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Infineon Technologies IRFR5305TRR
- Part No.:
- IRFR5305TRR
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Datasheet:
-
IRFR5305TRR.pdf
- Description:
- MOSFET P-CH 55V 31A DPAK
- Quantity:
- Payment:
- Shipping:
Inventory:3,428
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Product details
Overview
IRFR5305TRR from Infineon Technologies (formerly International Rectifier) is a P-channel enhancement-mode HEXFET® Power MOSFET in D-Pak (TO-252AA) package, rated for -55 V VDS, 0.065 Ω RDS(on) at -10 V VGS, and -31 A continuous drain current at TC = 25°C. It serves as a high-efficiency, surface-mount power switch in DC-DC converters, motor drivers, and load management circuits.
For engineers reviewing the IRFR5305TRR datasheet, IRFR5305TRR pinout, IRFR5305TRR application, or IRFR5305TRR equivalent, key selection criteria include its fully avalanche-rated capability (280 mJ EAS), fast switching (tr = 66 ns, tf = 63 ns), low gate charge (Qg = 63 nC), and rugged thermal performance (RθJC = 1.4 °C/W).
Technical Context
This P-channel MOSFET operates with negative gate drive relative to source, enabling high-side switching without level-shifting circuitry in buck regulators and OR-ing applications. Its body diode features low forward voltage (-1.3 V at -16 A) and controlled reverse recovery (trr = 71–110 ns, Qrr = 170–250 nC), supporting synchronous rectification in non-isolated topologies.
The device employs fifth-generation HEXFET processing for ultra-low on-resistance per die area and integrates a fully rated unclamped inductive switching (UIS) capability. Thermal design is supported by a low junction-to-case resistance (1.4 °C/W) and validated operation across -55°C to +175°C junction temperature range.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | -55 V - Maximum blocking voltage in high-side switch configurations |
| RDS(on) | 0.065 Ω @ VGS = -10 V - Enables <1 W conduction loss at -16 A DC load |
| ID (continuous) | -31 A @ TC = 25°C - Supports high-current load switching on thermally optimized PCBs |
| EAS | 280 mJ - Fully rated single-pulse avalanche energy for inductive load turn-off safety |
| Qg | 63 nC - Determines gate driver power requirement and switching speed trade-off |
| tr/tf | 66 ns / 63 ns - Enables >100 kHz switching in hard-switched SMPS designs |
| RθJC | 1.4 °C/W - Allows direct heatsinking via exposed drain pad for thermal management |
Pinout & Package
D-Pak (TO-252AA) surface-mount package with exposed drain pad for thermal and electrical connection; compatible with vapor-phase, infrared, and wave soldering. Leads are gull-wing, coplanar, and RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Gate) | Control terminal | Receives negative gate drive signal; requires -10 V for full enhancement and low RDS(on) |
| 2 (Drain) | Power output node | Connected to exposed copper pad; carries main load current and dissipates heat directly to PCB |
| 3 (Source) | Reference node | Serves as return path for load current and reference for gate drive; tied to system ground in high-side switch |
| 4 (Drain) | Power output node | Second drain connection-electrically identical to Pin 2; enhances current handling and thermal spreading |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low RDS(on) | 0.065 Ω enables <1 W conduction loss at -16 A, reducing thermal footprint in space-constrained layouts |
| Fully avalanche rated | 280 mJ single-pulse energy rating eliminates need for external snubbers in inductive switching |
| Fast body diode | 71–110 ns reverse recovery time supports efficient synchronous rectification in buck converters |
| Thermally enhanced D-Pak | Exposed drain pad and 1.4 °C/W RθJC allow direct PCB heatsinking without mechanical clips or thermal interface material |
Applications
| DC-DC Buck Converter | High-Side Load Switch |
|---|---|
Use Scenario: Step-down voltage regulation in industrial PLC I/O modules with 12 V input and 5 V/3.3 V outputs. IC Role / Device Role: High-side P-channel MOSFET used as synchronous rectifier and main power switch. Use Value: Low RDS(on) and fast switching minimize conduction and switching losses, achieving >92% efficiency at 5 A load. | Use Scenario: Controlled power-up sequencing for FPGA core rails in telecom baseband cards. IC Role / Device Role: High-side load switch enabling soft-start and overcurrent protection via gate control. Use Value: Avalanche rating ensures robustness against inrush current transients; exposed drain pad simplifies thermal layout. |
| Motor Driver H-Bridge | OR-ing Circuit |
Use Scenario: 24 V brushed DC motor control in automated warehouse conveyors. IC Role / Device Role: Upper-leg switch in half-bridge configuration driving motor phase voltage. Use Value: -55 V VDS withstands back-EMF spikes; fast body diode reduces shoot-through risk during PWM dead-time. | Use Scenario: Redundant 48 V power supply selection in network routers with dual PSUs. IC Role / Device Role: P-channel MOSFET acting as ideal diode in active OR-ing configuration. Use Value: Low VSD (-1.3 V at -16 A) cuts forward drop by >60% vs. Schottky diodes, reducing heat generation and improving system efficiency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar P-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRF9530NPBF | TO-220 package, higher RDS(on) (0.3 Ω), lower ID (-12 A), no avalanche rating | Requires heatsink; unsuitable for surface-mount or high-reliability inductive switching | Select only when through-hole mounting and lower cost outweigh thermal and ruggedness requirements |
| DMG2305UVT-7 | Small SOT-23 package, lower voltage (-20 V), higher RDS(on) (0.045 Ω @ -4.5 V), Qg = 10 nC | Limited to low-power logic-level loads; not rated for UIS or high-current DC operation | Prefer for compact, low-voltage, low-current bias or signal switching-not for power conversion |
Compared with IRF9530NPBF and DMG2305UVT-7, IRFR5305TRR uniquely combines surface-mount D-Pak packaging, -55 V rating, full avalanche capability, and 0.065 Ω on-resistance-making it the only option suitable for rugged, medium-power, high-side switching in industrial power supplies and motor controls.
