact, high-power-density surface-mount designs where PCB copper serves as primary heatsink.
Availability
IRFR3910TRR is available at Aetrix Electronics and suitable for industrial motor drives, telecom DC-DC converters, and automotive lighting systems requiring stable component supply and long-term manufacturing continuity.
Supply support for IRFR3910TRR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader specializing in power management, automotive, and industrial control solutions, with heritage from International Rectifier's HEXFET® innovation.
The IRFR/U3910 series belongs to Infineon's legacy HEXFET® Power MOSFET product line, engineered for high-efficiency switching in medium-voltage, medium-current applications where thermal performance and avalanche ruggedness are critical.
FAQ
What is the maximum continuous drain current at 100°C case temperature?
The IRFR3910TRR supports 12A continuous drain current at TC = 100°C, derated linearly from 16A at 25°C using the 0.53W/°C thermal derating factor. This reflects real-world thermal limits when mounted on standard 1"² FR-4 PCB without forced air or heatsink.
Does IRFR3910TRR require a gate resistor for safe operation?
Yes - a gate resistor (typically 10–22Ω) is required to control dv/dt and prevent parasitic oscillation during switching. The 44nC total gate charge and low gate threshold (2.0–4.0V) make it susceptible to shoot-through if driven directly by low-impedance logic sources without current limiting.
Can IRFR3910TRR replace IRFU3910 in existing designs?
Yes, with mechanical adaptation: both share identical die and electrical specs, but IRFR3910TRR uses surface-mount D-Pak (TO-252AA) while IRFU3910 uses through-hole I-Pak (TO-251AA). PCB layout and thermal design must be updated to accommodate gull-wing leads and bottom-side thermal pad anchoring.
Is the body diode suitable for synchronous rectification?
No - the body diode has relatively high Qrr (650–970nC) and slow trr (130–190ns), making it unsuitable for high-frequency synchronous rectification. External Schottky or GaN FETs are recommended for >100kHz secondary-side switching where reverse recovery loss must be minimized.
IRFR3910TRR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 100 V
- Current - Continuous Drain (Id) @ 25°C:
- 16A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 115mOhm @ 10A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 44 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 640 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 79W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- TO-252AA (DPAK)
IRFR3910TRR FAQ
1.How can I place an order for IRFR3910TRR through Aetrix?
Please submit a Request for Quotation (RFQ) for IRFR3910TRR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRFR3910TRR reliable?
The price and inventory of IRFR3910TRR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRFR3910TRR is usually 5 days.
3.What payment methods are accepted for IRFR3910TRR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRFR3910TRR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRFR3910TRR?
IRFR3910TRR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRFR3910TRR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRFR3910TRR?
For technical support, including IRFR3910TRR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRFR3910TRR requirements.
6.How does Aetrix verify that IRFR3910TRR is sourced from the original manufacturer or authorized distributors?
All IRFR3910TRR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRFR3910TRR meets industry standards.
7.What is the process for return or replacement of IRFR3910TRR?
All IRFR3910TRR units undergo pre-shipment inspection (PSI). If there is an issue with IRFR3910TRR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRFR3910TRR part is unused and in its original packaging.
Return procedure for IRFR3910TRR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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