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Infineon Technologies IRFR5305CPBF
- Part No.:
- IRFR5305CPBF
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Datasheet:
-
IRFR5305CPBF.pdf
- Description:
- MOSFET P-CH 55V 31A DPAK
- Quantity:
- Payment:
- Shipping:
Inventory:2,761
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Product details
Overview
IRFR5305CPBF from Infineon Technologies (formerly International Rectifier) is a P-channel enhancement-mode HEXFET® Power MOSFET in D-Pak (TO-252AA) package, rated for -55 V VDS, 0.065 Ω RDS(on) at -10 V VGS, and -31 A continuous drain current at TC = 25°C. It serves as a high-efficiency, surface-mount power switch in DC-DC converters, motor drivers, and load management circuits.
For engineers reviewing the IRFR5305CPBF datasheet, IRFR5305CPBF pinout, IRFR5305CPBF application, or IRFR5305CPBF equivalent, key selection criteria include its fully avalanche-rated capability (280 mJ EAS), fast switching performance (tr = 66 ns, tf = 63 ns), low gate charge (Qg = 63 nC), and rugged thermal design with 1.4 °C/W junction-to-case resistance.
Technical Context
This P-channel MOSFET operates with negative gate drive relative to source, enabling high-side switching without level-shifting circuitry in buck regulators and OR-ing applications. Its body diode exhibits VSD = -1.3 V at -16 A and reverse recovery time trr = 71–110 ns under specified conditions.
The device uses fifth-generation HEXFET processing for ultra-low on-resistance per die area and integrates a fully rated intrinsic body diode suitable for synchronous rectification and unclamped inductive switching. Thermal design leverages direct die-to-case conduction via the exposed drain pad, supporting up to 110 W power dissipation at TC = 25°C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | -55 V - Maximum blocking voltage in high-side switch configurations |
| RDS(on) | 0.065 Ω @ VGS = -10 V - Enables <1.5 W conduction loss at -16 A in PCB-mounted designs |
| ID (cont) | -31 A @ TC = 25°C - Supports high-current load switching with minimal heatsinking |
| EAS | 280 mJ - Withstands single-pulse inductive energy without failure in motor drive flyback |
| Qg | 63 nC - Determines gate driver current requirement for <100 ns switching transitions |
| tr/tf | 66/63 ns - Enables >1 MHz switching in resonant and hard-switched topologies |
| RθJC | 1.4 °C/W - Allows precise junction temperature estimation using case temperature measurement |
Pinout & Package
D-Pak (TO-252AA) surface-mount package with exposed drain pad for thermal and electrical connection; 3-pin configuration (Gate, Drain, Source) plus integrated drain tab (pin 4 = Drain).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Gate) | Control terminal | Receives negative VGS to turn on; requires ≥2.0 V threshold margin for reliable operation |
| 2 (Drain) | Main current output | Connected to exposed metal tab; must be soldered to large copper pour for thermal management |
| 3 (Source) | Reference node | Serves as return path and gate drive reference; defines system ground in high-side configurations |
| 4 (Drain Tab) | Thermal & power path | Electrically identical to pin 2; provides primary heat transfer path to PCB |
Key Features
| Feature | Design Value |
|---|---|
| Fully avalanche rated | 280 mJ single-pulse energy tolerance enables robust operation in inductive load switching without external snubbers |
| Ultra-low RDS(on) | 0.065 Ω reduces conduction losses by >40% vs. prior-gen P-channel MOSFETs at same voltage rating |
| Fast switching speed | 14 ns turn-on delay + 66 ns rise time supports high-frequency DC-DC conversion with minimized dead-time losses |
| Surface-mount optimized | D-Pak footprint allows automated assembly and achieves 110 W power dissipation with standard FR-4 PCB layout |
| Body diode with low VSD | -1.3 V forward drop at -16 A enables efficient freewheeling in synchronous buck and H-bridge topologies |
Applications
| DC-DC Buck Converter | Industrial Motor Driver |
|---|---|
Use Scenario: High-side synchronous rectification in 12 V input, 5 V/10 A output buck converter. IC Role / Device Role / Timing Role: P-channel high-side switch replacing N-channel + driver; eliminates bootstrap complexity. Use Value: Reduces BOM count by eliminating gate driver IC and bootstrap capacitor while maintaining <90% efficiency at full load. | Use Scenario: Bidirectional 24 V brushed DC motor control in factory automation actuator. IC Role / Device Role / Timing Role: Low-side switch in H-bridge leg with fast turn-off to prevent shoot-through during direction reversal. Use Value: 63 ns fall time ensures <200 ns minimum off-time, meeting IEC 61800-5-1 safe torque off timing requirements. |
| Hot-Swap OR-ing Circuit | Automotive Load Switch |