Availability
IRFR5305TRR is available at Aetrix Electronics and suitable for DC-DC converters, high-side load switches, motor drivers, and OR-ing circuits requiring stable component supply and long-term industrial availability.
Supply support for IRFR5305TRR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader specializing in power management, automotive, and industrial control solutions, with deep expertise in silicon-based power devices.
The HEXFET® Power MOSFET product line was engineered for high-efficiency, high-reliability power conversion in industrial, computing, and automotive systems-emphasizing low conduction loss, fast switching, and rugged transient handling.
FAQ
What is the maximum safe operating voltage for IRFR5305TRR in continuous DC blocking?
The absolute maximum drain-to-source voltage (VDS) is -55 V under all operating conditions. This rating applies to steady-state DC blocking and must not be exceeded-even momentarily-during switching transients or inductive kickback events. Derating is required above TJ = 25°C per the breakdown voltage temperature coefficient (-0.034 V/°C).
Can IRFR5305TRR be used without a gate driver in microcontroller-based applications?
Yes, but only with logic-level gate drive capable of delivering -10 V at sufficient current (≥100 mA peak). Standard 3.3 V or 5 V GPIO cannot fully enhance this device; its VGS(th) range (-2.0 V to -4.0 V) means partial turn-on occurs at -5 V, resulting in elevated RDS(on) (>0.15 Ω) and thermal risk. A dedicated P-channel gate driver or level shifter is strongly recommended.
How is thermal performance affected when the drain pad is not soldered to a copper plane?
Without PCB copper thermal relief, RθJA degrades from 50 °C/W (1"² FR-4 board) to ~110 °C/W (socket mount), limiting continuous power dissipation to ~1.5 W at ambient. Full thermal benefit requires minimum 1 in² (6.5 cm²) 2-oz copper pour connected to the exposed drain pad via ≥4 thermal vias-enabling up to 110 W at TC = 25°C.
Does IRFR5305TRR support paralleling for higher current capacity?
Yes-its positive RDS(on) temperature coefficient (-0.034 Ω/°C) enables inherent current sharing when multiple units are paralleled with matched gate drive and symmetric PCB layout. However, gate loop inductance must be minimized (<5 nH per device) to prevent oscillation, and individual gate resistors (6.8 Ω typical) are required to dampen ringing during switching transitions.
IRFR5305TRR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HEXFET®
- Package/Case:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- P-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 55 V
- Current - Continuous Drain (Id) @ 25°C:
- 31A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 65mOhm @ 16A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 63 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1200 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 110W (Tc)
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- TO-252AA (DPAK)
IRFR5305TRR FAQ
1.How can I place an order for IRFR5305TRR through Aetrix?
Please submit a Request for Quotation (RFQ) for IRFR5305TRR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for IRFR5305TRR reliable?
The price and inventory of IRFR5305TRR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for IRFR5305TRR is usually 5 days.
3.What payment methods are accepted for IRFR5305TRR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for IRFR5305TRR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for IRFR5305TRR?
IRFR5305TRR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your IRFR5305TRR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for IRFR5305TRR?
For technical support, including IRFR5305TRR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your IRFR5305TRR requirements.
6.How does Aetrix verify that IRFR5305TRR is sourced from the original manufacturer or authorized distributors?
All IRFR5305TRR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that IRFR5305TRR meets industry standards.
7.What is the process for return or replacement of IRFR5305TRR?
All IRFR5305TRR units undergo pre-shipment inspection (PSI). If there is an issue with IRFR5305TRR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The IRFR5305TRR part is unused and in its original packaging.
Return procedure for IRFR5305TRR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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