Use Scenario: Redundant 48 V power supply OR-ing in telecom shelf with inrush current limiting. IC Role / Device Role / Timing Role: Reverse-polarity protected high-side switch controlling power path to backplane. Use Value: -55 V VDS rating accommodates 48 V nominal + 20% transients; RDS(on) ensures <0.5 W loss at 15 A. | Use Scenario: Engine control unit (ECU) battery disconnect switch for 12 V accessory loads. IC Role / Device Role / Timing Role: Protected load switch with integrated overtemperature and short-circuit response. Use Value: Junction temperature range (-55°C to +175°C) meets AEC-Q101 ambient requirements; avalanche rating handles load dump transients. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar P-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRLR7843PbF | -40 V VDS, 0.0065 Ω RDS(on), 75 A ID - lower voltage, higher current, smaller die | Better suited for 12 V systems requiring <10 mΩ on-resistance; not rated for 48 V bus applications | Select when operating voltage ≤36 V and board space is constrained; verify avalanche capability is not required |
| STP12PF06 | -60 V VDS, 0.12 Ω RDS(on), 12 A ID - higher voltage, higher RDS(on), TO-220 package | Through-hole mounting only; higher conduction loss limits use to <5 A continuous loads | Choose for legacy through-hole designs or where thermal mass of TO-220 improves transient thermal response |
Compared with IRFR5305CPBF, IRLL7843PbF offers superior conduction efficiency below 36 V but lacks its 48 V+ system compatibility and surface-mount flexibility, while STP12PF06 trades packaging convenience and RDS(on) for broader voltage margin and simpler thermal interface.
Availability
IRFR5305CPBF is available at Aetrix Electronics and suitable for industrial motor drivers, automotive load switches, DC-DC buck converters, and hot-swap OR-ing circuits requiring stable component supply and long-term production continuity.
Supply support for IRFR5305CPBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader specializing in power management, automotive electronics, and industrial control solutions, with core expertise in silicon and wide-bandgap device design.
The HEXFET® Power MOSFET product line delivers high-efficiency, ruggedized switching devices optimized for power conversion, motor control, and load management in harsh thermal and electrical environments.
FAQ
What is the maximum allowable gate-to-source voltage for IRFR5305CPBF?
The absolute maximum VGS rating is ±20 V. Operation beyond ±15 V risks permanent gate oxide damage. For reliable turn-on, apply -10 V to ensure full enhancement across temperature and process variation; logic-level drive (-4.5 V) yields higher RDS(on) and reduced current capability.
Can IRFR5305CPBF be used in parallel for higher current handling?
Yes, but with strict layout and gate drive matching. The device's positive RDS(on) temperature coefficient enables current sharing, yet mismatched gate resistances or PCB trace inductance can cause imbalance. Use individual 10 Ω gate resistors and symmetrical Kelvin-source routing to achieve <15% current deviation at full load.
Does IRFR5305CPBF require a heatsink in typical surface-mount applications?
No external heatsink is required if PCB copper area meets IR's recommended 1"² FR-4 footprint with internal ground plane. At 110 W power dissipation, junction temperature remains within 175°C limit only with full thermal pad soldering and ≥2 oz copper; derate linearly above 25°C ambient using 0.71 W/°C factor.
How does the body diode performance compare to discrete Schottky diodes?
The integrated body diode has VSD = -1.3 V at -16 A and trr = 71–110 ns - higher forward drop and slower recovery than 45 V Schottky diodes (e.g., SS34: 0.5 V, <35 ns). Use only where synchronous rectification is not required or where diode conduction is brief and infrequent.
IRFR5305CPBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Packaging:
- Tube
- Product Status:
- Obsolete
- FET Type:
- P-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 55 V
- Current - Continuous Drain (Id) @ 25°C:
- 31A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 65mOhm @ 16A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 63 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1200 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 110W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- TO-252AA (DPAK)
IRFR5305CPBF FAQ
1.How can I place an order for IRFR5305CPBF through Aetrix?
Please submit a Request for Quotation (RFQ) for IRFR5305CPBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRFR5305CPBF reliable?
The price and inventory of IRFR5305CPBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRFR5305CPBF is usually 5 days.
3.What payment methods are accepted for IRFR5305CPBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRFR5305CPBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRFR5305CPBF?
IRFR5305CPBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRFR5305CPBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRFR5305CPBF?
For technical support, including IRFR5305CPBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRFR5305CPBF requirements.
6.How does Aetrix verify that IRFR5305CPBF is sourced from the original manufacturer or authorized distributors?
All IRFR5305CPBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRFR5305CPBF meets industry standards.
7.What is the process for return or replacement of IRFR5305CPBF?
All IRFR5305CPBF units undergo pre-shipment inspection (PSI). If there is an issue with IRFR5305CPBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRFR5305CPBF part is unused and in its original packaging.
Return procedure for IRFR5305CPBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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